PIC12(L)F1501/PIC16(L)F150X Memory Programming

PIC12(L)F1501/PIC16(L)F150X
PIC12(L)F1501/PIC16(L)F150X Memory Programming Specification
This document includes the
programming specifications for the
following devices:
1.1.2
LOW-VOLTAGE ICSP
PROGRAMMING
• PIC12F1501
• PIC12LF1501
• PIC16F1503
• PIC16LF1503
• PIC16F1507
• PIC16LF1507
In Low-Voltage ICSP™ mode, these devices can be
programmed using a single VDD source in the
operating range. The MCLR/VPP pin does not have to
be brought to a different voltage, but can instead be left
at the normal operating voltage.
• PIC16F1508
• PIC16LF1508
1.1.2.1
• PIC16F1509
• PIC16LF1509
1.0
The LVP bit in Configuration Word 2 enables singlesupply (low-voltage) ICSP programming. The LVP bit
defaults to a ‘1’ (enabled) from the factory. The LVP bit
may only be programmed to ‘0’ by entering the HighVoltage ICSP mode, where the MCLR/VPP pin is raised
to VIHH. Once the LVP bit is programmed to a ‘0’, only
the High-Voltage ICSP mode is available and only the
High-Voltage ICSP mode can be used to program the
device.
OVERVIEW
The devices can be programmed using either the highvoltage In-Circuit Serial Programming™ (ICSP™)
method or the low-voltage ICSP™ method.
1.1
Hardware Requirements
1.1.1
Single-Supply ICSP Programming
Note 1: The High-Voltage ICSP mode is always
available, regardless of the state of the
LVP bit, by applying VIHH to the MCLR/
VPP pin.
HIGH-VOLTAGE ICSP
PROGRAMMING
In High-Voltage ICSP™ mode, these devices require
two programmable power supplies: one for VDD and
one for the MCLR/VPP pin.
2: While in Low-Voltage ICSP mode, MCLR
is always enabled, regardless of the
MCLRE bit, and the port pin can no
longer be used as a general purpose
input.
1.2
Pin Utilization
Five pins are needed for ICSP™ programming. The
pins are listed in Table 1-1.
TABLE 1-1:
Pin Name
RA1
RA0
PIN DESCRIPTIONS DURING PROGRAMMING
During Programming
Function
Pin Type
ICSPCLK
I
Pin Description
Clock Input – Schmitt Trigger Input
ICSPDAT
I/O
Data Input/Output – Schmitt Trigger Input
Program/Verify mode
P(1)
Program Mode Select/Programming Power Supply
VDD
VDD
P
Power Supply
VSS
VSS
P
Ground
MCLR/VPP/RA3
Legend:
Note 1:
I = Input, O = Output, P = Power
The programming high voltage is internally generated. To activate the Program/Verify mode, high voltage needs to be
applied to MCLR input. Since the MCLR is used for a level source, MCLR does not draw any significant current.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 1
PIC12(L)F1501/PIC16(L)F150X
2.0
DEVICE PINOUTS
The pin diagrams are shown in Figure 2-1 through
Figure 2-5. The pins that are required for programming
are listed in Table 1-1 and shown in bold lettering in the
pin diagrams.
FIGURE 2-1:
8-PIN PDIP, SOIC, MSOP, DFN DIAGRAM FOR PIC12(L)F1501
FIGURE 2-2:
VDD
1
RA5
2
RA4
3
MCLR/VPP/RA3
4
PIC12(L)F1501
PDIP, SOIC, MSOP, DFN (2X3)
8
VSS
7
RA0/ICSPDAT
6
RA1/ICSPCLK
5
RA2
14-PIN PDIP, SOIC, TSSOP DIAGRAM FOR PIC16(L)F1503
PDIP, SOIC, TSSOP
FIGURE 2-3:
1
14
RA5
RA4
2
13
VSS
RA0/ICSPDAT
12
RA1/ICSPCLK
11
RA2
10
RC0
9
RC1
8
RC2
MCLR/VPP/RA3
3
4
RC5
5
RC4
6
RC3
7
PIC16(L)F1503
VDD
16-PIN QFN DIAGRAM FOR PIC16(L)F1503
VDD
NC
NC
Vss
QFN (3x3)
RA5
RA4
MCLR/VPP/RA3
RC5
1
2
3
4
PIC16(L)F1503
16 15 14 13
12
11
10
9
- RA0/ICSPDAT
RA1/ICSPCLK
RA2
RC0
RC4
RC3
RC2
RC1
5 6 7 8
DS41573C-page 2
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PIC12(L)F1501/PIC16(L)F150X
FIGURE 2-4:
20-PIN PDIP, SOIC, SSOP DIAGRAM FOR PIC16(L)F1507/8/9
PDIP, SOIC, SSOP
20
VSS
RA5
2
19
RA0/ICSPDAT
RA4
3
18
RA1/ICSPCLK
MCLR/VPP/RA3
4
17
RA2
16
RC0
15
RC1
14
13
RC2
9
12
RB5
10
11
RB6
RC5
5
RC4
6
RC3
RC6
7
RC7
RB7
8
RB4
20-PIN QFN DIAGRAM FOR PIC16(L)F1507/8/9
RA4
RA5
VDD
Vss
RA0/ICSPDAT
FIGURE 2-5:
PIC16(L)F1507/8/9
1
VDD
QFN (4x4)
MCLR/VPP/RA3
RC5
RC4
RC3
RC6
1
2
3
4
5
PIC16(L)F1507/8/9
20 19 18 17 16
15
14
13
12
11
-
RA1/ICSPCLK
RA2
RC0
RC1
RC2
RC7
RB7
RB6
RB5
RB4
6 7 8 9 10
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 3
PIC12(L)F1501/PIC16(L)F150X
3.0
MEMORY MAP
The memory is broken into two sections: program
memory and configuration memory. Only the size of the
program memory changes between devices, the
configuration memory remains the same.
FIGURE 3-1:
PIC12(L)F1501 PROGRAM MEMORY MAPPING
1 KW
0000h
Implemented
03FFh
Maps to
0-03FFh
8000h
User ID Location
8001h
User ID Location
8002h
User ID Location
8003h
User ID Location
8004h
Reserved
8005h
Reserved
8006h
Device ID
8007h
Configuration Word 1
8008h
Configuration Word 2
8009h
Calibration Word 1
800Ah
Calibration Word 2
7FFFh
8000h
Program Memory
Implemented
8100h
Maps to
8000-80FFh
Configuration Memory
FFFFh
800Bh-80FFh
DS41573C-page 4
Reserved
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PIC12(L)F1501/PIC16(L)F150X
FIGURE 3-2:
PIC16(L)F1503/1507 PROGRAM MEMORY MAPPING
2 KW
0000h
Implemented
07FFh
Maps to
0-07FFh
8000h
User ID Location
8001h
User ID Location
8002h
User ID Location
8003h
User ID Location
8004h
Reserved
8005h
Reserved
8006h
Device ID
8007h
Configuration Word 1
8008h
Configuration Word 2
8009h
Calibration Word 1
800Ah
Calibration Word 2
7FFFh
8000h
Program Memory
Implemented
8200h
Maps to
8000-81FFh
Configuration Memory
FFFFh
800Bh-81FFh
 2011 Microchip Technology Inc.
Reserved
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DS41573C-page 5
PIC12(L)F1501/PIC16(L)F150X
FIGURE 3-3:
PIC16(L)F1508 PROGRAM MEMORY MAPPING
4 KW
0000h
Implemented
0FFFh
Maps to
0-0FFFh
8000h
User ID Location
8001h
User ID Location
8002h
User ID Location
8003h
User ID Location
8004h
Reserved
8005h
Reserved
8006h
Device ID
8007h
Configuration Word 1
8008h
Configuration Word 2
8009h
Calibration Word 1
800Ah
Calibration Word 2
7FFFh
8000h
Program Memory
Implemented
8200h
Maps to
8000-81FFh
Configuration Memory
FFFFh
800Bh-81FFh
DS41573C-page 6
Reserved
Advance Information
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
FIGURE 3-4:
PIC16(L)F1509 PROGRAM MEMORY MAPPING
8 KW
0000h
Implemented
1FFFh
Maps to
0-1FFFh
8000h
User ID Location
8001h
User ID Location
8002h
User ID Location
8003h
User ID Location
8004h
Reserved
8005h
Reserved
8006h
Device ID
8007h
Configuration Word 1
8008h
Configuration Word 2
8009h
Calibration Word 1
800Ah
Calibration Word 2
7FFFh
8000h
Program Memory
Implemented
8200h
Maps to
8000-81FFh
Configuration Memory
FFFFh
800Bh-81FFh
 2011 Microchip Technology Inc.
Reserved
Advance Information
DS41573C-page 7
PIC12(L)F1501/PIC16(L)F150X
3.1
User ID Location
A user may store identification information (user ID) in
four designated locations. The user ID locations are
mapped to 8000h-8003h. Each location is 14 bits in
length. Code protection has no effect on these memory
locations. Each location may be read with code
protection enabled or disabled.
MPLAB® IDE only displays the 7 Least
Significant bits (LSb) of each user ID
location, the upper bits are not read. It is
recommended that only the 7 LSbs be
used if MPLAB IDE is the primary tool
used to read these addresses.
Note:
3.2
Device ID
The device ID word is located at 8006h. This location is
read-only and cannot be erased or modified.
REGISTER 3-1:
DEVICE ID: DEVICE ID REGISTER(1)
R
R
R
R
R
R
DEV8
DEV7
DEV6
DEV5
DEV4
DEV3
bit 13
bit 8
R
R
R
R
R
R
R
R
DEV2
DEV1
DEV0
REV4
REV3
REV2
REV1
REV0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
‘1’ = Bit is set
-n = Value at POR
W = Writable bit
U = Unimplemented bit, read as x = Bit is unknown
‘0’
bit 13-5
DEV<8:0>: Device ID bits
These bits are used to identify the part number.
bit 4-0
REV<4:0>: Revision ID bits
‘0’ = Bit is cleared
These bits are used to identify the revision.
Note 1:
This location cannot be written.
DS41573C-page 8
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PIC12(L)F1501/PIC16(L)F150X
TABLE 3-1:
DEVICE ID VALUES
DEVICE
DEVICE ID VALUES
DEV
REV
PIC12F1501
0010 1100 110
x xxxx
PIC12LF1501
0010 1101 100
x xxxx
PIC16F1503
0010 1100 111
x xxxx
PIC16LF1503
0010 1101 101
x xxxx
PIC16F1507
0010 1101 000
x xxxx
PIC16LF1507
0010 1101 110
x xxxx
PIC16F1508
0010 1101 001
x xxxx
PIC16LF1508
0010 1101 111
x xxxx
PIC16F1509
0010 1101 010
x xxxx
PIC16LF1509
0010 1110 000
x xxxx
3.3
Configuration Words
There are two Configuration Words, Configuration Word
1 (8007h) and Configuration Word 2 (8008h). The
individual bits within these Configuration Words are
used to enable or disable device functions such as the
Brown-out Reset, code protection and Power-up Timer.
3.4
Calibration Words
The internal calibration values are factory calibrated
and stored in Calibration Words 1 and 2 (8009h,
800Ah).
The Calibration Words do not participate in erase
operations. The device can be erased without affecting
the Calibration Words.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 9
PIC12(L)F1501/PIC16(L)F150X
REGISTER 3-2:
CONFIGURATION WORD 1: PIC12(L)F1501 AND PIC16(L)F1503/1507 DEVICES
ONLY
U-1
U-1
R/P-1
R/P-1
R/P-1
U-1(3)
—
—
CLKOUTEN
BOREN1
BOREN0
—
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
U-1
R/P-1
R/P-1
CP
MCLRE
PWRTE
WDTE1
WDTE0
—
FOSC1
FOSC0
bit 7
bit 0
Legend:
W = Writable bit
R = Readable bit
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
-n = Value at POR
U = Unimplemented bit
P = Programmable Bit
bit 13-12
Unimplemented: Read as ‘1’
bit 11
CLKOUTEN: Clock Out Enable bit
1 = CLKOUT function is disabled. I/O or oscillator function on CLKOUT pin.
0 = CLKOUT function is enabled on CLKOUT pin
bit 10-9
BOREN<1:0>: Brown-out Reset Enable bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the PCON register
00 = BOR disabled
bit 8(3)
Unimplemented: Read as ‘1’
bit 7
CP: Code Protection bit(2)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 6
MCLRE: MCLR/VPP Pin Function Select bit
If LVP bit = 1:
This bit is ignored.
If LVP bit = 0:
1 = MCLR/VPP pin function is MCLR; Weak pull-up enabled.
0 = MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUA register.
bit 5
PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 4-3
WDTE<1:0>: Watchdog Timer Enable bit
11 = WDT enabled
10 = WDT enabled while running and disabled in Sleep
01 = WDT controlled by the SWDTEN bit in the WDTCON register
00 = WDT disabled
bit 2
Unimplemented: Read as ‘1’
bit 1-0
FOSC<1:0>: Oscillator Selection bits
11 =
ECH: External Clock, High-Power mode: on CLKIN pin
10 =
ECM: External Clock, Medium-Power mode: on CLKIN pin
01 =
ECL: External Clock, Low-Power mode: on CLKIN pin
00 =
INTOSC oscillator: I/O function on OSC1 pin
Note
1:
2:
3:
Enabling Brown-out Reset does not automatically enable Power-up Timer.
The entire program memory will be erased when the code protection is turned off.
This bit should be maintained as ‘1’ when programmed.
