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Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Carbon Black
Metal Hydroxide
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Nickel
Solder Mask
Brominated Compound
CSP BGA
12 X 12
160
Pb-Free
0.45
Molding Compound
% of Compound
7
85
6.5
0.5
1
Weight (g)
1.34 E-02
1.63 E-01
1.25 E-02
9.60 E-04
1.92 E-03
PPM
36155
439026
33573
2583
5165
Weight (g)
28
2.84 E-02
25
2.53 E-02
19
1.93 E-02
11
1.12 E-02
7.8
7.91 E-03
9.35
9.48 E-03
Confidential Not Determined
PPM
76361
68179
51816
29999
21272
25499
Laminate
% of Laminate
Sn
Ag
Cu
Solder Ball
% of Solder Ball
96.5
3
0.5
Weight (g)
5.93 E-02
1.84 E-03
3.07 E-04
PPM
159644
4963
827
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.13 E-03
PPM
3048
100
Weight (g)
1.41 E-02
PPM
37877
Weight (g)
3.58 E-04
1.13 E-03
PPM
24
76
Chip
% of Chip
Si
Item
Resin
Ag Filler
Die Attach
% of Die Attach
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICPaes)
Mercury Analyser
EPA method #3060A(UV)
Item
Pb
Cd
Hg
Cr+6
PPM
<2.0
<2.0
<2.0
<2.0
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<14
<2.0
<2.0
<19
Not Detected
Not Detected
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
ICP-AES
Laminate
Method
963
3050
Package Totals
PPM
Weight (g)
1000000
3.72 E-01
STS-BC-G
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/9/04
Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol resin
Antimony trioxide
Bromine
Item
BT-Epoxy
Glass Fiber
Copper
Gold
Nickel
Solder Mask
Brominated Compound
CSP BGA
12 X 12
160
SnPbAg
0.45
Molding Compound
% of Compound
90
4.8
3.9
0.7
0.6
Weight (g)
1.70 E-01
9.04 E-03
7.37 E-03
1.30 E-03
1.13 E-03
PPM
460579
24564
20010
3531
3071
Weight (g)
28
2.84 E-02
25
2.53 E-02
19
1.93 E-02
11
1.12 E-02
7.8
7.91 E-03
9.35
9.48 E-03
Confidential Not Determined
PPM
77111
68849
52325
30293
21481
25749
Laminate
% of Laminate
Solder Ball
% of Solder Ball
Sn
Pb
Ag
Au
62
36
2
PPM
103576
60141
3341
Bond Wires
% of Wire
99.99
Weight (g)
1.13 E-03
PPM
100
Weight (g)
1.41 E-02
PPM
38249
Weight (g)
3.43 E-04
1.15 E-03
PPM
23
77
Chip
% of Chip
Item
Resin
Ag Filler
PPM
<5
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<14
<2.0
<2.0
<19
Not Detected
Not Detected
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
ICP-AES
Laminate
Weight (g)
3.81 E-02
2.21 E-02
1.23 E-03
Si
Molding Compound
Method
BS EN 1122:2001B (ICPaes)
Item
Cd
Die Attach
% of Die Attach
Method
3078
932
3121
Package Totals
PPM
Weight (g)
1000000
3.68 E-01
STS-BC-B
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/9/04