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Materials Declaration
CSP_BGA
9x9mm
80
SnAgPb
0.45 mm
Package
Body Size
LeadCount
Option
Ball Size
Item
Molding Compound
% of Compound
86.2
6.0
6.0
1.5
0.3
Mold Compound
Weight (g)
7.66 E-02
5.33 E-03
5.33 E-03
1.33 E-03
2.66 E-04
PPM
453209
31546
31546
7886
1577
Laminate
Solder mask
Cu
Nickel
Gold
Laminate
% of Laminate
75.0
21.6
3.0
0.3
0.1
Weight (g)
2.77 E-02
7.97 E-03
1.11 E-03
1.11 E-04
3.69 E-05
PPM
163928
47211
6557
656
219
Sn
Ag
Pb
Solder Ball
% of Plating
62.0
36.0
2.00
Weight (g)
1.99 E-02
1.15 E-02
6.42 E-04
PPM
117734
68362
3798
Au
Pd
Bond Wires
% of Wire
99.00
1.00
Weight (g)
1.76 E-03
1.78 E-05
PPM
10427
105
Chip
% of Chip
100.0
Weight (g)
8.13 E-03
PPM
48136
Die Attach
% of Die Attach
70.0
10.0
10.0
5.0
5.0
Weight (g)
8.40 E-04
1.20 E-04
1.20 E-04
6.00 E-05
6.00 E-05
PPM
4973
710
710
355
355
Weight (g)
1.69 E-01
PPM
1000000
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Item
Si
Item
Ag Filler
Diester
Functionalized ester
Polymeric resin
Epoxy resin
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
5.00
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
USEPA3050B. ICP-AES
EN 1122 Method B:2001. ICP-AES
USEPA 3052. ICP-AES
USEPA 3060A & USEPA 7196A
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Die Attach
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Laminate
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/16/2006