Intelligent Power Devices (IPDs) MIP713 Silicon MOS IC ■ Features Unit : mm 2.90+0.20 –0.05 1.9±0.1 (0.95) (0.95) 2 1 0.30+0.10 –0.05 • For automotive electric equipment 0.50+0.10 –0.05 (0.65) 3 ■ Applications 2.8+0.2 –0.3 6 5˚ 5 1.50+0.25 –0.05 4 0.16+0.10 –0.06 0.4±0.2 • Five protective functions (over-current, over-voltage, short-circuit load, over heat, ESD) built-in. • Heat which goes up when load short-circuits is controlled. • Although it is a small package, it has resistance of low heat. (When mounted in a substrate.) • Driving directly from CMOS (microcomputer) is possible. Rating Unit Drain-source voltage VDS − 0.5 to +40 V Output peak current IOP 3.0 A Output current IO 1.0 A Input voltage VIN − 0.5 to +6.0 V Input current IIN ±2 mA Drain clamp energy *1 ECLP 17 mJ *2 PD1 0.2 W Power dissipation 2 *3 PD2 0.8 W Channel temperature Tch −40 to +150 °C Storage temperature Tstg −55 to +150 °C Power dissipation 1 1.1+0.2 –0.1 Symbol 0 to 0.1 Parameter 1.1+0.3 –0.1 10˚ ■ Absolute Maximum Ratings 1 : Drain 2 : Drain 3 : Source 4 : In 5 : Drain 6 : Drain Mini6-G1 Package Marking Symbol: MA Note) *1 : L = 10 mH, IL = 1.84 A, VDD = 20 V 1 pulse, TC = 25°C *2 : Single unit *3 : Mounting on the PCB (40 mm2, Thick 1.7 mm Glass epoxy substrate) (Ta = 25°C) ■ Block Diagram Drain 2 Over Current Protection In 3 Short Circuit Load Protection Gate Shut Down Circuit ESD Protection Over Heat Protection Over Voltage Protection 1 Source Publication date: July 2003 SLB00064AED 1 MIP713 ■ Electrical Characteristics TC = 25°C ± 3°C Parameter Symbol Conditions Typ Max Unit 0.55 0.8 Ω 0.55 0.8 V 52 65 V VIN = 0 V, VDS = 12 V 27 50 µA VIN = 0 V, VDS = 16 V 36 68 79 170 RDS(on) VIN = 5 V, IDS = 1 A Drain-source voltage VDS(on) VIN = 5 V, IDS = 1 A Drain clamp voltage VDS(CLP) VIN = 0 V, IDS = 3 mA Drain-source cutoff current 1 IDS(off)1 Drain-source cutoff current 2 IDS(off)2 Drain-source cutoff current 3 IDS(off)3 VIN = 0 V, VDS = 30 V Input voltage high-level VIN(H) IDS = 1 A Input voltage low-level VIN(L) IDS = 1 mA Input current (normal) IIN(on) VIN = 5 V, VDS = 0 V Drain-source ON resistance IIN(PROT) VIN = 5 V IOCP VIN = 5 V Short circuit load protection limit VDS(SHT) VIN = 5 V Input voltage of act on protection VIN(PROT) Input current (act on protection) * Over current protection limit Min 40 4 2.0 V 0.8 V 0.2 0.3 mA 0.6 0.9 mA 3.0 A 2.0 4.0 V 3.9 6.0 V Note) 1. At on-state when drain voltage exceeds the "Short circuit load protection voltage", output current begin to oscillate. 2. When drain voltage exceeds the "Drain clamp voltage" output MOS turn on, so drain voltage are clamped before the drain-source junction become breakdown. 3. *: State of short circuit laod protection and over heat protection (Designed guarantee). ■ Electrical Characteristics (Reference value: Non guarantee value) Parameter Over heat protection temperature Symbol TSHD Turn-on time tON Turn-off time tOFF Conditions VIN = 5 V Min Typ 150 190 °C 4 µs VDD = 30 V, RL = 30 Ω IDS = 1 A, VIN = 5 V Max Unit 7 Note) If the chip temperature exceeds the "Over heat protection temperature", output current is shut down. And if the chip cool down, the protection will operate automatically again. ■ Electrical Characteristics TC = −40°C to 125°C Parameter Conditions Min Typ Max Unit Drain-source ON resistance RDS(on) VIN = 5 V, IDS = 1 A 1.6 Ω Drain-source voltage VDS(on) VIN = 5 V, IDS = 1 A 1.6 V Drain clamp voltage VDS(CLP) VIN = 0 V, IDS = 3 mA 65 V Drain-source cutoff current 1 IDS(off)1 VIN = 0 V, VDS = 12 V 100 µA Drain-source cutoff current 2 IDS(off)2 VIN = 0 V, VDS = 16 V 136 Drain-source cutoff current 3 IDS(off)3 VIN = 0 V, VDS = 30 V 340 Input voltage high-level VIN(H) IDS = 1 A Input voltage low-level VIN(L) IDS = 1 mA 0.8 V IIN(on) Input current (normal) Input current (act on protection) 40 4.3 V VIN = 5 V, VDS = 0 V 0.45 mA IIN(PROT) VIN = 5 V 1.2 mA IOCP VIN = 5 V 1.15 A Short circuit load protection limit VDS(SHT) VIN = 5 V 1.6 V Input voltage of act on protection VIN(PROT) Over current protection limit 2 Symbol 4.0 SLB00064AED 6.0 V Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. 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Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL