Si4554DY Datasheet

Si4554DY
Vishay Siliconix
N- and P-Channel 40 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
40
P-Channel
ID (A)a Qg (Typ.)
RDS(on) (Ω)
- 40
0.024 at VGS = 10 V
8e
0.026 at VGS = 8 V
8e
0.027 at VGS = 4.5 V
8
0.027 at VGS = - 10 V
- 8e
e
0.028 at VGS = - 8 V
-8
0.034 at VGS = - 4.5 V
- 7.5
6.5
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
21.7
• Motor Drive
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
D1
S2
G2
G1
Top View
Ordering Information:
Si4554DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
S1
D2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
VDS
40
- 40
Gate-Source Voltage
VGS
± 20
± 20
8e
- 8e
6.8
- 6.8
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
Source-Drain Current Diode Current
TC = 25 °C
TA = 25 °C
Pulsed Source-Drain Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
L = 0.1 mH
- 6.6b, c
b, c
- 5.3b, c
- 40
5.4
40
IDM
Pulsed Drain Current (10 µs Pulse Width)
2.6
- 2.6
ISM
1.6b, c
40
- 1.6b, c
- 40
IAS
10
- 20
EAS
5
20
IS
TC = 25 °C
3.1
3.2
TC = 70 °C
2
2.1
2b, c
2b, c
TA = 25 °C
PD
TA = 70 °C
1.28b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
V
b, c
6.8
TA = 70 °C
Unit
A
mJ
W
1.28b, c
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
N-Channel
Parameter
Maximum
Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
Symbol
Typ.
Max.
t ≤ 10 s
RthJA
50
Steady State
RthJF
30
P-Channel
Typ.
Max.
62.5
47
62.5
40
29
38
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 120 °C/W (n-channel) and 110 °C/W (p-channel).
e. Package limited.
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.a
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
Drain-Source On-State Resistanceb
Forward Transconductanceb
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V, ID = 250 µA
N-Ch
40
VGS = 0 V, ID = - 250 µA
P-Ch
- 40
ID = 250 µA
N-Ch
V
40
ID = - 250 µA
P-Ch
- 34
ID = 250 µA
N-Ch
- 4.1
5
mV/°C
ID = - 250 µA
P-Ch
VDS = VGS, ID = 250 µA
N-Ch
1
2.2
VDS = VGS, ID = - 250 µA
P-Ch
- 1.2
- 2.5
VDS = 0 V, VGS = ± 20 V
N-Ch
± 100
VDS = 0 V, VGS = ± 20 V
P-Ch
± 100
VDS = 40 V, VGS = 0 V
N-Ch
1
VDS = - 40 V, VGS = 0 V
P-Ch
-1
VDS = 40 V, VGS = 0 V, TJ = 55 °C
N-Ch
10
VDS = - 40 V, VGS = 0 V, TJ = 55 °C
P-Ch
- 10
VDS = 5 V, VGS = 10 V
N-Ch
20
VDS = - 5 V, VGS = - 10 V
P-Ch
- 20
VGS = 10 V, ID = 6.8 A
N-Ch
V
nA
µA
A
0.020
0.024
VGS = - 10 V, ID = - 8 A
P-Ch
0.021
0.027
VGS = 8 V, ID = 6.7 A
N-Ch
0.021
0.026
VGS = - 8 V, ID = - 6.5 A
P-Ch
0.022
0.028
VGS = 4.5 V, ID = 6.6 A
N-Ch
0.022
0.027
VGS = - 4.5 V, ID = - 5 A
P-Ch
0.027
0.034
VDS = 15 V, ID = 6.8 A
N-Ch
27
VDS = - 15 V, ID = - 6.7 A
P-Ch
25
Ω
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Crss
Qg
N-Channel
VDS = 20 V, VGS = 0 V, f = 1 MHz
P-Channel
VDS = - 20 V, VGS = 0 V, f = 1 MHz
690
P-Ch
2000
N-Ch
115
P-Ch
240
pF
N-Ch
41
P-Ch
202
VDS = 20 V, VGS = 10 V, ID = 10 A
N-Ch
13.3
VDS = - 20 V, VGS = - 10 V, ID = - 10 A
P-Ch
41.5
63
N-Ch
6.5
10
33
N-Channel
VDS = 20 V, VGS = 4.5 V, ID = 10 A
P-Ch
21.7
N-Ch
2.3
P-Ch
5.6
N-Ch
1.7
P-Ch
9.8
Qgs
Gate-Drain Charge
Qgd
P-Channel
VDS = - 20 V, VGS = - 4.5 V, ID = - 10 A
Gate Resistance
Rg
f = 1 MHz
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2
N-Ch
20
N-Ch
0.3
1.3
2.6
P-Ch
1.3
6.4
12.8
nC
Ω
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Dynamic
Symbol
Test Conditions
Min.
