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Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
CSP BGA
6 X 6 mm
76
96.5Sn/3Ag/0.5Cu
0.30 mm
Molding Compound
% of Compound
86.20
6.00
6.00
1.50
0.30
Weight (g)
3.40 E-02
2.37 E-03
2.37 E-03
5.92 E-04
1.18 E-04
PPM
391033
27218
27218
6805
1361
Laminate
% of Laminate
75.00
21.60
3.00
0.30
0.10
Weight (g)
2.61 E-02
7.53 E-03
1.05 E-03
1.05 E-04
3.49 E-05
PPM
300452
86530
12018
1202
401
Sn
Ag
Cu
Solder Ball
% of Solder Ball
96.50
3.00
0.50
Weight (g)
7.68 E-03
2.39 E-04
3.98 E-05
PPM
88221
2743
457
Bond Wires
% of Wire
99.99
Weight (g)
7.33 E-04
PPM
Au
% of Chip
100.0
Weight (g)
3.38 E-03
PPM
38826
Weight (g)
4.32 E-04
6.17 E-05
6.17 E-05
3.09 E-05
3.09 E-05
PPM
Item
BT Resin
Solder Mask
Copper
Nickel
Gold
8424
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
USEPA3050B. ICP-AES
Not Detected
EN 1122 Method B:2001. ICP-AES
Not Detected
USEPA 3052. ICP-AES
Not Detected
USEPA 3060A & USEPA 7196A
Not Detected
Analysis was performed by GC/MS
Not Detected
Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
5.00
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Laminate
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Chip
Si
Item
Ag
Functionalized ester
Diester
Polymeric resin
Epoxy Resin
Die Attach Material
% of Die Attach
70.0
10.0
10.0
5.0
5.0
4964
709
709
355
355
Package Totals
Weight (g)
PPM
1000000
8.70 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/18/06