Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot First QUARTER 2008 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 11. Technology List 10 12. Failure Rate Calculations 11 13. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: February 20, 2008 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 3 FITS (3,235K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 6 FITS (1,327K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 924 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 843K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 847 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 4 LAST 4Q 0 0 632 1,040 0 0 632 1,040 0 0 259 436 0 0 259 436 321,664 537,472 40 43 0 0 71 39 ASIC 4 LAST 4Q 0 0 2,610 12,170 0 1 2,410 10,910 0 2 1,633 6,165 0 0 331 1,372 1,122,136 4,626,140 92 80 0 0 9 11 MEMORY 4 LAST 4Q 0 0 2,200 4,860 0 0 1,600 2,500 0 0 600 1,499 0 0 600 1,499 796,800 1,780,448 57 79 0 0 20 7 MCU 4 LAST 4Q 0 0 1,042 15,968 0 0 242 1,263 0 0 242 1,263 0 0 122 961 220,400 1,817,840 4 67 0 0 1,056 8 RFA 4 LAST 4Q 0 0 1,238 5,323 0 0 1,238 5,323 0 0 1,238 5,323 0 0 311 2,923 774,500 4,199,000 190 124 0 0 6 2 ATMEL 4 LAST 4Q 0 0 7,722 42,139 0 1 6,122 23,814 0 2 3,972 15,384 0 0 1,623 7,889 3,235,500 14,008,340 96 88 0 0 3 3 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 154 240,872 4 0 1,004 160 160,000 117 0 49 157 157,000 52 1,049 1,203,500 99 0 0 113 8 0 40,000 21 0 1,090 0 0 22,500 3 0 11,874 77 154 0 0 77 154 77,000 154,000 117 117 0 0 102 51 0 154 0 154 154,000 129 0 46 80 0 80 0 80 80,000 206 0 56 0 229 0 229 0 153 191,000 135 0 36 77 785 0 0 77 785 0 0 77 785 0 0 77 708 77,000 746,500 117 110 0 0 102 11 0 462 0 0 0 0 0 0 22,176 3 0 15,940 0 154 0 154 0 154 0 77 115,500 484 0 462 0 462 0 462 0 308 385,000 227 0 0 16 10 0 1,200 0 400 0 400 0 400 438,400 63 0 33 0 539 0 539 0 539 269,500 117 0 1,386 0 1,386 0 1,001 0 0 565,180 117 0 0 29 14 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 815 0 276 0 276 0 4 LAST 4Q 0 160 0 160 0 160 0 0 157 0 157 0 157 0 0 1,206 0 1,206 0 1,206 0 4 LAST 4Q 0 80 0 80 0 80 0 4 LAST 4Q 0 122 0 122 0 122 SCMOS3 4 LAST 4Q 0 0 77 154 0 0 77 154 0 0 SIGE1 4 LAST 4Q 0 154 0 154 4 LAST 4Q 0 80 0 4 LAST 4Q 0 229 BICMOS2 4 LAST 4Q 0 0 AT2F 4 LAST 4Q Z92 UNI3 UHF SMD SCMOS2 SIGE2 BCDMOS 75K 63K 58.8K 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH 58K 57.5K 57K 56.9K 56.8K 56K 55K 46K 44K 39K 35K 34K 19K ATMEL QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 77 409,808 143 0 154 629,984 116 0 0 16 13 228,176 117 1,835 0 0 998,476 113 0 0 34 28 0 357 0 200 278,500 49 0 67 100 0 100 0 100 100,000 48 100 0 100 0 