Materials Declaration CSP_BGA 9x9mm 80 SnAgPb 0.45 mm Package Body Size LeadCount Option Ball Size Item Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Mold Compound Weight (g) 7.66 E-02 5.33 E-03 5.33 E-03 1.33 E-03 2.66 E-04 PPM 453209 31546 31546 7886 1577 Laminate Solder mask Cu Nickel Gold Laminate % of Laminate 75.0 21.6 3.0 0.3 0.1 Weight (g) 2.77 E-02 7.97 E-03 1.11 E-03 1.11 E-04 3.69 E-05 PPM 163928 47211 6557 656 219 Sn Ag Pb Solder Ball % of Plating 62.0 36.0 2.00 Weight (g) 1.99 E-02 1.15 E-02 6.42 E-04 PPM 117734 68362 3798 Au Pd Bond Wires % of Wire 99.00 1.00 Weight (g) 1.76 E-03 1.78 E-05 PPM 10427 105 Chip % of Chip 100.0 Weight (g) 8.13 E-03 PPM 48136 Die Attach % of Die Attach 70.0 10.0 10.0 5.0 5.0 Weight (g) 8.40 E-04 1.20 E-04 1.20 E-04 6.00 E-05 6.00 E-05 PPM 4973 710 710 355 355 Weight (g) 1.69 E-01 PPM 1000000 SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Item Si Item Ag Filler Diester Functionalized ester Polymeric resin Epoxy resin Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method USEPA3050B. ICP-AES EN 1122 Method B:2001. ICP-AES USEPA 3052. ICP-AES USEPA 3060A & USEPA 7196A Analysis was performed by GC/MS Analysis was performed by GC/MS Die Attach Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/16/2006