Typ.a
Max.
Unit
a
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
td(on)
Turn-On Delay Time
tr
Rise Time
Fall Time
P-Channel
VDD = - 20 V, RL = 2 Ω
ID ≅ - 10 A, VGEN = - 10 V, Rg = 1 Ω
N-Channel
VDD = 20 V, RL = 3.7 Ω
ID ≅ 5.4 A, VGEN = 4.5 V, Rg = 1 Ω
tf
P-Channel
VDD = - 20 V, RL = 2 Ω
ID ≅ - 10 A, VGEN = - 4.5 V, Rg = 1 Ω
IS
TC = 25 °C
td(off)
Turn-Off Delay Time
N-Channel
VDD = 20 V, RL = 3.7 Ω
ID ≅ 5.4 A, VGEN = 10 V, Rg = 1 Ω
N-Ch
5
10
P-Ch
10
20
N-Ch
10
20
P-Ch
9
18
N-Ch
16
25
P-Ch
50
90
N-Ch
7
14
P-Ch
13
26
N-Ch
11
22
75
P-Ch
42
N-Ch
12
22
P-Ch
40
70
N-Ch
17
26
P-Ch
40
70
N-Ch
7
14
P-Ch
18
35
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
ISM
VSD
N-Ch
2.6
P-Ch
- 2.6
N-Ch
40
P-Ch
A
- 40
IS = 5.4 A
N-Ch
0.81
1.2
IS = - 2 A
P-Ch
- 0.77
- 1.2
N-Ch
17
34
P-Ch
41
80
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
N-Channel
IF = 5 A, dI/dt = 100 A/µs, TJ = 25 °C
N-Ch
10
20
P-Ch
32
65
Reverse Recovery Fall Time
ta
P-Channel
IF = - 5 A, dI/dt = - 100 A/µs, TJ = 25 °C
N-Ch
10
P-Ch
15
Reverse Recovery Rise Time
tb
N-Ch
7
P-Ch
26
V
ns
nC
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
40
10
VGS = 10 V thru 4 V
8
ID - Drain Current (A)
ID - Drain Current (A)
30
VGS = 3 V
20
6
TC = 25 °C
4
10
2
0
TC = 125 °C
TC = - 55 °C
0
0
0.5
1
1.5
VDS - Drain-to-Source Voltage (V)
2
0
0.6
1.2
1.8
2.4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
3
Transfer Characteristics
1000
0.035
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
800
0.030
VGS = 4.5 V
0.025
VGS = 8 V
Ciss
600
400
VGS = 10 V
0.020
200
Coss
Crss
0
0.015
0
10
20
30
0
40
10
20
30
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
1.8
ID = 6.8 A
8
RDS(on) - On-Resistance (Normalized)
ID = 6.8 A
VGS - Gate-to-Source Voltage (V)
40
VDS = 32 V
6
VDS = 20 V
VDS = 10 V
4
2
0
0
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4
3
6
9
12
15
1.6
VGS = 10 V; 4.5 V
1.4
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
100
0.05
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
ID = 6.8 A
TJ = 150 °C
10
TJ = 25 °C
1
0.1
0.04
TJ = 125 °C
0.03
TJ = 25 °C
0.02
0.01
0.0
0.3
0.6
0.9
1.2
VSD - Source-to-Drain Voltage (V)
0
2
4
6
8
VGS - Gate-to-Source Voltage (V)
10
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
60
1.9
48
Power (W)
VGS(th) (V)
1.6
ID = 250 μA
1.3
36
24
1
12
0.7
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
TJ - Temperature (°C)
Threshold Voltage
0.1
Time (s)
1
10
Single Pulse Power, Junction-to-Ambient
100
Limited by RDS(on)*
ID - Drain Current (A)
10
100 μs
1 ms
1
10 ms
100 ms
0.1
TA = 25 °C
Single Pulse
BVDSS Limited
1s
10 s
DC
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
10
ID - Drain Current (A)
8
6
4
2
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Current Derating*
4
1.25
1.0
Power (W)
Power (W)
3
2
0.75
0.50
1
0.25
0
0.0
0
25
50
75
100
125
TC - Case Temperature (°C)
Power Derating, Junction-to-Foot
150
0
25
50
75
100
125
150
TA - Ambient Temperature (°C)
Power Derating, Junction-to-Ambient
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 120 °C/W
3. T JM - T A = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
100
10
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
Single Pulse
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
40
10
V GS = 10 V thru 4 V
8
ID - Drain Current (A)
ID - Drain Current (A)
32
24
16
V GS = 3 V
6
4
T C = 25 °C
8
2
T C = 125 °C
T C = - 55 °C
V GS = 2 V
0
0.0
0.5
1.0
1.5
2.0
VDS - Drain-to-Source Voltage (V)
0
2.5
0
1
2
3
4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