100 100,000 48 0 0 189 189 0 815 0 584 0 45 353,308 103 0 1,739 0 815 0 122 631,124 89 0 0 25 16 154 0 154 0 77 0 77 89,936 23 0 2,476 0 2,476 1 1,149 0 431 1,012,936 69 0 0 448 29 4 LAST 4Q 0 0 308 1,302 0 0 308 1,302 0 0 77 1,071 0 0 77,308 574,308 117 117 0 0 101 14 4 LAST 4Q 0 224 0 224 0 82 0 82 105,856 23 0 1,171 0 1,171 0 629 0 398 604,556 53 0 0 381 29 4 LAST 4Q 0 308 0 308 0 77 0 77 115,808 48 0 1,611 0 1,611 0 308 0 308 526,904 34 0 0 163 51 4 LAST 4Q 0 600 0 200 0 200 0 200 219,200 11 0 600 0 200 0 200 0 200 219,200 11 0 0 368 368 4 LAST 4Q 0 2,252 0 1,452 0 452 0 377 620,900 37 0 19,786 0 5,220 0 2,140 0 1,958 3,265,608 61 0 0 40 5 4 LAST 4Q 0 300 0 100 0 100 0 100 109,600 187 0 1,160 0 400 0 400 0 400 436,480 187 0 0 45 11 4 LAST 4Q 0 300 0 100 0 100 0 100 109,600 42 0 900 0 300 0 298 0 298 327,136 42 0 0 201 67 4 LAST 4Q 0 7,722 0 6,122 0 3,972 0 1,623 3,235,500 96 0 42,139 1 23,814 2 15,384 0 7,889 14,008,340 88 0 0 3 3 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 896 0 896 0 665 0 0 1,248 0 1,204 0 1,050 4 LAST 4Q 0 461 0 461 0 454 0 2,317 1 2,317 1 0 357 0 357 4 LAST 4Q 0 100 0 0 100 0 4 LAST 4Q 0 815 0 1,893 4 LAST 4Q 0 4 LAST 4Q * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS ASIC 4 LAST 4Q 0 0 77 616 0 0 77 616 0 0 77 616 77,000 616,000 117 117 102 13 MEMORY 4 0 731 0 731 0 731 731,000 11 LAST 4Q 0 1,501 0 1,501 0 1,501 1,501,000 117 117 MCU 4 LAST 4Q 0 0 593 2,020 0 0 593 1,866 0 0 445 1,564 519,000 1,740,872 117 117 15 4 ATMEL 4 LAST 4Q 0 0 1,401 4,714 0 0 1,401 4,560 0 0 1,253 4,258 1,327,000 4,434,872 117 117 6 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours Device-Hours AF FITS REJ SS REJ SS REJ SS 4 LAST 4Q 0 231 0 231 0 154 192,500 117 41 4 LAST 4Q 0 308 0 308 0 308 308,000 117 25 4 LAST 4Q 0 308 0 308 0 308 308,000 117 25 39K 4 LAST 4Q 0 0 154 231 0 0 154 231 0 0 154 231 154,000 231,000 117 117 51 34 35K 4 LAST 4Q 0 0 1,016 2,943 0 0 1,016 2,789 0 0 868 2,564 942,000 2,702,372 117 117 8 3 34K 4 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 77,000 308,000 117 117 102 25 56.8K 4 LAST 4Q 0 77 0 77 0 77 77,000 117 102 19K 4 LAST 4Q 0 0 77 231 0 0 77 231 0 0 77 231 77,000 231,000 117 117 102 34 58K 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 117 117 102 102 ATMEL 4 LAST 4Q 0 0 1,401 4,714 0 0 1,401 4,560 0 0 1,253 4,258 1,327,000 4,434,872 117 117 6 2 Z92 63 K 56K RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles % Defective REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 231 0 231 0 231 0 0 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 77 0.00% 4 LAST 4Q 0 231 0 231 0 231 0 0 0.00% MLF / QFN 4 LAST 4Q 0 