Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot First QUARTER 2007 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product family) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product family) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 11. Technology List 10 12. Failure Rate Calculations 11 13. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: March 19, 2007 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process or package family and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 7 FITS (4,168K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 15 FITS (524K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 462 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 847K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 385 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS REJ SS 100 300 0 0 100 300 109,600 328,752 42 131 0 0 201 21 APG 4 LAST 4Q 0 0 300 899 0 0 100 300 ASIC 4 LAST 4Q 0 0 652 2,984 0 0 652 0 2,855 0 344 1,386 0 0 254 1,020 350,744 1,455,984 31 37 0 0 84 17 MEMORY 4 LAST 4Q 0 0 900 3,105 0 0 299 0 1,004 0 299 989 0 0 299 944 327,848 1,069,868 104 202 0 0 27 4 MCU 4 LAST 4Q 1 1 25,872 29,598 0 0 177 861 177 860 0 0 100 532 1,371,860 2,075,544 45 41 39 34 33 24 RFA 4 LAST 4Q 0 0 1,700 1,810 0 0 1,700 0 1,340 1,810 0 1,398 0 0 1,340 1,398 1,400,480 1,467,216 94 91 0 0 7 7 SERIAL EE ATMEL 0 0 1K Hours 0 0 4 0 2,200 0 2,100 0 300 0 300 607,200 48 0 31 LAST 4Q 0 4,600 0 3,600 0 900 0 900 1,401,600 57 0 12 4 LAST 4Q 1 1 31,624 42,996 0 0 5,028 0 2,560 10,430 0 5,833 0 0 2,393 5,094 4,167,732 7,798,964 65 65 32 23 7 4 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH Z96 Z92 Z91 UHF 6UH6+BICMOS SIGE2 CMOS BCDMOS BICMOS 63K 58K 57.5K 57K 56.9K 56.8K 56K 46K QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 154 154,000 117 154 154,000 117 0 0 51 51 498,036 12 542,728 12 100 98 333 313 45 81,900 10 0 1,160 0 152 186,440 90 152 0 152 186,440 90 0 0 55 55 0 80 0 80 80,000 117 0 80 0 80 80,000 117 0 0 98 98 80 0 80 0 80 80,000 206 80 0 80 0 80 80,000 206 0 0 56 56 0 154 0 154 0 0 77,000 117 0 102 79 0 79 0 79 0 79 79,000 117 79 0 79 0 79 0 79 79,000 117 0 0 99 99 0 325 0 325 0 325 0 325 325,000 117 0 325 0 325 0 325 0 325 325,000 117 0 0 24 24 0 600 0 199 0 199 0 199 218,248 63 0 1,500 0 499 0 499 0 499 547,048 76 0 0 67 22 4 LAST 4Q 0 314 0 314 0 313 0 313 313,168 21 0 914 0 391 0 390 0 313 376,772 18 0 0 139 134 4 LAST 4Q 0 154 0 154 25,872 117 0 154 0 154 0 0 0 0 25,872 117 0 0 302 302 4 LAST 4Q 0 100 0 100 0 100 0 100 100,000 23 0 315 0 315 0 300 0 300 302,520 24 0 0 403 127 0 100 0 100 0 100 0 100 100,000 48 0 189 0 154 0 154 0 77 0 77 89,936 48 0 1,253 0 1,030 0 254 0 177 356,572 38 0 0 210 67 0 12 0 12 0 12 0 12 12,000 260 0 294 0 157 0 157 0 157 0 157 157,000 85 0 157 0 157 0 157 0 157 157,000 85 0 0 69 69 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 154 0 154 0 154 0 0 154 0 154 0 154 0 4 LAST 4Q 1 9,952 0 45 0 45 1 10,158 0 122 0 122 0 0 0 390 0 90 0 90 0 4 LAST 4Q 0 357 0 357 0 152 0 357 0 357 0 4 LAST 4Q 0 80 0 80 0 80 0 80 4 LAST 4Q 0 80 0 0 80 0 0 154 4 LAST 4Q 0 0 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH 44K 43 K 39K 35K 34K 26K 19K ATMEL QTR 4 LAST 4Q 4 LAST 4Q 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 77 115,808 23 0 231 347,424 23 0 0 348 116 58 0 58 66,736 42 0 327 REJ SS REJ SS REJ SS REJ SS 0 308 0 308 0 77 0 0 924 0 924 0 231 0 110 0 110 0 4 LAST 4Q 0 300 0 300 0 100 0 100 133,600 48 0 1,200 0 600 0 400 0 400 462,400 74 0 142 27 4 LAST 4Q 0 17,910 0 2,022 0 422 0 300 1,392,424 58 0 22,580 0 3,897 0 1,396 0 1,132 2,580,952 50 0 0 11 7 4 LAST 4Q 0 300 0 100 0 100 0 100 109,600 187 0 1,200 0 400 0 400 0 400 438,400 161 0 0 45 13 0 200 0 200 0 200 0 200 200,000 36 0 129 4 LAST 4Q 0 300 0 100 0 100 0 100 109,600 42 0 600 0 200 0 200 0 200 219,200 175 0 0 201 24 4 LAST 4Q 1 31,624 0 5,028 0 2,560 0 2,393 4,167,732 65 1 42,996 0 10,430 0 5,833 0 5,094 7,798,964 65 32 23 7 4 4 LAST 4Q * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) FAMILY QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS APG 4 LAST 4Q 0 0 77 177 0 0 77 177 0 0 77 177 77,000 177,000 117 117 102 44 ASIC 4 LAST 4Q 0 0 0 231 0 0 0 231 0 0 0 231 0 231,000 117 117 34 MEMORY 4 LAST 4Q 0 0 231 585 0 0 231 585 0 0 231 585 231,000 585,000 117 117 34 13 MCU 4 LAST 4Q 0 0 254 1,197 0 0 254 1,197 0 0 177 1,119 215,500 1,158,000 117 117 36 7 SERIAL EE 4 LAST 4Q 0 0 0 408 0 0 0 408 0 0 0 408 0 408,000 117 117 19 4 LAST 4Q 0 0 562 2,598 0 0 562 2,598 0 0 485 2,520 523,500 2,559,000 117 117 15 3 ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours Device-Hours AF FITS REJ SS REJ SS REJ SS 4 LAST 4Q 0 77 0 77 0 77 77,000 117 102 63 K 4 LAST 4Q 0 0 154 358 0 0 154 358 0 0 154 358 154,000 358,000 117 117 51 22 56K 4 LAST 4Q 0 154 0 154 0 154 154,000 117 51 4 LAST 4Q 0 227 0 227 0 227 227,000 117 35 35K 4 LAST 4Q 0 0 254 1,120 0 0 254 1,120 0 0 177 1,042 215,500 1,081,000 117 117 36 7 34K 4 LAST 4Q 0 0 77 254 0 0 77 254 0 0 77 254 77,000 254,000 117 117 102 31 56.8K 4 LAST 4Q 0 231 0 231 0 231 231,000 117 34 19K 4 LAST 4Q 0 0 77 127 0 0 77 127 0 0 77 127 77,000 127,000 117 117 102 62 58K 4 LAST 4Q 0 50 0 50 0 50 50,000 117 157 4 LAST 4Q 0 0 562 2,598 0 0 562 2,598 0 0 485 2,520 523,500 2,559,000 117 117 15 3 Z92 39K ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles 2K Cycles % Defective REJ SS REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 154 0 154 0 154 0 154 0 0 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 77 0 0 0.00% 4 LAST 4Q 0 154 0 154 0 154 0 139 0 0 0.00% 4 LAST 4Q 0 0 77 589 0 0 77 589 0 0 154 666 0 0 154 577 0 0 0.00% 0.00% 4 LAST 4Q 0 0 77 227 0 0 77 227 0 0 77 224 0 0 77 224 0 0 0.00% 