5
Transfer Characteristics
3100
0.035
VGS = 4.5 V
0.025
VGS = 8 V
VGS = 10 V
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
2480
0.03
Ciss
1860
1240
0.02
620
Coss
Crss
0
0.015
0
10
20
ID - Drain Current (A)
30
40
0
8
16
24
32
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
1.8
10
ID = 8 A
RDS(on) - On-Resistance (Normalized)
ID = 10 A
VGS - Gate-to-Source Voltage (V)
40
8
V DS = 20 V
6
V DS = 10 V
V DS = 30 V
4
2
0
0
9
18
27
Qg - Total Gate Charge (nC)
Gate Charge
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8
36
45
1.6
V GS = 10 V
1.4
V GS = 4.5 V
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
TJ - Junction Temperature (°C)
125
150
On-Resistance vs. Junction Temperature
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.15
100
ID = 8 A
0.12
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
10
T J = 150 °C
1
0.1
T J = 25 °C
0.09
0.06
T J = 125 °C
0.03
0.01
T J = 25 °C
0.001
0.0
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
0
1.2
1
2
3
4
5
6
7
8
9
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.8
50
40
ID = 250 μA
ID = 5 mA
0.2
Power (W)
VGS(th) Variance (V)
0.5
30
20
- 0.1
10
- 0.4
- 50
- 25
0
25
50
75
100
125
150
0
0.001
TJ - Temperature (°C)
0.01
0.1
Time (s)
1
10
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
Limited by RDS(on) *
ID - Drain Current (A)
10
1 ms
1
10 ms
100 ms
0.1
TA = 25 °C
Single Pulse
BVDSS Limited
1s
10 s
DC
0.01
0.01
0.1
1
10
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
100
Safe Operating Area, Junction-to-Ambient
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
10
ID - Drain Current (A)
8
6
4
2
0
0
25
50
75
100
TC - Case Temperature (°C)
125
150
4.0
1.5
3.2
1.2
2.4
0.9
Power (W)
Power (W)
Current Derating*
1.6
0.8
0.6
0.3
0.0
0.0
0
25
50
75
100
TC - Case Temperature (°C)
125
Power Derating, Junction-to-Foot
150
0
25
50
75
100
125
TA - Ambient Temperature (°C)
150
Power Derating, Junction-to-Ambient
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
www.vishay.com
10
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4554DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 110 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
10 -2
4. Surface Mounted
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
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Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63660.
Document Number: 63660
S11-2527-Rev. A, 26-Dec-11
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Package Information
Vishay Siliconix
SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
8
6
7
5
E
1
3
2
H
4
S
h x 45
D
C
0.25 mm (Gage Plane)
A
e
B
All Leads
q
A1
L
0.004"
MILLIMETERS
INCHES
DIM
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.20
0.004
0.008
B
0.35
0.51
0.014
0.020
C
0.19
0.25
0.0075
0.010
D
4.80
5.00
0.189
0.196
E
3.80
4.00
0.150
e
0.101 mm
1.27 BSC
0.157
0.050 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.50
0.93
0.020
0.037
q
0°
8°
0°
8°
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
Document Number: 71192
11-Sep-06
www.vishay.com
1
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR SO-8
0.172
(4.369)
0.028
0.022
0.050
(0.559)
(1.270)
0.152
(3.861)
0.047
(1.194)
0.246
(6.248)
(0.711)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
APPLICATION NOTE
Return to Index
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22
Document Number: 72606
Revision: 21-Jan-08
Legal Disclaimer Notice
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Revision: 02-Oct-12
1
Document Number: 91000