0 154 1,181 0 0 147 1,174 0 0 154 1,181 0 0 147 690 0.00% 0.00% QFP 4 LAST 4Q 0 0 385 1,125 0 0 385 1,125 0 0 385 1,125 0 0 365 859 0.00% 0.00% PDIP 4 LAST 4Q 0 0 77 385 0 0 77 385 0 0 77 385 0 0 77 308 0.00% 0.00% PLCC 4 LAST 4Q 0 0 77 539 0 0 77 539 0 0 77 539 0 0 77 385 0.00% 0.00% SOIC 4 LAST 4Q 0 0 154 539 0 0 154 539 0 0 154 539 0 0 154 385 0.00% 0.00% TSOP / VSOP 4 LAST 4Q 0 0 77 231 0 0 77 231 0 0 77 231 0 0 77 231 0.00% 0.00% ATMEL 4 LAST 4Q 0 0 924 4,539 0 0 917 4,532 0 0 924 4,539 0 0 897 2,935 0.00% 0.00% BCC CASON BGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST HAST Temperature Humidity Bias Device-Hours* % Defective 168 Hours 500 Hours 1K Hours 100 Hours 500 Hours REJ SS REJ SS REJ SS REJ SS REJ SS PACKAGE QTR BCC 4 LAST 4Q 0 231 0 231 0 231 0 0 0 0 231,000 0.00% 4 LAST 4Q 0 231 0 231 0 231 0 0 0 0 231,000 0.00% 4 LAST 4Q 0 956 0 956 0 956 0 0 0 0 956,000 0.00% 4 LAST 4Q 0 0 385 994 0 0 385 994 0 0 68 371 0 154 0 0 226,500 990,500 0.00% 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 0 77 308 0 0 154,000 693,000 0.00% 0.00% 4 LAST 4Q 0 187 0 187 0 0 0 0 77 385 0 0 154,000 863,500 0.00% 0.00% 4 LAST 4Q 0 151 0 151 0 77 0 0 77 231 0 0 154,000 576,000 0.00% 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 154 0 0 308,000 0.00% 77 77 0 0 154,000 154,000 0.00% 0.00% 308 1,309 0 0 0 0 842,500 5,003,000 0.00% 0.00% BGA MLF / QFN QFP PDIP PLCC SOIC TSOP / VSOP VSOP ATMEL 4 LAST 4Q 0 0 0 0 0 0 0 0 4 LAST 4Q 0 0 385 2,827 0 0 385 2,827 0 0 68 1,943 0 0 RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 4 LAST 4Q 0 77 0 77 0 77 0.0% 4 LAST 4Q 0 231 0 0 0 0 0.0% 4 LAST 4Q 0 15 0 15 0 0 0.0% MLF / QFN 4 LAST 4Q 0 0 154 649 0 0 77 77 0 0 77 77 0.0% 0.0% QFP 4 LAST 4Q 0 0 385 1,202 0 154 0 154 0.0% 0.0% PDIP 4 LAST 4Q 0 0 77 385 0 0 77 308 0 0 77 308 0.0% 0.0% PGA 4 LAST 4Q 0 15 0 15 0 0 0.0% PLCC 4 LAST 4Q 0 0 77 539 0 0 77 385 0 0 77 385 0.0% 0.0% SOIC 4 LAST 4Q 0 0 77 461 0 0 77 308 0 0 77 308 0.0% 0.0% CASON BGA MCGA TSOP / VSOP ATMEL 4 0 77 0 77 0 77 0.0% LAST 4Q 0 231 0 231 0 231 0.0% 4 LAST 4Q 0 0 847 3,805 0 0 385 1,570 0 0 385 1,540 0.00% 0.00% RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) 5 19.7 EPLD 0.5 PLD 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 5 34 EPROM 0.5 EPROM NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH 5 42 BiCMOS 0.6 GFO / CSO 43 ASIC ASIC, TX RF HNO 46 5 55 Logic RFA 5 55.8 5 56 5 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS 6BD1 HNO BICMOS2 GFO HCCD1 NMOS 2.5 0.8 ASIC / RFA ASIC / RFA RFA CCD GFO HCCD3 NMOS 1.5 CCD HNO I²L 6IL4 2 ASIC HNO SCMOS3 HNO SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12