Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black CSP_BGA 13 X 13 144 96.5Sn/3Ag/0.5Cu 0.6mm Molding Compound % of Compound 77.0 10.0 10.0 2.5 0.5 Weight (g) 1.32 E-01 1.71 E-02 1.71 E-02 4.28E-03 8.56 E-04 PPM 257284 33413 33413 8353 1671 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Weight (g) 2.98E-02 2.76E-02 1.99E-02 1.22E-02 1.22E-02 8.84E-03 PPM 58230 53916 38820 23723 23723 17253 Sn Ag Cu Solder Ball % of Solder Ball 96.5 3.0 0.5 Weight (g) 1.16 E-01 3.62 E-03 6.03 E-04 PPM 226985 7059 1176 Au Bond Wires % of Wire 99.99 Weight (g) 2.35 E-03 PPM 4585 Si Chip % of Chip 100.0 Weight (g) 3.26 E-02 PPM 63626 Die Attach % of Die Attach 75.0 12.5 5.0 5.0 2.5 Weight (g) 5.64E-02 9.40E-03 3.76E-03 3.76E-03 1.88E-03 PPM 110077 18346 7338 7338 3669 Item BT-Epoxy Glass Fiber Copper Solder Mask Nickel Gold Item Ag Diester Resin Functionalized ester Functionalized urethene Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected USEPA3050B. ICP-AES Not Detected EN 1122 Method B:2001. ICP-AES Not Detected USEPA 3052. ICP-AES Not Detected USEPA 3060A & USEPA 7196A Not Detected Analysis was performed by GC/MS Not Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Package Totals Weight (g) PPM 1000000 5.12 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/16/06 Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Item BT-Epoxy Glass Fiber Copper Solder Mask Nickel Gold Sn Pb Ag CSP_BGA 13 X 13 144 62Sn/36Pb/2Ag 0.6mm Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Weight (g) 1.48 E-01 1.03 E-02 1.03 E-02 2.57 E-03 5.14 E-04 PPM 276211 19226 19226 4806 962 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Weight (g) 2.98 E-02 2.76 E-02 1.99 E-02 1.22 E-02 1.22 E-02 8.84 E-03 PPM 55842 51705 37228 22750 22750 16546 Solder Ball % of Solder Ball 62.0 36.0 2.0 Weight (g) 8.49 E-02 4.93 E-02 2.74 E-03 PPM 158816 92216 5123 Bond Wires % of Wire 99.99 Weight (g) 2.35 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 3.82 E-02 PPM 71446 Die Attach % of Die Attach 75.0 12.0 5.0 5.0 3.0 Weight (g) 5.64 E-02 9.02 E-03 3.76 E-03 3.76 E-03 2.26 E-03 PPM 105563 16890 7038 7038 4223 Item Ag Diester Resin Functionalized ester Functionalized urethene 4397 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected USEPA3050B. ICP-AES None Detected EN 1122 Method B:2001. ICP-AES None Detected USEPA 3052. ICP-AES None Detected USEPA 3060A & USEPA 7196A None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM 5.00 US EPA Method 3052. ICP-OES None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3052. ICP-OES None Detected US EPA Method 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Package Totals Weight (g) PPM 1000000 5.34 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/20/06