0.00% PLCC 4 LAST 4Q 0 0 77 535 0 0 77 535 0 0 77 535 0 0 77 304 0 0 0 0 0.00% 0.00% SAP 4 LAST 4Q 0 77 0 77 0 77 0 77 0 0 0.00% SOIC 4 LAST 4Q 0 154 0 154 0 154 0 148 0 0 0.00% TSOP / VSOP 4 LAST 4Q 0 0 154 508 0 0 154 508 0 0 154 508 0 0 154 508 0 0 0.00% 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 77 0 0 0.00% 4 LAST 4Q 0 0 385 2,552 0 0 385 2,552 0 0 462 2,626 0 0 462 2,285 0 0 0 0 0.00% 0.00% BCC CBGA MLF / QFN QFP PDIP TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST HAST Temperature Humidity Bias Device-Hours* % Defective 168 Hours 500 Hours 1K Hours 100 Hours 500 Hours REJ SS REJ SS REJ SS REJ SS REJ SS PACKAGE QTR BCC 4 LAST 4Q 0 154 0 154 0 154 0 0 0 0 154,000 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 0 0 0 77,000 0.00% 4 LAST 4Q 0 154 0 154 0 154 0 0 0 0 154,000 0.00% 4 LAST 4Q 0 0 154 502 0 0 154 502 0 0 0 229 0 0 77 154 0 0 204,188 673,500 0.00% 0.00% 4 LAST 4Q 0 0 0 50 0 0 0 50 0 0 0 50 0 0 77 227 0 0 716,800 504,000 0.00% 0.00% 4 LAST 4Q 0 0 0 314 0 0 0 314 0 0 0 237 0 0 77 304 0 0 109,600 883,500 0.00% 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 0 0 0 77,000 0.00% 4 LAST 4Q 0 154 0 154 0 154 0 77 0 0 308,000 0.00% 4 LAST 4Q 0 159 0 159 0 159 0 0 0 0 159,000 0.00% 4 LAST 4Q 0 0 0 150 0 0 0 150 0 0 0 150 0 0 154 508 0 0 218,248 1,166,000 0.00% 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 0 0 0 77,000 0.00% 4 LAST 4Q 0 0 154 1,868 0 0 154 1,868 0 0 0 1,518 0 0 385 1,270 0 0 0 0 847,000 4,233,000 0.00% 0.00% CBGA MLF / QFN QFP PDIP PLCC SAP SOIC SSOP TSOP / VSOP TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 4 LAST 4Q 0 77 0 77 0 0 0.0% 4 LAST 4Q 0 154 0 0 0 0 0.0% QFP 4 LAST 4Q 0 0 77 503 0 0 77 154 0 0 77 154 0.0% 0.0% PDIP 4 LAST 4Q 0 0 77 227 0 0 77 227 0 0 77 227 0.0% 0.0% PLCC 4 LAST 4Q 0 0 77 535 0 0 77 304 0 0 76 303 0.0% 0.0% SAP 4 LAST 4Q 0 77 0 77 0 0 0.0% 4 LAST 4Q 0 231 0 77 0 0 0.0% SSOP 4 LAST 4Q 0 77 0 0 0 0 0.0% TSOP / VSOP 4 0 154 0 154 0 154 0.0% LAST 4Q 0 508 0 508 0 508 0.0% 4 LAST 4Q 0 77 0 77 0 0 0.0% 4 LAST 4Q 0 0 385 2,466 0 0 385 1,501 0 0 384 1,192 0.00% 0.00% CBGA MLF / QFN SOIC TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) 5 19.7 EPLD 0.5 PLD 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 5 34 EPROM 0.5 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH 5 42 BiCMOS 0.6 GFO / CSO 43 EPROM ASIC ASIC, TX RF HNO 46 5 55 Logic RFA 5 55.8 5 56 5 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH HNO BCDMOS 6BD1 0.8 ASIC / RFA HNO BICMOS HNO 6UH6+BICMOS GFO HCCD1 NMOS 2.5 ASIC / RFA RFA CCD GFO HCCD3 NMOS 1.5 CCD HNO I²L 6IL4 2 ASIC HNO SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA SRAM,MICRO, VAN DLC NTO Z86 CMOS Digital 0.8 NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) 22 RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. 22 RELIABILITY MONITOR -- ATMEL PROPRIETARY 12