Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black CSP BGA 6 X 6 mm 76 96.5Sn/3Ag/0.5Cu 0.30 mm Molding Compound % of Compound 86.20 6.00 6.00 1.50 0.30 Weight (g) 3.40 E-02 2.37 E-03 2.37 E-03 5.92 E-04 1.18 E-04 PPM 391033 27218 27218 6805 1361 Laminate % of Laminate 75.00 21.60 3.00 0.30 0.10 Weight (g) 2.61 E-02 7.53 E-03 1.05 E-03 1.05 E-04 3.49 E-05 PPM 300452 86530 12018 1202 401 Sn Ag Cu Solder Ball % of Solder Ball 96.50 3.00 0.50 Weight (g) 7.68 E-03 2.39 E-04 3.98 E-05 PPM 88221 2743 457 Bond Wires % of Wire 99.99 Weight (g) 7.33 E-04 PPM Au % of Chip 100.0 Weight (g) 3.38 E-03 PPM 38826 Weight (g) 4.32 E-04 6.17 E-05 6.17 E-05 3.09 E-05 3.09 E-05 PPM Item BT Resin Solder Mask Copper Nickel Gold 8424 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected USEPA3050B. ICP-AES Not Detected EN 1122 Method B:2001. ICP-AES Not Detected USEPA 3052. ICP-AES Not Detected USEPA 3060A & USEPA 7196A Not Detected Analysis was performed by GC/MS Not Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Chip Si Item Ag Functionalized ester Diester Polymeric resin Epoxy Resin Die Attach Material % of Die Attach 70.0 10.0 10.0 5.0 5.0 4964 709 709 355 355 Package Totals Weight (g) PPM 1000000 8.70 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/18/06