Materials Declaration Package Body Size Ball Count Option Ball Size G770 Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Molding Compound % of Compound 85.0 7.0 6.5 1.0 0.5 Weight (g) 1.60 E-01 1.32 E-02 1.22 E-02 1.88 E-03 9.42 E-04 PPM 386715 31847 29572 4550 2275 Laminate % of Laminate 28.0 25.0 19.0 11.0 9.4 7.8 Weight (g) 3.61 E-02 3.22 E-02 2.45 E-02 1.42 E-02 1.21 E-02 1.01 E-02 PPM 87242 77895 59200 34274 29133 24303 Sn Ag Cu Solder Ball % of Solder Ball 96.5 3.0 0.5 Weight (g) 6.44 E-02 2.00 E-03 3.34 E-04 PPM 155567 4836 806 Au Bond Wires % of Wire 99.99 Weight (g) 4.60 E-03 PPM 11118 Si Chip % of Chip 100.0 Weight (g) 2.19 E-02 PPM 52876 Die Attach % of Die Attach 76.0 24.0 Weight (g) 2.45 E-03 7.74 E-04 PPM Item BT-Epoxy Glass Fiber Copper Gold Solder Mask Nickel A2000 CSP_BGA 13 X 13 237 Pb-free 0.40 mm Item Ag Epoxy Resin Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected USEPA3050B. ICP-AES Not Detected EN 1122 Method B:2001. ICP-AES Not Detected USEPA 3052. ICP-AES Not Detected USEPA 3060A & USEPA 7196A Not Detected Analysis was performed by GC/MS Not Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS 2 layers Samsung Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS 5920 1869 Package Totals PPM Weight (g) 997725 4.14 E-01 STS-BC-F Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/23/06 Materials Declaration Package Body Size Ball Count Option Ball Size Item Silica Epoxy resin Antimony trioxide Carbon black CSP_BGA 13 X 13 237 Standard 0.40 mm Molding Compound % of Compound Weight (g) 75.5 1.40 E-01 20.0 3.71 E-02 3.0 5.56 E-03 1.5 2.78 E-03 PPM 337903 89511 13426 6714 Laminate % of Laminate 25.0 25.0 19.0 12.2 11.0 7.8 Weight (g) 3.46E-02 2.83E-02 5.72E-02 8.66E-03 1.56E-03 2.90E-04 PPM 83478 68300 138154 20916 3768 700 Sn Pb Ag Solder Ball % of Solder Ball 62.0 36.0 2.0 Weight (g) 4.14 E-02 2.40 E-02 1.34 E-03 PPM 99937 58028 3224 Au Bond Wires % of Wire 99.99 Weight (g) 4.46 E-03 PPM 10774 Si Chip % of Chip 100.0 Weight (g) 1.81 E-02 PPM 43634 Die Attach % of Die Attach 70.0 20.0 5.0 5.0 Weight (g) 6.24 E-03 1.78 E-03 4.46 E-04 4.46 E-04 PPM 15071 4306 1077 1077 Item BT-Epoxy Glass Fiber Copper Solder Mask Nickel Gold Item Ag Epoxy Resin Silane Amine Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Laminate Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Package Totals Weight (g) PPM 1000000 4.14 E-01 Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS STS-BC-C Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/23/06