DS41573C-page 10
Advance Information
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PIC12(L)F1501/PIC16(L)F150X
REGISTER 3-3:
CONFIGURATION WORD 1: PIC16(L)F1508/1509 DEVICES ONLY
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
U-1(3)
FCMEN
IESO
CLKOUTEN
BOREN1
BOREN0
—
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
CP
MCLRE
PWRTE
WDTE1
WDTE0
FOSC2
FOSC1
FOSC0
bit 7
bit 0
Legend:
W = Writable bit
‘0’ = Bit is cleared
R = Readable bit
‘1’ = Bit is set
x = Bit is unknown
-n = Value at POR
U = Unimplemented bit
P = Programmable Bit
bit 13
FCMEN: Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor is enabled
0 = Fail-Safe Clock Monitor is disabled
bit 12
IESO: Internal/External Switchover bit
1 = Internal/External Switchover mode is enabled
0 = Internal/External Switchover mode is disabled
bit 11
CLKOUTEN: Clock Out Enable bit
1 = CLKOUT function is disabled. I/O or oscillator function on CLKOUT pin.
0 = CLKOUT function is enabled on CLKOUT pin
bit 10-9
BOREN<1:0>: Brown-out Reset Enable bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the PCON register
00 = BOR disabled
bit 8(3)
Unimplemented: Read as ‘1’
bit 7
CP: Code Protection bit(2)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 6
MCLRE: MCLR/VPP Pin Function Select bit
If LVP bit = 1:
This bit is ignored.
If LVP bit = 0:
1 = MCLR/VPP pin function is MCLR; Weak pull-up enabled.
0 = MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUA register.
bit 5
PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 4-3
WDTE<1:0>: Watchdog Timer Enable bit
11 = WDT enabled
10 = WDT enabled while running and disabled in Sleep
01 = WDT controlled by the SWDTEN bit in the WDTCON register
00 = WDT disabled
bit 2-0
FOSC<2:0>: Oscillator Selection bits
111 = ECH: External Clock, High-Power mode: on CLKIN pin
110 = ECM: External Clock, Medium-Power mode: on CLKIN pin
101 = ECL: External Clock, Low-Power mode: on CLKIN pin
100 = INTOSC oscillator: I/O function on OSC1 pin
011 = EXTRC oscillator: RC function on CLKIN pin
010 = HS oscillator: High-speed crystal/resonator on OSC1 and OSC2 pins
001 = XT oscillator: Crystal/resonator on OSC1 and OSC2 pins
000 = LP oscillator: Low-power crystal on OSC1 and OSC2 pins
Note
1:
2:
3:
Enabling Brown-out Reset does not automatically enable Power-up Timer.
The entire program memory will be erased when the code protection is turned off.
This bit should be maintained as ‘1’ when programmed.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 11
PIC12(L)F1501/PIC16(L)F150X
REGISTER 3-4:
CONFIGURATION WORD 2: PIC12(L)F1501 AND PIC16(L)F1503/1507 DEVICES
ONLY
R/P-1
U-1
R/P-1
R/P-1
R/P-1
U-1
LVP
—
LPBOR
BORV
STVREN
—
bit 13
bit 8
U-1
U-1
U-1
U-1
U-1
U-1
R/P-1
R/P-1
—
—
—
—
—
—
WRT1
WRT0
bit 7
bit 0
Legend:
W = Writable bit
‘0’ = Bit is cleared
R = Readable bit
‘1’ = Bit is set
x = Bit is unknown
-n = Value at POR
U = Unimplemented bit
P = Programmable Bit
bit 13
LVP: Low-Voltage Programming Enable bit(1)
1 = Low-voltage programming enabled
0 = HV on MCLR/VPP must be used for programming
bit 12
Unimplemented: Read as ‘1’
bit 11
LPBOR: Low-Power BOR bit
1 = Low-Power BOR is disabled
0 = Low-Power BOR is enabled
bit 10
BORV: Brown-out Reset Voltage Selection bit
1 = Brown-out Reset Voltage (VBOR) set to 1.9V on LF devices, and 2.45V on F devices
0 = Brown-out Reset Voltage (VBOR) set to 2.7V
bit 9
STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset
0 = Stack Overflow or Underflow will not cause a Reset
bit 8-2
Unimplemented: Read as ‘1’
bit 1-0
WRT<1:0>: Flash Memory Self-Write Protection bits
1 kW Flash memory (PIC12(L)F1501):
11 = Write protection off
10 = 000h to 0FFh write-protected, 100h to 3FFh may be modified by PMCON control
01 = 000h to 1FFh write-protected, 200h to 3FFh may be modified by PMCON control
00 = 000h to 3FFh write-protected, no addresses may be modified by PMCON control
2 kW Flash memory (PIC16(L)F1503/1507):
11 = Write protection off
10 = 000h to 1FFh write-protected, 200h to 7FFh may be modified by PMCON control
01 = 000h to 3FFh write-protected, 400h to 7FFh may be modified by PMCON control
00 = 000h to 7FFh write-protected, no addresses may be modified by PMCON control
Note 1:
The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
DS41573C-page 12
Advance Information
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PIC12(L)F1501/PIC16(L)F150X
REGISTER 3-5:
CONFIGURATION WORD 2: PIC16(L)F1508/1509 DEVICES ONLY
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
U-1
LVP
DEBUG
LPBOR
BORV
STVREN
—
bit 13
bit 8
U-1
U-1
U-1
U-1
U-1
U-1
R/P-1
R/P-1
—
—
—
—
—
—
WRT1
WRT0
bit 7
bit 0
Legend:
W = Writable bit
R = Readable bit
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
-n = Value at POR
U = Unimplemented bit
P = Programmable Bit
bit 13
LVP: Low-Voltage Programming Enable bit(1)
1 = Low-voltage programming enabled
0 = HV on MCLR/VPP must be used for programming
bit 12
DEBUG: Debugger mode
1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT pins are general purpose I/O pins
0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT pins are dedicated to the debugger
bit 11
LPBOR: Low-Power BOR bit
1 = Low-Power BOR is disabled
0 = Low-Power BOR is enabled
bit 10
BORV: Brown-out Reset Voltage Selection bit
1 = Brown-out Reset Voltage (VBOR) set to 1.9V on LF devices, and 2.45V on F devices
0 = Brown-out Reset Voltage (VBOR) set to 2.7V
bit 9
STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset
0 = Stack Overflow or Underflow will not cause a Reset
bit 8-2
Unimplemented: Read as ‘1’
bit 1-0
WRT<1:0>: Flash Memory Self-Write Protection bits
4 kW Flash memory (PIC16(L)F1508):
11 = Write protection off
10 = 000h to 1FFh write-protected, 200h to FFFh may be modified by PMCON control
01 = 000h to 7FFh write-protected, 800h to FFFh may be modified by PMCON control
00 = 000h to FFFh write-protected, no addresses may be modified by PMCON control
8 kW Flash memory (PIC16(L)F1509):
11 = Write protection off
10 = 0000h to 01FFh write-protected, 0200h to 1FFFh may be modified by PMCON control
01 = 0000h to 0FFFh write-protected, 1000h to 1FFFh may be modified by PMCON control
00 = 0000h to 1FFFh write-protected, no addresses may be modified by PMCON control
Note 1:
The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 13
PIC12(L)F1501/PIC16(L)F150X
4.0
PROGRAM/VERIFY MODE
In Program/Verify mode, the program memory and the
configuration memory can be accessed and
programmed in serial fashion. ICSPDAT and
ICSPCLK are used for the data and the clock,
respectively. All commands and data words are
transmitted LSb first. Data changes on the rising edge
of the ICSPCLK and latched on the falling edge. In
Program/Verify mode both the ICSPDAT and
ICSPCLK are Schmitt Trigger inputs. The sequence
that enters the device into Program/Verify mode
places all other logic into the Reset state. Upon
entering Program/Verify mode, all I/Os are
automatically configured as high-impedance inputs
and the address is cleared.
