Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Item BT-Epoxy Glass Fiber Copper Gold Solder Mask Nickel Subtotal CSP BGA 17 X 17 256 Pb-Free 0.60 mm Molding Compound % of Compound 85.0 7.0 6.5 1.0 0.5 Laminate % of Laminate 28 25 19 11 9.35 7.8 Solder Ball % of Solder Ball 96.5 3 0.5 Sn Ag Cu Subtotal Weight (g) 2.90 E-01 2.39 E-02 2.22 E-02 3.41 E-03 1.70 E-03 3.41 E-01 PPM 303818 25020 23233 3574 1787 357433 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3060A & EPA 7196A. UV-VIS. Not Detected EPA 3540C/3550C. GC/MS Not Detected EPA 3540C/3550C. GC/MS Weight (g) 9.59 E-02 8.57 E-02 6.51 E-02 3.77 E-02 3.20 E-02 2.67 E-02 3.43 E-01 PPM 100571 89796 68245 39510 33584 28016 359721 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 2.35 E-01 7.30 E-03 1.22 E-03 2.43 E-01 PPM 246036 7649 1275 254960 Au Bond Wires % of Wire 99.99 Weight (g) 7.38 E-03 PPM 7733 Si Chip % of Chip 100 Weight (g) 1.68 E-02 PPM 17565 Die Attach % of Die Attach 76 24 Weight (g) 1.88 E-03 5.92 E-04 PPM 1967 621 Item Ag Filler Resin Subtotal Die Attach Paste Package Totals PPM Weight (g) 1000000 9.54 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3060A & EPA 7196A. UV-VIS. EPA 3540C/3550C. GC/MS EPA 3540C/3550C. GC/MS STS-BC-E Materials Declaration Package Body Size Ball Count Option Ball Size Item Silica Epoxy resin Phenol resin Antimony trioxide Bromine Subtotal Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Subtotal CSP BGA 17 X 17 256 SnPbAg 0.60 mm Molding Compound % of Compound 90 4.8 3.9 0.7 0.6 Laminate % of Laminate 28 25 19 11 7.8 9.35 Solder Ball % of Solder ball 62 36 2 Sn Pb Ag Subtotal Weight (g) 3.00 E-01 1.60 E-02 1.31 E-02 2.30 E-03 2.00 E-03 3.34 E-01 PPM 317305 16923 13785 2433 2115 352561 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3060A & EPA 7196A. UV-VIS. Not Detected EPA 3540C/3550C. GC/MS Not Detected EPA 3540C/3550C. GC/MS Weight (g) 9.59 E-02 8.57 E-02 6.51 E-02 3.77 E-02 2.67 E-02 3.20 E-02 3.43 E-01 PPM 101333 90476 68762 39810 28229 33838 362448 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3060A & EPA 7196A. UV-VIS. Not Detected EPA 3540C/3550C. GC/MS Not Detected EPA 3540C/3550C. GC/MS Weight (g) 1.51 E-01 8.76 E-02 4.86 E-03 2.43 E-01 PPM 159273 92481 5138 256893 Bond Wires % of Wire 99.99 Weight (g) 7.38 E-03 PPM Au Si Chip % of Chip 100 Weight (g) 1.68 E-02 PPM 17698 Weight (g) 1.90 E-03 5.68 E-04 2.47 E-03 PPM Item Ag Filler Resin Subtotal Die Attach % of Die Attach 77 23 7792 2008 600 2607 Package Totals PPM Weight (g) 1000000 9.47 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary STS-BC-A