PANASONIC 2SC6012

Power Transistors
2SC6012
Silicon NPN triple diffusion mesa type
For horizontal deflection output
Unit: mm
Unit
Collector-base voltage (Emitter open)
VCBO
1 700
V
Collector-emitter voltage (E-B short)
VCES
1 700
V
Emitter-base voltage (Collector open)
VEBO
7
V
IB
3
A
Collector current
IC
15
A
Peak collector current *
ICP
24
A
Collector power dissipation
PC
60
W
(23.4)
(4.5)
5˚
(2.0)
0.7±0.1
5.45±0.3
10.9±0.5
5˚
1
2
5.5±0.3
Rating
5˚
1.1±0.1
3
1: Base
2: Collector
3: Emitter
EIAJ: SC-94
TOP-3E-A1 Package
(2.0)
Symbol
3.3±0.3
Parameter
3.0±0.3
5˚
5˚
(4.0)
2.0±0.2
18.6±0.5
(2.0)
Solder Dip
■ Absolute Maximum Ratings TC = 25°C
Ta = 25°C
(1.2)
26.5±0.5
• High breakdown voltage, and high reliability through the use of a
glass passivation layer
• High-speed switching
• Wide safe oeration area
Base current
5˚
(10.0)
■ Features
φ 3.2±0.1
22.0±0.5
15.5±0.5
Internal Connection
C
3
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
B
Note) *: Non-repetitive peak collector current
E
■ Electrical Characteristics TC = 25°C ± 3°C
Parameter
Symbol
Emitter-base voltage (Collector open)
Forward voltage *
VEBO
VF
Collector-base cutoff current (Emitter open)
Forward current transfer ratio *
Collector-emitter saturation voltage *
Base-emitter saturation voltage
*
*
ICBO
Conditions
IE = 750 mA, IC = 0
Min
Typ
Max
7
Unit
V
IF = 7.0 A
−2
VCB = 1 000 V, IE = 0
50
µA
VCB = 1 700 V, IE = 0
1
mA
12

3.0
V
hFE
VCE = 5 V, IC = 7.0 A
VCE(sat)
IC = 7.0 A, IB = 1.75 A
VBE(sat)
IC = 7.0 A, IB = 1.75 A
7
1.5
V
V
Transition frequency
fT
VCE = 10 V, IC = 0.5 A, f = 0.5 MHz
Storage time
tstg
IC = 7.0 A, Resistance loaded
5.0
µs
Fall time
tf
IB1 = 1.75 A, IB2 = −3.5 A
0.5
µs
2.1
MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Publication date: July 2004
SJD00321AED
1
2SC6012
IC  VCE
10
(1) TC = Ta
(2) With a 100 × 100 × 2 mm
Al heat sink
(3) Without heat sink
60
50
(1)
40
30
20
1.0 A
7
0.8 A
6
0.6 A
5
0.4 A
4
0.2 A
3
25
50
75
100
125
0
150
IB = 0 A
0
1
2
3
10
5
6
Forward current transfer ratio hFE
Ta = 120°C
25°C
0.1
−40°C
10
Collector current IC (A)
10
1
0.1
1
Collector current IC (A)
< 1 mA
1 500
−40°C
0
0.2
0.4 0.6
0.8
1.0
1.2
1.4
Base-emitter voltage VBE (V)
100
Non repetitive pulse
TC = 25°C
ICP
1
t=
10 ms
t=
1 ms
t=
100 µs
DC
10−1
10−2
5
1 000
25°C
Safe operation area
−40°C
10
500
0
9 10
25°C
15
0
8
Ta = 120°C
20
0
Ta = 120°C
10 IC
fH = 64 kHz, TC < 90°C
A.S.O for a single
pulse load caused by
EHT flash over during
horizontal operation.
25
7
VCE = 5 V
Safe operation area (Horizontal operation)
30
4
hFE  IC
100
1
1
6
Collector-emitter voltage VCE (V)
IC / IB = 4
0.01
0.1
4
Collector current IC (A)
0
8
2
VCE(sat)  IC
Collector-emitter saturation voltage VCE(sat) (V)
10
8
Ambient temperature Ta (°C)
Collector current IC (A)
VCE = 5 V
1.2 A
1
(2)
(3)
2 000
Collector-emitter voltage VCE (V)
2
IC  VBE
12
1.6 A
1.4 A
2
10
0
1.8 A
9
Collector current IC (A)
Collector power dissipation PC (W)
70
2.0 A
Collector current IC (A)
PC  Ta
80
SJD00321AED
10
10−3
1
10
100
1 000
Collector-emitter voltage VCE (V)
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and semiconductors described in this material
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Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
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modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
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2003 SEP