4.1
High-Voltage Program/Verify Mode
Entry and Exit
There are two different methods of entering Program/
Verify mode via high-voltage:
• VPP – First entry mode
• VDD – First entry mode
4.1.1
VPP – FIRST ENTRY MODE
To enter Program/Verify mode via the VPP-first method
the following sequence must be followed:
1.
2.
3.
Hold ICSPCLK and ICSPDAT low. All other pins
should be unpowered.
Raise the voltage on MCLR from 0V to VIHH.
Raise the voltage on VDD from 0V to the desired
operating voltage.
The VPP-first entry prevents the device from executing
code prior to entering Program/Verify mode. For
example, the device will execute code when
Configuration Word 1 has MCLR disabled (MCLRE =
0), the Power-up Timer is disabled (PWRTE = 0), the
internal oscillator is selected (FOSC = 100), and
ICSPCLK and ICSPDAT pins are driven by the user
application. Since this may prevent entry, VPP-first
entry mode is strongly recommended. See the timing
diagram in Figure 8-2.
4.1.2
4.1.3
PROGRAM/VERIFY MODE EXIT
To exit Program/Verify mode take MCLR to VDD or
lower (VIL). See Figures 8-3 and 8-4.
4.2
Low-Voltage Programming (LVP)
Mode
The Low-Voltage Programming mode allows devices to
be programmed using VDD only, without high voltage.
When the LVP bit of Configuration Word 2 register is
set to ‘1’, the low-voltage ICSP programming entry is
enabled. To disable the Low-Voltage ICSP mode, the
LVP bit must be programmed to ‘0’. This can only be
done while in the High-Voltage Entry mode.
Entry into the Low-Voltage ICSP Program/Verify modes
requires the following steps:
1.
2.
MCLR is brought to VIL.
A 32-bit key sequence is presented on
ICSPDAT, while clocking ICSPCLK.
The key sequence is a specific 32-bit pattern, '0100
1101 0100 0011 0100 1000 0101 0000' (more
easily remembered as MCHP in ASCII). The device will
enter Program/Verify mode only if the sequence is
valid. The Least Significant bit of the Least Significant
nibble must be shifted in first.
Once the key sequence is complete, MCLR must be
held at VIL for as long as Program/Verify mode is to be
maintained.
For low-voltage programming timing, see Figure 8-8
and Figure 8-9.
Exiting Program/Verify mode is done by no longer
driving MCLR to VIL. See Figure 8-8 and Figure 8-9.
Note:
To enter LVP mode, the LSB of the Least
Significant nibble must be shifted in first.
This differs from entering the key
sequence on other parts.
VDD – FIRST ENTRY MODE
To enter Program/Verify mode via the VDD-first method
the following sequence must be followed:
1.
2.
3.
Hold ICSPCLK and ICSPDAT low.
Raise the voltage on VDD from 0V to the desired
operating voltage.
Raise the voltage on MCLR from VDD or below
to VIHH.
The VDD-first method is useful when programming the
device when VDD is already applied, for it is not
necessary to disconnect VDD to enter Program/Verify
mode. See the timing diagram in Figure 8-1.
DS41573C-page 14
Advance Information
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PIC12(L)F1501/PIC16(L)F150X
4.3
Program/Verify Commands
The devices implement 10 programming commands;
each six bits in length. The commands are summarized
in Table 4-1.
Commands that have data associated with them are
specified to have a minimum delay of TDLY between the
command and the data. After this delay 16 clocks are
required to either clock in or clock out the 14-bit data
word. The first clock is for the Start bit and the last clock
is for the Stop bit.
TABLE 4-1:
COMMAND MAPPING
Mapping
Command
Data/Note
Binary (MSb … LSb)
Hex
Load Configuration
x
0
0
0
0
0
00h
0, data (14), 0
Load Data For Program Memory
x
0
0
0
1
0
02h
0, data (14), 0
Read Data From Program Memory
x
0
0
1
0
0
04h
0, data (14), 0
Increment Address
x
0
0
1
1
0
06h
—
Reset Address
x
1
0
1
1
0
16h
—
Begin Internally Timed Programming
x
0
1
0
0
0
08h
—
Begin Externally Timed Programming
x
1
1
0
0
0
18h
—
End Externally Timed Programming
x
0
1
0
1
0
0Ah
—
Bulk Erase Program Memory
x
0
1
0
0
1
09h
Internally Timed
Row Erase Program Memory
x
1
0
0
0
1
11h
Internally Timed
4.3.1
LOAD CONFIGURATION
The Load Configuration command is used to access
the configuration memory (user ID locations,
Configuration Words, Calibration Words). The Load
Configuration command sets the address to 8000h and
loads the data latches with one word of data (see
Figure 4-1).
Note:
The only way to get back to the program memory
(address 0) is to exit Program/Verify mode or issue the
Reset Address command after the configuration memory
has been accessed by the Load Configuration command.
After issuing the Load Configuration command, use the
Increment Address command until the proper address
to be programmed is reached. The address is then programmed by issuing either the Begin Internally Timed
Programming or Begin Externally Timed Programming
command.
FIGURE 4-1:
Externally timed writes are not supported
for Configuration and Calibration bits. Any
externally timed write to the Configuration
or Calibration Word will have no effect on
the targeted word.
LOAD CONFIGURATION
1
2
3
4
5
2
1
6
15
16
TDLY
ICSPCLK
ICSPDAT
0
 2011 Microchip Technology Inc.
0
0
0
0
X
0
Advance Information
LSb
MSb 0
DS41573C-page 15
PIC12(L)F1501/PIC16(L)F150X
4.3.2
LOAD DATA FOR PROGRAM
MEMORY
The Load Data for Program Memory command is used
to load one 14-bit word into the data latches. The word
programs into program memory after the Begin
Internally Timed Programming or Begin Externally
Timed Programming command is issued (see
Figure 4-2).
FIGURE 4-2:
LOAD DATA FOR PROGRAM MEMORY
1
2
4
3
5
2
1
6
16
15
TDLY
ICSPCLK
0
ICSPDAT
4.3.3
1
0
0
0
0
X
LSb
MSb 0
READ DATA FROM PROGRAM
MEMORY
The Read Data from Program Memory command will
transmit data bits out of the program memory map
currently accessed, starting with the second rising edge
of the clock input. The ICSPDAT pin will go into Output
mode on the first falling clock edge, and it will revert to
Input mode (high-impedance) after the 16th falling edge
of the clock. If the program memory is code-protected
(CP), the data will be read as zeros (see Figure 4-3).
