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Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
CSP_BGA
15 X 15
196
96.5Sn/3Ag/0.5Cu
0.6mm
Molding Compound
% of Compound
77.0
10.0
10.0
2.5
0.5
Weight (g)
2.46 E-01
3.19 E-02
3.19 E-02
7.98 E-03
1.60 E-03
PPM
328014
42599
42599
10650
2130
Laminate
% of Laminate
27.0
25.0
18.0
11.0
11.0
8.0
Weight (g)
5.39 E-02
4.99 E-02
3.59 E-02
2.19 E-02
2.19 E-02
1.60 E-02
PPM
71978
66636
47954
29245
29245
21313
Sn
Ag
Cu
Solder Ball
% of Solder Ball
96.5
3.0
0.5
Weight (g)
1.58 E-01
4.92 E-03
8.21 E-04
PPM
211527
6574
1096
Au
Bond Wires
% of Wire
99.99
Weight (g)
5.10 E-03
PPM
6807
Si
Chip
% of Chip
100.0
Weight (g)
2.05 E-02
PPM
27416
Die Attach
% of Die Attach
75.0
12.5
5.0
5.0
2.5
Weight (g)
3.05 E-02
5.08 E-03
2.03 E-03
2.03 E-03
1.02 E-03
PPM
40663
6777
2711
2711
1355
Item
BT-Epoxy
Glass Fiber
Copper
Solder Mask
Nickel
Gold
Item
Ag
Diester
Resin
Functionalized ester
Functionalized urethene
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
None Detected
USEPA3050B. ICP-AES
None Detected
EN 1122 Method B:2001. ICP-AES
None Detected
USEPA 3052. ICP-AES
None Detected
USEPA 3060A & USEPA 7196A
None Detected
Analysis was performed by GC/MS
None Detected
Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
5.00
None Detected
None Detected
None Detected
None Detected
None Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Laminate
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Package Totals
Weight (g)
PPM
1000000
7.49 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/16/06