Materials Declaration Package Body Size Ball Count Option Ball Size Item Epoxy resin SiO2 Filler Phenol Resin Carbon Black Metal Hydroxide Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound CSP BGA 12 X 12 160 Pb-Free 0.45 Molding Compound % of Compound 7 85 6.5 0.5 1 Weight (g) 1.34 E-02 1.63 E-01 1.25 E-02 9.60 E-04 1.92 E-03 PPM 36155 439026 33573 2583 5165 Weight (g) 28 2.84 E-02 25 2.53 E-02 19 1.93 E-02 11 1.12 E-02 7.8 7.91 E-03 9.35 9.48 E-03 Confidential Not Determined PPM 76361 68179 51816 29999 21272 25499 Laminate % of Laminate Sn Ag Cu Solder Ball % of Solder Ball 96.5 3 0.5 Weight (g) 5.93 E-02 1.84 E-03 3.07 E-04 PPM 159644 4963 827 Au Bond Wires % of Wire 99.99 Weight (g) 1.13 E-03 PPM 3048 100 Weight (g) 1.41 E-02 PPM 37877 Weight (g) 3.58 E-04 1.13 E-03 PPM 24 76 Chip % of Chip Si Item Resin Ag Filler Die Attach % of Die Attach Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPaes) Mercury Analyser EPA method #3060A(UV) Item Pb Cd Hg Cr+6 PPM <2.0 <2.0 <2.0 <2.0 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM <14 <2.0 <2.0 <19 Not Detected Not Detected Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES Laminate Method 963 3050 Package Totals PPM Weight (g) 1000000 3.72 E-01 STS-BC-G Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/9/04 Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol resin Antimony trioxide Bromine Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound CSP BGA 12 X 12 160 SnPbAg 0.45 Molding Compound % of Compound 90 4.8 3.9 0.7 0.6 Weight (g) 1.70 E-01 9.04 E-03 7.37 E-03 1.30 E-03 1.13 E-03 PPM 460579 24564 20010 3531 3071 Weight (g) 28 2.84 E-02 25 2.53 E-02 19 1.93 E-02 11 1.12 E-02 7.8 7.91 E-03 9.35 9.48 E-03 Confidential Not Determined PPM 77111 68849 52325 30293 21481 25749 Laminate % of Laminate Solder Ball % of Solder Ball Sn Pb Ag Au 62 36 2 PPM 103576 60141 3341 Bond Wires % of Wire 99.99 Weight (g) 1.13 E-03 PPM 100 Weight (g) 1.41 E-02 PPM 38249 Weight (g) 3.43 E-04 1.15 E-03 PPM 23 77 Chip % of Chip Item Resin Ag Filler PPM <5 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM <14 <2.0 <2.0 <19 Not Detected Not Detected Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES Laminate Weight (g) 3.81 E-02 2.21 E-02 1.23 E-03 Si Molding Compound Method BS EN 1122:2001B (ICPaes) Item Cd Die Attach % of Die Attach Method 3078 932 3121 Package Totals PPM Weight (g) 1000000 3.68 E-01 STS-BC-B Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/9/04