FIGURE 4-3:
READ DATA FROM PROGRAM MEMORY
1
2
3
4
5
6
1
2
15
16
TDLY
ICSPCLK
ICSPDAT
(from Programmer)
0
0
1
0
0
ICSPDAT
(from device)
X
x
Input
DS41573C-page 16
Advance Information
LSb
MSb
Output
Input
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
4.3.4
INCREMENT ADDRESS
The address is incremented when this command is
received. It is not possible to decrement the address.
To reset this counter, the user must use the Reset
Address command or exit Program/Verify mode and reenter it. If the address is incremented from address
7FFFh, it will wrap-around to location 0000h. If the
address is incremented from FFFFh, it will wrap-around
to location 8000h.
FIGURE 4-4:
INCREMENT ADDRESS
Next Command
1
2
4
3
2
1
6
5
3
TDLY
ICSPCLK
0
ICSPDAT
1
1
0
0
X
X
Address
4.3.5
X
X
Address + 1
RESET ADDRESS
The Reset Address command will reset the address to
0000h, regardless of the current value. The address is
used in program memory or the configuration memory.
FIGURE 4-5:
RESET ADDRESS
Next Command
1
2
4
3
5
6
2
1
3
TDLY
ICSPCLK
ICSPDAT
0
Address
 2011 Microchip Technology Inc.
1
1
0
1
X
N
Advance Information
X
X
X
0000h
DS41573C-page 17
PIC12(L)F1501/PIC16(L)F150X
4.3.6
BEGIN INTERNALLY TIMED
PROGRAMMING
A Load Configuration or Load Data for Program
Memory command must be given before every Begin
Programming command. Programming of the
addressed memory will begin after this command is
received. An internal timing mechanism executes the
write. The user must allow for the program cycle time,
TPINT, for the programming to complete.
The End Externally Timed Programming command is
not needed when the Begin Internally Timed
Programming is used to start the programming.
The program memory address that is being
programmed is not erased prior to being programmed.
FIGURE 4-6:
BEGIN INTERNALLY TIMED PROGRAMMING
1
2
5
4
3
Next Command
1
2
3
6
TPINT
ICSPCLK
ICSPDAT
4.3.7
0
0
0
0
1
X
X
X
X
BEGIN EXTERNALLY TIMED
PROGRAMMING
A Load Configuration or Load Data for Program
Memory command must be given before every Begin
Programming command. Programming of the
addressed memory will begin after this command is
received. To complete the programming the End
Externally Timed Programming command must be sent
in the specified time window defined by TPEXT (see
Figure 4-7).
Externally timed writes are not supported for
Configuration and Calibration bits. Any externally timed
write to the Configuration or Calibration Word will have
no effect on the targeted word.
FIGURE 4-7:
BEGIN EXTERNALLY TIMED PROGRAMMING
End Externally Timed Programming
Command
1
2
4
3
5
6
1
2
3
TPEXT
ICSPCLK
ICSPDAT
DS41573C-page 18
0
0
0
1
1
X
Advance Information
0
1
0
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
4.3.8
END EXTERNALLY TIMED
PROGRAMMING
This command is required after a Begin Externally
Timed Programming command is given. This
command must be sent within the time window
specified by TPEXT after the Begin Externally Timed
Programming command is sent.
After sending the End Externally Timed Programming
command, an additional delay (TDIS) is required before
sending the next command. This delay is longer than
the delay ordinarily required between other commands
(see Figure 4-8).
FIGURE 4-8:
END EXTERNALLY TIMED PROGRAMMING
1
2
5
4
3
Next Command
2
1
3
6
TDIS
ICSPCLK
4.3.9
1
0
ICSPDAT
0
1
1
BULK ERASE PROGRAM MEMORY
X
X
X
X
After receiving the Bulk Erase Program Memory
command the erase will not complete until the time
interval, TERAB, has expired.
The Bulk Erase Program Memory command performs
two different functions dependent on the current state
of the address.
Note:
Address 0000h-7FFFh:
Program Memory is erased
The code protection Configuration bit
(CP) has no effect on the Bulk Erase
Program Memory command.
Configuration Words are erased
Address 8000h-8008h:
Program Memory is erased
Configuration Words are erased
User ID Locations are erased
A Bulk Erase Program Memory command should not
be issued when the address is greater than 8008h.
FIGURE 4-9:
BULK ERASE PROGRAM MEMORY
1
2
3
4
5
Next Command
2
1
3
6
TERAB
ICSPCLK
ICSPDAT
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1
0
0
1
0
X
Advance Information
X
X
X
DS41573C-page 19
PIC12(L)F1501/PIC16(L)F150X
4.3.10
ROW ERASE PROGRAM MEMORY
The Row Erase Program Memory command will erase
an individual row. Refer to Table 4-2 for row sizes of
specific devices and the PC bits used to address them.
If the program memory is code-protected, the Row
Erase Program Memory command will be ignored.
When the address is 8000h-8008h, the Row Erase
Program Memory command will only erase the user ID
locations, regardless of the setting of the CP
Configuration bit.
After receiving the Row Erase Program Memory
command, the erase will not complete until the time
interval, TERAR, has expired.
TABLE 4-2:
PROGRAMMING ROW SIZE AND LATCHES
Devices
PC
Row Size
Number of Latches
PIC12(L)F1501
<15:5>
32
32
PIC16(L)F1503/1507
<15:4>
16
16
PIC16(L)F1508/1509
<15:5>
32
32
FIGURE 4-10:
ROW ERASE PROGRAM MEMORY
1
2
5
4
3
Next Command
1
2
3
6
TERAR
ICSPCLK
ICSPDAT
DS41573C-page 20
1
0
0
0
1
X
Advance Information
X
X
X
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
5.0
PROGRAMMING ALGORITHMS
The devices use internal latches to temporarily store
the 14-bit words used for programming. Refer to
Table 4-2 for specific latch information. The data
latches allow the user to write the program words with
a single Begin Externally Timed Programming or Begin
Internally Timed Programming command. The Load
Program Data or the Load Configuration command is
used to load a single data latch. The data latch will hold
the data until the Begin Externally Timed Programming
or Begin Internally Timed Programming command is
given.
The data latches are aligned with the LSbs of the
address. The PC’s address at the time the Begin
Externally Timed Programming or Begin Internally
Timed Programming command is given will determine
which location(s) in memory are written. Writes cannot
cross the physical boundary. For example, with the
PIC16F1507, attempting to write from address 0002h0009h will result in data being written to 0008h-000Fh.
If more than the maximum number of data latches are
written without a Begin Externally Timed Programming
or Begin Internally Timed Programming command, the
data in the data latches will be overwritten. The
following figures show the recommended flowcharts for
programming.
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Advance Information
DS41573C-page 21
PIC12(L)F1501/PIC16(L)F150X
FIGURE 5-1:
DEVICE PROGRAM/VERIFY FLOWCHART
Start
Enter
Programming Mode
Bulk Erase
Device
Write Program
Memory(1)
Write User IDs
Verify Program
Memory
Verify User IDs
Write Configuration
Words(2)
Verify Configuration
Words
Exit Programming
Mode
Done
Note 1:
See Figure 5-2.
