pdf

Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
CSP_BGA
13 X 13
144
96.5Sn/3Ag/0.5Cu
0.6mm
Molding Compound
% of Compound
77.0
10.0
10.0
2.5
0.5
Weight (g)
1.32 E-01
1.71 E-02
1.71 E-02
4.28E-03
8.56 E-04
PPM
257284
33413
33413
8353
1671
Laminate
% of Laminate
27.0
25.0
18.0
11.0
11.0
8.0
Weight (g)
2.98E-02
2.76E-02
1.99E-02
1.22E-02
1.22E-02
8.84E-03
PPM
58230
53916
38820
23723
23723
17253
Sn
Ag
Cu
Solder Ball
% of Solder Ball
96.5
3.0
0.5
Weight (g)
1.16 E-01
3.62 E-03
6.03 E-04
PPM
226985
7059
1176
Au
Bond Wires
% of Wire
99.99
Weight (g)
2.35 E-03
PPM
4585
Si
Chip
% of Chip
100.0
Weight (g)
3.26 E-02
PPM
63626
Die Attach
% of Die Attach
75.0
12.5
5.0
5.0
2.5
Weight (g)
5.64E-02
9.40E-03
3.76E-03
3.76E-03
1.88E-03
PPM
110077
18346
7338
7338
3669
Item
BT-Epoxy
Glass Fiber
Copper
Solder Mask
Nickel
Gold
Item
Ag
Diester
Resin
Functionalized ester
Functionalized urethene
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
USEPA3050B. ICP-AES
Not Detected
EN 1122 Method B:2001. ICP-AES
Not Detected
USEPA 3052. ICP-AES
Not Detected
USEPA 3060A & USEPA 7196A
Not Detected
Analysis was performed by GC/MS
Not Detected
Analysis was performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
5.00
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Laminate
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Package Totals
Weight (g)
PPM
1000000
5.12 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/16/06