SUM110N04-03L New Product Vishay Siliconix N-Channel 40-V (D-S) 175_C MOSFET FEATURES PRODUCT SUMMARY V(BR)DSS (V) rDS(on) (W) 0.0035 @ VGS = 10 V 40 D TrenchFETr Power MOSFET D 175_C Junction Temperature ID (A) APPLICATIONS 110 a 0.0053 @ VGS = 4.5 V D Automotive Applications Such As: - ABS - 12-V EPS - Motor Drives D Industrial D TO-263 G G D S Top View S SUM110N04-03L N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol Limit Drain-Source Voltage VDS 40 Gate-Source Voltage VGS "20 TC = 25_C Continuous Drain Current (TJ = 175_C) _ TC = 125_C Pulsed Drain Current ID IDM Avalanche Current Repetitive Avalanche Energyb L = 0.1 mH TC = 25_C Maximum Power Dissipationb TA = 25_Cd Operating Junction and Storage Temperature Range Unit V 110a 102a A 300 IAR 55 EAR 151 mJ 230c PD 3.75 W TJ, Tstg -55 to 175 _C Symbol Limit Unit THERMAL RESISTANCE RATINGS Parameter Junction-to-Ambient Junction-to-Case PCB Mountd RthJA 40 RthJC 0.65 _ _C/W Notes a. Package limited. b. Duty cycle v 1%. c. See SOA curve for voltage derating. d. When mounted on 1” square PCB (FR-4 material). Document Number: 72081 S-22247—Rev. A, 25-Nov-02 www.vishay.com 1 SUM110N04-03L New Product Vishay Siliconix SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED) Parameter Symbol Test Condition Min Typ Max V(BR)DSS VDS = 0 V, ID = 250 mA 40 VGS(th) VDS = VGS, ID = 250 mA 1 IGSS VDS = 0 V, VGS = "20 V 100 VDS = 40 V, VGS = 0 V 1 Unit Static Drain-Source Breakdown Voltage Gate-Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea IDSS ID(on) rDS(on) V 3 VDS = 40 V, VGS = 0 V, TJ = 125_C 50 VDS = 40 V, VGS = 0 V, TJ = 175_C 250 VDS w 5 V, VGS = 10 V 120 VGS = 10 V, ID = 30 A 0.0029 0.0035 VGS = 4.5 V, ID = 20 A 0.0042 0.0053 VDS = 15 V, ID = 30 A W 0.0055 VGS = 10 V, ID = 30 A, TJ = 175_C gfs mA m A VGS = 10 V, ID = 30 A, TJ = 125_C Forward Transconductancea nA 0.0066 30 S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss 560 Total Gate Chargec Qg 110 Gate-Source Chargec Qgs 17 Gate-Drain Chargec Qgd 35 Turn-On Delay Timec td(on) 15 25 tr 20 30 50 75 100 150 Rise Timec Turn-Off Delay Timec Fall Timec td(off) 4800 VGS = 0 V, VDS = 25 V, f = 1 MHz VDS = 30 V, VGS = 10 V, ID = 110 A VDD = 30 V, RL = 0.35 W ID ^ 110 A, VGEN = 10 V, RG = 2.5 W tf 1010 pF 165 nC ns Source-Drain Diode Ratings and Characteristics (TC = 25_C)b Continuous Current IS 110 Pulsed Current ISM 300 Forward Voltagea VSD Reverse Recovery Time Peak Reverse Recovery Current Reverse Recovery Charge IF = 110 A, VGS = 0 V 1.1 IF = 110 A, di/dt = 100 A/ms 0.034 trr IRM(REC) Qrr A 1.4 V 45 70 ns 1.5 2.3 A 0.081 mC Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. www.vishay.com 2 Document Number: 72081 S-22247—Rev. A, 25-Nov-02 SUM110N04-03L New Product Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Output Characteristics Transfer Characteristics 250 250 VGS = 10 thru 5 V 4V 200 I D - Drain Current (A) I D - Drain Current (A) 200 150 100 3V 50 150 100 TC = 125_C 50 25_C -55 _C 0 0 0 2 4 6 8 10 0 VDS - Drain-to-Source Voltage (V) Transconductance 2 4 5 0.008 200 160 r DS(on) - On-Resistance ( W ) TC = -55_C 25_C 125_C 120 80 40 0 0.006 VGS = 4.5 V 0.004 VGS = 10 V 0.002 0.000 0 15 30 45 60 75 0 90 20 40 ID - Drain Current (A) 60 80 100 120 ID - Drain Current (A) Capacitance Gate Charge 20 7000 V GS - Gate-to-Source Voltage (V) 6000 C - Capacitance (pF) 3 On-Resistance vs. Drain Current 240 g fs - Transconductance (S) 1 VGS - Gate-to-Source Voltage (V) Ciss 5000 4000 3000 2000 Coss 1000 VDS = 30 V ID = 110 A 16 12 8 4 Crss 0 0 0 8 16 24 32 VDS - Drain-to-Source Voltage (V) Document Number: 72081 S-22247—Rev. A, 25-Nov-02 40 0 40 80 120 160 200 Qg - Total Gate Charge (nC) www.vishay.com 3 SUM110N04-03L New Product Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage 2.0 100 1.6 I S - Source Current (A) r DS(on) - On-Resistance (W) (Normalized) VGS = 10 V ID = 30 A 1.2 0.8 TJ = 150_C 0.4 0.0 -50 -25 0 25 50 75 100 125 150 1 0 175 0.3 TJ - Junction Temperature (_C) 0.6 0.9 1.2 VSD - Source-to-Drain Voltage (V) Drain Source Breakdown vs. Junction Temperature Avalanche Current vs. Time 1000 50 48 V(BR)DSS (V) 100 I Dav (a) TJ = 25_C 10 IAV (A) @ TA = 25_C 10 ID = 1 mA 46 44 1 IAV (A) @ TA = 150_C 42 0.1 0.00001 0.0001 0.001 0.01 tin (Sec) www.vishay.com 4 0.1 1 40 -50 -25 0 25 50 75 100 125 150 175 TJ - Junction Temperature (_C) Document Number: 72081 S-22247—Rev. A, 25-Nov-02 SUM110N04-03L New Product Vishay Siliconix THERMAL RATINGS Maximum Avalanche and Drain Current vs. Case Temperature Safe Operating Area, Junction-to-Case 1000 100 10 ms 80 100 ms I D - Drain Current (A) I D - Drain Current (A) 100 60 40 Limited by rDS(on) 0 10 ms 100 ms dc 1 20 1 ms 10 TC = 25_C Single Pulse 0.1 0 25 50 75 100 125 150 175 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) TC - Ambient Temperature (_C) Normalized Thermal Transient Impedance, Junction-to-Case 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (sec) Document Number: 72081 S-22247—Rev. A, 25-Nov-02 www.vishay.com 5 This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.