2:
See Figure 5-5.
DS41573C-page 22
Advance Information
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
FIGURE 5-2:
PROGRAM MEMORY FLOWCHART
Start
Bulk Erase
Program
Memory(1, 2)
Program Cycle(3)
Read Data
from
Program Memory
Data Correct?
No
Report
Programming
Failure
Yes
Increment
Address
Command
No
All Locations
Done?
Yes
Done
Note 1:
This step is optional if the device has already been erased or has not been previously programmed.
2:
If the device is code-protected or must be completely erased, then Bulk Erase the device per Figure 5-6.
3:
See Figure 5-3 or Figure 5-4.
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Advance Information
DS41573C-page 23
PIC12(L)F1501/PIC16(L)F150X
FIGURE 5-3:
ONE-WORD PROGRAM CYCLE
Program Cycle
Load Data
for
Program Memory
Begin
Programming
Command
(Internally timed)
Begin
Programming
Command
(Externally timed)(1)
Wait TPINT
Wait TPEXT
End
Programming
Command
Wait TDIS
Note 1:
Externally timed writes are not supported for Configuration and Calibration bits.
DS41573C-page 24
Advance Information
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PIC12(L)F1501/PIC16(L)F150X
FIGURE 5-4:
MULTIPLE-WORD PROGRAM CYCLE
Program Cycle
Load Data
for
Program Memory
Latch 1
Increment
Address
Command
Load Data
for
Program Memory
Latch 2
Increment
Address
Command
Load Data
for
Program Memory
Latch n
Begin
Programming
Command
(Internally timed)
Begin
Programming
Command
(Externally timed)
Wait TPINT
Wait TPEXT
End
Programming
Command
Wait TDIS
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Advance Information
DS41573C-page 25
PIC12(L)F1501/PIC16(L)F150X
FIGURE 5-5:
CONFIGURATION MEMORY PROGRAM FLOWCHART
Start
Load
Configuration
Bulk Erase
Program
Memory(1)
One-word
Program Cycle(2)
(User ID)
Read Data
From Program
Memory Command
Data Correct?
No
Report
Programming
Failure
Yes
Increment
Address
Command
No
Address =
8004h?
Yes
Increment
Address
Command
Increment
Address
Command
Increment
Address
Command
One-word
Program Cycle(2)
(Config. Word 1)
Read Data
From Program
Memory Command
Data Correct?
No
Report
Programming
Failure
Yes
Increment
Address
Command
One-word
Program Cycle(2)
(Config. Word 2)
Read Data
From Program
Memory Command
Data Correct?
No
Report
Programming
Failure
Yes
Note
1:
This step is optional if the device is erased or not previously programmed.
2:
See Figure 5-3.
DS41573C-page 26
Advance Information
Done
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
FIGURE 5-6:
ERASE FLOWCHART
Start
Load Configuration
Bulk Erase
Program Memory
Done
Note:
This sequence does not erase the Calibration Words.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 27
PIC12(L)F1501/PIC16(L)F150X
6.0
CODE PROTECTION
7.0
Code protection is controlled using the CP bit in
Configuration Word 1. When code protection is
enabled, all program memory locations (0000h-7FFFh)
read as ‘0’. Further programming is disabled for the
program memory (0000h-7FFFh).
The user ID locations and Configuration Words can be
programmed and read out regardless of the code
protection settings.
6.1
Program Memory
Code protection is enabled by programming the CP bit
in Configuration Word 1 register to ‘0’.
The only way to disable code protection is to use the
Bulk Erase Program Memory command.
HEX FILE USAGE
In the hex file there are two bytes per program word
stored in the Intel® INHX32 hex format. Data is stored
LSB first, MSB second. Because there are two bytes
per word, the addresses in the hex file are 2x the
address in program memory. (Example: Configuration
Word 1 is stored at 8007h on the PIC16(L)F1507. In the
hex file this will be referenced as 1000Eh-1000Fh).
7.1
Configuration Word
To allow portability of code, it is strongly recommended
that the programmer is able to read the Configuration
Words and user ID locations from the hex file. If the
Configuration Words information was not present in the
hex file, a simple warning message may be issued.
Similarly, while saving a hex file, Configuration Words
and user ID information should be included.
7.2
Device ID and Revision
If a device ID is present in the hex file at 1000Ch1000Dh (8006h on the part), the programmer should
verify the device ID (excluding the revision) against the
value read from the part. On a mismatch condition the
programmer should generate a warning message.
DS41573C-page 28
Advance Information
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PIC12(L)F1501/PIC16(L)F150X
7.3
Checksum Computation
7.3.1
The checksum is calculated by two different methods
dependent on the setting of the CP Configuration bit.
TABLE 7-1:
CONFIGURATION WORD
MASK VALUES
Config. Word
1 Mask
Config. Word
2 Mask
PIC12(L)F1501
0EFBh
2E03h
PIC16(L)F1503
0EFBh
2E03h
PIC16(L)F1507
0EFBh
2E03h
PIC16(L)F1508
3EFFh
3E03h
PIC16(L)F1509
3EFFh
3E03h
Device
EXAMPLE 7-1:
PIC16F1507
PROGRAM CODE PROTECTION
DISABLED
With the program code protection disabled, the
checksum is computed by reading the contents of the
program memory locations and adding up the program
memory data starting at address 0000h, up to the
maximum user addressable location. Any Carry bit
exceeding 16 bits are ignored. Additionally, the relevant
bits of the Configuration Words are added to the
checksum. All unimplemented Configuration bits are
masked to ‘0’.
CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION DISABLED
(CP = 1), PIC16F1507, BLANK DEVICE
Sum of Memory addresses 0000h-07FFh
F800h(1)
Configuration Word 1
3FFFh(2)
Configuration Word 1 mask
0EFBh(3)
Configuration Word 2
3FFFh(4)
Configuration Word 2 mask
2E03h(5)
Checksum
= F800h + (3FFFh and 0EFBh) + (3FFFh and 2E03h)(6)
= F800h + 0EFBh + 2E03h
= 34FEh
Note 1:
2:
3:
4:
5:
6:
This value is obtained by taking the total number of program memory locations (0x000 to 0x7FFh which
is 800h) and multiplying it by the blank memory value of 0x3FFF to get the sum of 1FF F800h. Then,
truncate to 16 bits, thus having a final value of F800h.
This value is obtained by making all bits of the Configuration Word 1 a ‘1’, then converting it to hex, thus
having a value of 3FFFh.
This value is obtained by making all used bits of the Configuration Word 1 a ‘1’, then converting it to hex,
thus having a value of 0EFBh.
This value is obtained by making all bits of the Configuration Word 2 a ‘1’, then converting it to hex, thus
having a value of 3FFFh.
This value is obtained by making all used bits of the Configuration Word 2 a ‘1’, then converting it to hex,
thus having a value of 2E03h.
