pdf

Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Solder Mask
Nickel
Subtotal
CSP BGA
17 X 17
256
Pb-Free
0.60 mm
Molding Compound
% of Compound
85.0
7.0
6.5
1.0
0.5
Laminate
% of Laminate
28
25
19
11
9.35
7.8
Solder Ball
% of Solder Ball
96.5
3
0.5
Sn
Ag
Cu
Subtotal
Weight (g)
2.90 E-01
2.39 E-02
2.22 E-02
3.41 E-03
1.70 E-03
3.41 E-01
PPM
303818
25020
23233
3574
1787
357433
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3060A & EPA 7196A. UV-VIS.
Not Detected
EPA 3540C/3550C. GC/MS
Not Detected
EPA 3540C/3550C. GC/MS
Weight (g)
9.59 E-02
8.57 E-02
6.51 E-02
3.77 E-02
3.20 E-02
2.67 E-02
3.43 E-01
PPM
100571
89796
68245
39510
33584
28016
359721
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Weight (g)
2.35 E-01
7.30 E-03
1.22 E-03
2.43 E-01
PPM
246036
7649
1275
254960
Au
Bond Wires
% of Wire
99.99
Weight (g)
7.38 E-03
PPM
7733
Si
Chip
% of Chip
100
Weight (g)
1.68 E-02
PPM
17565
Die Attach
% of Die Attach
76
24
Weight (g)
1.88 E-03
5.92 E-04
PPM
1967
621
Item
Ag Filler
Resin
Subtotal
Die Attach Paste
Package Totals
PPM
Weight (g)
1000000
9.54 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3060A & EPA 7196A. UV-VIS.
EPA 3540C/3550C. GC/MS
EPA 3540C/3550C. GC/MS
STS-BC-E
Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
Silica
Epoxy resin
Phenol resin
Antimony trioxide
Bromine
Subtotal
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Nickel
Solder Mask
Subtotal
CSP BGA
17 X 17
256
SnPbAg
0.60 mm
Molding Compound
% of Compound
90
4.8
3.9
0.7
0.6
Laminate
% of Laminate
28
25
19
11
7.8
9.35
Solder Ball
% of Solder ball
62
36
2
Sn
Pb
Ag
Subtotal
Weight (g)
3.00 E-01
1.60 E-02
1.31 E-02
2.30 E-03
2.00 E-03
3.34 E-01
PPM
317305
16923
13785
2433
2115
352561
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3060A & EPA 7196A. UV-VIS.
Not Detected
EPA 3540C/3550C. GC/MS
Not Detected
EPA 3540C/3550C. GC/MS
Weight (g)
9.59 E-02
8.57 E-02
6.51 E-02
3.77 E-02
2.67 E-02
3.20 E-02
3.43 E-01
PPM
101333
90476
68762
39810
28229
33838
362448
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3060A & EPA 7196A. UV-VIS.
Not Detected
EPA 3540C/3550C. GC/MS
Not Detected
EPA 3540C/3550C. GC/MS
Weight (g)
1.51 E-01
8.76 E-02
4.86 E-03
2.43 E-01
PPM
159273
92481
5138
256893
Bond Wires
% of Wire
99.99
Weight (g)
7.38 E-03
PPM
Au
Si
Chip
% of Chip
100
Weight (g)
1.68 E-02
PPM
17698
Weight (g)
1.90 E-03
5.68 E-04
2.47 E-03
PPM
Item
Ag Filler
Resin
Subtotal
Die Attach
% of Die Attach
77
23
7792
2008
600
2607
Package Totals
PPM
Weight (g)
1000000
9.47 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
STS-BC-A