Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black CSP_BGA 15 X 15 196 96.5Sn/3Ag/0.5Cu 0.6mm Molding Compound % of Compound 77.0 10.0 10.0 2.5 0.5 Weight (g) 2.46 E-01 3.19 E-02 3.19 E-02 7.98 E-03 1.60 E-03 PPM 328014 42599 42599 10650 2130 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Weight (g) 5.39 E-02 4.99 E-02 3.59 E-02 2.19 E-02 2.19 E-02 1.60 E-02 PPM 71978 66636 47954 29245 29245 21313 Sn Ag Cu Solder Ball % of Solder Ball 96.5 3.0 0.5 Weight (g) 1.58 E-01 4.92 E-03 8.21 E-04 PPM 211527 6574 1096 Au Bond Wires % of Wire 99.99 Weight (g) 5.10 E-03 PPM 6807 Si Chip % of Chip 100.0 Weight (g) 2.05 E-02 PPM 27416 Die Attach % of Die Attach 75.0 12.5 5.0 5.0 2.5 Weight (g) 3.05 E-02 5.08 E-03 2.03 E-03 2.03 E-03 1.02 E-03 PPM 40663 6777 2711 2711 1355 Item BT-Epoxy Glass Fiber Copper Solder Mask Nickel Gold Item Ag Diester Resin Functionalized ester Functionalized urethene Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected USEPA3050B. ICP-AES None Detected EN 1122 Method B:2001. ICP-AES None Detected USEPA 3052. ICP-AES None Detected USEPA 3060A & USEPA 7196A None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Package Totals Weight (g) PPM 1000000 7.49 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/16/06