This value is obtained by ANDing the Configuration Word value with the Configuration Word Mask Value
and adding it to the sum of memory addresses: (3FFFh and 0EFBh) + (3FFFh and 2E03h) + F800h =
1 34FEh. Then, truncate to 16 bits, thus having a final value of 34FEh.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 29
PIC12(L)F1501/PIC16(L)F150X
EXAMPLE 7-2:
PIC16LF1507
CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION DISABLED
(CP = 1), PIC16LF1507, 00AAh AT FIRST AND LAST ADDRESS
Sum of Memory addresses 0000h-07FFh
7956h(1)
Configuration Word 1
3FFFh(2)
Configuration Word 1 mask
0EFBh(3)
Configuration Word 2
3FFFh(4)
Configuration Word 2 mask
2E03h(5)
Checksum = 7956h + (3FFFh and 0EFBh) + (3FFFh and 2E03h)(6)
= 7956h + 0EFBh + 2E03h
= B654h
Note 1:
2:
3:
4:
5:
6:
This value is obtained by taking the total number of program memory locations (0x000 to 0x7FFh which
is 800h) subtracting 2h which yields 7FEh, then multiplying it by the blank memory value of 0x3FFF to
get the sum of 1FF 7802h. Then, truncate to 16 bits the value of 7802h. Now add 00AAh (00AAh +
00AAh) to 7802h to get the final value of B654h.
This value is obtained by making all bits of the Configuration Word 1 a ‘1’, then converting it to hex, thus
having a value of 3FFFh.
This value is obtained by making all used bits of the Configuration Word 1 a ‘1’, then converting it to hex,
thus having a value of 0EFBh.
This value is obtained by making all bits of the Configuration Word 2 a ‘1’, then converting it to hex, thus
having a value of 3FFFh.
This value is obtained by making all used bits of the Configuration Word 2 a ‘1’, then converting it to hex,
thus having a value of 2E03h.
This value is obtained by ANDing the Configuration Word value with the Configuration Word Mask Value
and adding it to the sum of memory addresses: (3FFFh and 0EFBh) + (3FFFh and 2E03h) + 7956h =
B654h. Then, truncate to 16 bits, thus having a final value of B654h.
DS41573C-page 30
Advance Information
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
7.3.2
PROGRAM CODE PROTECTION
ENABLED
With the program code protection enabled, the
checksum is computed in the following manner: The
Least Significant nibble of each user ID is used to
create a 16-bit value. The masked value of user ID
location 8000h is the Most Significant nibble. This sum
of user IDs is summed with the Configuration Words (all
unimplemented Configuration bits are masked to ‘0’).
EXAMPLE 7-3:
PIC16F1507
CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION ENABLED
(CP = 0), PIC16F1507, BLANK DEVICE
Configuration Word 1
3F7Fh(1)
Configuration Word 1 mask
0E7Bh(2)
Configuration Word 2
3FFFh(3)
Configuration Word 2 mask
2E03h(4)
User ID (8000h)
0006h(5)
User ID (8001h)
0007h(5)
User ID (8002h)
0001h(5)
User ID (8003h)
0002h(5)
Sum of User IDs = (0006h and 000Fh) << 12 + (0007h and 000Fh) << 8 +
(0001h and 000Fh) << 4 + (0002h and 000Fh)(6)
= 6000h + 0700h + 0010h + 0002h
= 6712h
Checksum
= (3F7Fh and 0E7Bh) + (3FFFh and 2E03h) + Sum of User IDs(7)
= 0E7Bh +2E03h + 6712h
= A390h
Note 1:
2:
3:
4:
5:
6:
7:
This value is obtained by making all bits of the Configuration Word 1 a ‘1’, but the code-protect bit is ‘0’
(thus, enabled), then converting it to hex, thus having a value of 3F7Fh.
This value is obtained by making all used bits of the Configuration Word 1 a ‘1’, but the code-protect bit
is ‘0’ (thus, enabled), then converting it to hex, thus having a value of 0E7Bh.
This value is obtained by making all bits of the Configuration Word 2 a ‘1’, then converting it to hex, thus
having a value of 3FFFh.
This value is obtained by making all used bits of the Configuration Word 2 a ‘1’, then converting it to hex,
thus having a value of 2E03h.
These values are picked at random for this example; they could be any 16-bit value.
In order to calculate the sum of user IDs, take the 16-bit value of the first user ID location (0006h), AND
the address to (000Fh), thus masking the MSB. This gives you the value 0006h, then shift left 12 bits,
giving you 6000h. Do the same procedure for the 16-bit value of the second user ID location (0007h),
except shift left 8 bits. Also, do the same for the third user ID location (0001h), except shift left 4 bits. For
the fourth user ID location do not shift. Finally, add up all four user ID values to get the final sum of user
IDs of 6712h.
This value is obtained by ANDing the Configuration Word value with the Configuration Word Mask Value
and adding it to the sum of user IDs: (3F7Fh AND 0E7Bh) + (3FFFh AND 2E03h) + 6712h = A390h.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 31
PIC12(L)F1501/PIC16(L)F150X
EXAMPLE 7-4:
PIC16LF1507
CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION ENABLED
(CP = 0), PIC16LF1507, 00AAh AT FIRST AND LAST ADDRESS
Configuration Word 1
3F7Fh(1)
Configuration Word 1 mask
0E7Bh(2)
Configuration Word 2
3FFFh(3)
Configuration Word 2 mask
2E03h(4)
User ID (8000h)
000Eh(5)
User ID (8001h)
0008h(5)
User ID (8002h)
0005h(5)
User ID (8003h)
0008h(5)
Sum of User IDs
= (000Eh and 000Fh) << 12 + (0008h and 000Fh) << 8 +
(0005h and 000Fh) << 4 + (0008h and 000Fh)(6)
= E000h + 0800h + 0050h + 0008h
= E858h
Checksum
= (3F7Fh and 0E7Bh) + (3FFFh and 2E03h) + Sum of User IDs(7)
= 0E7Bh +2E03h + E858h
= 24D6h
Note 1:
2:
3:
4:
5:
6:
7:
This value is obtained by making all bits of the Configuration Word 1 a ‘1’, but the code-protect bit is ‘0’
(thus, enabled), then converting it to hex, thus having a value of 3F7Fh.
This value is obtained by making all used bits of the Configuration Word 1 a ‘1’, but the code-protect bit
is ‘0’ (thus, enabled), then converting it to hex, thus having a value of 0E7Bh.
This value is obtained by making all bits of the Configuration Word 2 a ‘1’, then converting it to hex, thus
having a value of 3FFFh.
This value is obtained by making all used bits of the Configuration Word 2 a ‘1’, then converting it to hex,
thus having a value of 2E03h.
These values are picked at random for this example; they could be any 16-bit value.
In order to calculate the sum of user IDs, take the 16-bit value of the first user ID location (000Eh), AND
the address to (000Fh), thus masking the MSB. This gives you the value 000Eh, then shift left 12 bits,
giving you E000h. Do the same procedure for the 16-bit value of the second user ID location (0008h),
except shift left 8 bits. Also, do the same for the third user ID location (0005h), except shift left 4 bits. For
the fourth user ID location do not shift. Finally, add up all four user ID values to get the final sum of user
IDs of E858h.
