New Product Si4090DY Vishay Siliconix N-Channel 100 V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () Max. ID (A)a 0.0100 at VGS = 10 V 19.7 100 0.0105 at VGS = 7.5 V 19.2 0.0120 at VGS = 6.0 V 18 • TrenchFET® Power MOSFET • 100 % Rg and UIS Tested • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Qg (Typ.) 27.9 nC APPLICATIONS SO-8 S 1 8 D S 2 7 D S 3 6 D 5 D G 4 • • • • D DC/DC Primary Side Switch Telecom/Server Motor Drive Control Synchronous Rectification G Top View S Ordering Information: Si4090DY-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol Limit Drain-Source Voltage VDS 100 Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C) TC = 25 °C 19.7 TC = 70 °C 15.8 ID TA = 25 °C 10.4b, c IDM Continuous Source-Drain Diode Current Single Pulse Avalanche Current Avalanche Energy TC = 25 °C 7 3.1b, c 30 IAS EAS 7.8 TC = 70 °C 5 PD TA = 25 °C W 3.5b, c 2.2b, c TA = 70 °C Operating Junction and Storage Temperature Range mJ 45 TC = 25 °C Maximum Power Dissipation A 70 IS TA = 25 °C L = 0.1 mH V 13.2b, c TA = 70 °C Pulsed Drain Current (t = 300 µs) Unit TJ, Tstg °C - 55 to 150 THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb, d t 10 s Maximum Junction-to-Foot (Drain) Steady State Notes: a. Based on TC = 25 °C. b. Surface mounted on 1" x 1" FR4 board. c. t = 10 s. d. Maximum under steady state conditions is 80 °C/W. Document Number: 63917 S12-1135-Rev. A, 21-May-12 Symbol Typical Maximum RthJA 29 35 RthJF 13 16 For technical support, please contact: [email protected] Unit °C/W www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product Si4090DY Vishay Siliconix SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Test Conditions Min. VDS VGS = 0 V, ID = 250 µA 100 Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS/TJ VDS Temperature Coefficient VGS(th) Temperature Coefficient VGS(th)/TJ Gate-Source Threshold Voltage V 67 ID = 250 µA mV/°C - 6.4 VGS(th) VDS = VGS , ID = 250 µA 3.3 V Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 100 V, VGS = 0 V 1 VDS = 100 V, VGS = 0 V, TJ = 55 °C 10 On-State Drain Currenta ID(on) VDS 5 V, VGS = 10 V VGS 10 V, ID = 15 A 0.0080 0.0100 RDS(on) VGS 7.5 V, ID = 12 A 0.0085 0.0105 VGS 6.0 V, ID = 10 A 0.0090 0.0120 VDS = 15 V, ID = 15 A 54 Drain-Source On-State Resistancea Forward Transconductancea gfs 2 30 µA A S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss 2410 VDS = 50 V, VGS = 0 V, f = 1 MHz 790 VDS = 50 V, VGS = 10 V, ID = 10 A 45.6 69 27.9 42 60 Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Output Charge Qoss VDS = 50 V, VGS = 0 V Rg f = 1 MHz Gate Resistance tr Rise Time td(off) Turn-Off Delay Time Fall Time Turn-On Delay Time VDD = 50 V, RL = 5 ID 10 A, VGEN = 7.5 V, Rg = 1 63 95 1.3 2.6 16 32 11 22 35 70 20 td(on) 14 28 10 20 VDD = 50 V, RL = 5 ID 10 A, VGEN = 10 V, Rg = 1 tf Fall Time 0.4 10 td(off) Turn-Off Delay Time nC 9.2 tf tr Rise Time 8.5 VDS = 50 V, VGS = 6 V, ID = 10 A td(on) Turn-On Delay Time pF 36 70 10 20 ns Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Currenta IS TC = 25 °C 7 ISM VSD Body Diode Voltage 70 IS = 5 A 0.75 1.1 A V Body Diode Reverse Recovery Time trr 49 95 ns Body Diode Reverse Recovery Charge Qrr 58 115 nC Reverse Recovery Fall Time ta Reverse Recovery Rise Time tb IF = 10 A, di/dt = 100 A/µs, TJ = 25 °C 21 28 ns Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 % b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 For technical support, please contact: [email protected] Document Number: 63917 S12-1135-Rev. A, 21-May-12 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product Si4090DY Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 20 70 VGS = 10 V thru 5 V 16 ID - Drain Current (A) ID - Drain Current (A) 56 42 28 VGS = 4 V 12 TC = 25 °C 8 TC = 125 °C 14 4 TC = - 55 °C VGS = 3 V 0 0 1 2 3 4 VDS - Drain-to-Source Voltage (V) 0 5 0.0 1.4 Output Characteristics 4.2 5.6 7.0 Transfer Characteristics 0.0100 3200 Ciss 0.0094 2560 VGS = 6 V 0.0088 C - Capacitance (pF) RDS(on) - On-Resistance (Ω) 2.8 VGS - Gate-to-Source Voltage (V) VGS = 7.5 V VGS = 10 V 0.0082 1920 Coss 1280 640 0.0076 Crss 0 0.0070 0 14 28 42 ID - Drain Current (A) 56 0 70 20 40 60 80 VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current Capacitance 10 2.0 ID = 15 A RDS(on) - On-Resistance (Normalized) ID = 10 A VGS - Gate-to-Source Voltage (V) 100 VDS = 50 V 8 6 VDS = 25 V VDS = 75 V 4 2 0 0 10 20 30 40 Qg - Total Gate Charge (nC) Gate Charge Document Number: 63917 S12-1135-Rev. A, 21-May-12 50 VGS = 10 V 1.7 1.4 VGS = 6 V 1.1 0.8 0.5 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (°C) On-Resistance vs. Junction Temperature For technical support, please contact: [email protected] www.vishay.com 3 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product Si4090DY Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 0.05 100 ID = 15 A 0.04 TJ = 150 °C RDS(on) - On-Resistance (Ω) IS - Source Current (A) 10 TJ = 25 °C 1 0.1 0.01 0.03 0.02 TJ = 125 °C 0.01 TJ = 25 °C 0.001 0.00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 VSD - Source-to-Drain Voltage (V) 0 2 4 6 8 VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage 0.4 200 0.2 160 0 Power (W) VGS(th) - Variance (V) 10 - 0.2 ID = 5 mA 120 80 - 0.4 ID = 250 μA 40 - 0.6 - 0.8 - 50 - 25 0 25 50 75 100 TJ - Temperature (°C) 125 150 Threshold Voltage 0 0.001 0.01 0.1 Time (s) 1 10 Single Pulse Power, Junction-to-Ambient 100 IDM Limited ID - Drain Current (A) 10 100 μs ID Limited 1 ms 10 ms 1 Limited by RDS(on)* 100 ms 0.1 TA = 25 °C Single Pulse 0.01 0.01 1s 10 s BVDSS Limited DC 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area, Junction-to-Ambient www.vishay.com 4 For technical support, please contact: [email protected] Document Number: 63917 S12-1135-Rev. A, 21-May-12 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product Si4090DY Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 21.0 ID - Drain Current (A) 16.8 12.6 8.4 4.2 0.0 0 25 50 75 100 TC - Case Temperature (°C) 125 150 10 2.0 8 1.6 6 1.2 Power (W) Power (W) Current Derating* 4 2 0.8 0.4 0 0.0 0 25 50 75 100 TC - Case Temperature (°C) Power, Junction-to-Foot 125 150 0 25 50 75 100 125 150 TA - Ambient Temperature (°C) Power, Junction-to-Ambient * The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Document Number: 63917 S12-1135-Rev. A, 21-May-12 For technical support, please contact: [email protected] www.vishay.com 5 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 New Product Si4090DY Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 PDM 0.05 t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = R thJA = 80 °C/W 0.02 3. T JM - TA = PDMZthJA(t) Single Pulse 0.01 0.0001 0.001 0.01 4. Surface Mounted 0.1 1 10 100 1000 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 0.0001 0.001 0.01 0.1 Square Wave Pulse Duration (s) 1 10 Normalized Thermal Transient Impedance, Junction-to-Foot Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?63917. www.vishay.com 6 For technical support, please contact: [email protected] Document Number: 63917 S12-1135-Rev. A, 21-May-12 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information Vishay Siliconix SOIC (NARROW): 8-LEAD JEDEC Part Number: MS-012 8 6 7 5 E 1 3 2 H 4 S h x 45 D C 0.25 mm (Gage Plane) A e B All Leads q A1 L 0.004" MILLIMETERS INCHES DIM Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.20 0.004 0.008 B 0.35 0.51 0.014 0.020 C 0.19 0.25 0.0075 0.010 D 4.80 5.00 0.189 0.196 E 3.80 4.00 0.150 e 0.101 mm 1.27 BSC 0.157 0.050 BSC H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.50 0.93 0.020 0.037 q 0° 8° 0° 8° S 0.44 0.64 0.018 0.026 ECN: C-06527-Rev. I, 11-Sep-06 DWG: 5498 Document Number: 71192 11-Sep-06 www.vishay.com 1 Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR SO-8 0.172 (4.369) 0.028 0.022 0.050 (0.559) (1.270) 0.152 (3.861) 0.047 (1.194) 0.246 (6.248) (0.711) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index APPLICATION NOTE Return to Index www.vishay.com 22 Document Number: 72606 Revision: 21-Jan-08 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000