This value is obtained by ANDing the Configuration Word value with the Configuration Word Mask Value
and adding it to the sum of user IDs: (3F7Fh AND 0E7Bh) + (3FFFh AND 2E03h) + E858h = 24D6h.
DS41573C-page 32
Advance Information
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
8.0
ELECTRICAL SPECIFICATIONS
Refer to the device specific data sheet for absolute
maximum ratings.
TABLE 8-1:
AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY MODE
Standard Operating Conditions
Production tested at 25°C
AC/DC CHARACTERISTICS
Sym.
Characteristics
Min.
Typ.
Max.
Units Conditions/Comments
Supply Voltages and Currents
VDD
VDD
Read/Write and Row Erase
operations
Bulk Erase operations
IDDI
Current on VDD, Idle
IDDP
Current on VDD, Programming
VDD min.
—
VDD max.
V
2.7
—
VDD max.
V
—
—
1.0
mA
—
—
3.0
mA
VPP
IPP
Current on MCLR/VPP
—
—
600
A
VIHH
High voltage on MCLR/VPP for
Program/Verify mode entry
8.0
—
9.0
V
TVHHR
MCLR rise time (VIL to VIHH) for
Program/Verify mode entry
—
—
1.0
s
I/O pins
VIH
(ICSPCLK, ICSPDAT, MCLR/VPP) input high level
0.8 VDD
—
—
V
VIL
(ICSPCLK, ICSPDAT, MCLR/VPP) input low level
ICSPDAT output high level
—
VDD-0.7
VDD-0.7
VDD-0.7
—
0.2 VDD
V
—
—
V
—
—
VSS+0.6
VSS+0.6
VSS+0.6
V
—
ns
—
s
—
—
—
—
ns
ns
ns
ns
80
ns
80
ns
80
ns
—
s
5
2.5
ms
ms
2.5
5
2.1
ms
ms
ms
VOH
ICSPDAT output low level
VOL
TENTS
TENTH
TCKL
TCKH
TDS
TDH
TCO
TLZD
THZD
TDLY
TERAB
TERAR
TPINT
Programming Mode Entry and Exit
Programing mode entry setup time: ICSPCLK,
100
—
ICSPDAT setup time before VDD or MCLR
Programing mode entry hold time: ICSPCLK,
250
—
ICSPDAT hold time after VDD or MCLR
Serial Program/Verify
Clock Low Pulse Width
100
—
Clock High Pulse Width
100
—
Data in setup time before clock
100
—
Data in hold time after clock
100
—
Clock to data out valid (during a
0
—
Read Data command)
Clock to data low-impedance (during a
0
—
Read Data command)
Clock to data high-impedance (during a
0
—
Read Data command)
Data input not driven to next clock input (delay
required between command/data or command/
1.0
—
command)
Bulk Erase cycle time
—
—
Row Erase cycle time
—
—
Internally timed programming operation time
TPEXT
—
—
1.0
—
—
—
Externally timed programming pulse
Time delay from program to compare
TDIS
300
—
—
(HV discharge time)
Time delay when exiting Program/Verify mode
1
—
—
TEXIT
Note 1: Externally timed writes are not supported for Configuration and Calibration bits.
 2011 Microchip Technology Inc.
Advance Information
IOH = 3.5 mA, VDD = 5V
IOH = 3 mA, VDD = 3.3V
IOH = 2 mA, VDD = 1.8V
IOH = 8 mA, VDD = 5V
IOH = 6 mA, VDD = 3.3V
IOH = 3 mA, VDD = 1.8V
Program memory
Configuration Words
Note 1
s
s
DS41573C-page 33
PIC12(L)F1501/PIC16(L)F150X
8.1
AC Timing Diagrams
FIGURE 8-1:
FIGURE 8-4:
PROGRAMMING MODE
ENTRY – VDD FIRST
TENTS
PROGRAMMING MODE
EXIT – VDD LAST
TEXIT
VIHH
TENTH
VPP
VIL
VIHH
VPP
VDD
VIL
ICSPDAT
VDD
ICSPCLK
ICSPDAT
ICSPCLK
FIGURE 8-2:
PROGRAMMING MODE
ENTRY – VPP FIRST
TENTS
TENTH
VIHH
VPP
VIL
VDD
ICSPDAT
ICSPCLK
FIGURE 8-3:
PROGRAMMING MODE
EXIT – VPP LAST
TEXIT
VIHH
VPP
VIL
VDD
ICSPDAT
ICSPCLK
DS41573C-page 34
Advance Information
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
FIGURE 8-5:
CLOCK AND DATA
TIMING
TCKL
TCKH
ICSPCLK
TDS TDH
ICSPDAT
as
input
TCO
ICSPDAT
as
output
TLZD
ICSPDAT
from input
to output
THZD
ICSPDAT
from output
to input
FIGURE 8-6:
WRITE COMMAND-PAYLOAD TIMING
TDLY
1
2
3
4
5
X
X
X
X
X
1
6
2
15
16
ICSPCLK
ICSPDAT
0 LSb
X
0
Next
Command
Payload
Command
FIGURE 8-7:
MSb
READ COMMAND-PAYLOAD TIMING
TDLY
1
2
3
4
5
X
ICSPDAT
(from Programmer)
X
X
X
X
6
2
1
15
16
ICSPCLK
X
x
ICSPDAT
(from Device)
Command
 2011 Microchip Technology Inc.
Advance Information
LSb
MSb
Payload
0
Next
Command
DS41573C-page 35
PIC12(L)F1501/PIC16(L)F150X
FIGURE 8-8:
LVP ENTRY (POWERED)
VDD
MCLR
TENTS
TENTH
33 clocks
TCKH
TCKL
ICSPCLK
TDH
TDS
LSb of Pattern
0
ICSPDAT
FIGURE 8-9:
MSb of Pattern
1
2
...
31
LVP ENTRY (POWERING UP)
VDD
MCLR
TENTH
33 Clocks
TCKH
TCKL
ICSPCLK
TDH
TDS
LSb of Pattern
0
ICSPDAT
Note 1:
1
2
...
MSb of Pattern
31
Sequence matching can start with no edge on MCLR first.
DS41573C-page 36
Advance Information
 2011 Microchip Technology Inc.
PIC12(L)F1501/PIC16(L)F150X
APPENDIX A:
REVISION HISTORY
Revision A (04/2011)
Original release of this document.
Revision B (05/2011)
Updated Figures 2-1 and 2-2; Added Note 3 to Register
3-2; Revised Register 3-3; Other minor corrections.
Revision C (08/2011)
Added PIC12(L)F1501 and PIC16(L)F1503/1508/1509
devices; Other minor corrections.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 37
PIC12(L)F1501/PIC16(L)F150X
NOTES:
DS41573C-page 38
Advance Information
 2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-540-5
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2011 Microchip Technology Inc.
Advance Information
DS41573C-page 39
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DS41573C-page 40
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Advance Information
08/02/11
 2011 Microchip Technology Inc.