Materials Declaration Package Body Size LeadCount Option Ball Size Item Fused Silica Epoxy Resin Phenol Resin Crystalline Silica Carbon Black Antimony Trioxide Subtotal BGA 19 x 19 mm 484 SnPbAg 0.45 mm Molding Compound % of Compound 72.77 10.33 10.33 4.69 0.94 0.94 Weight (g) 3.15 E-01 4.47 E-02 4.47 E-02 2.03 E-02 4.07 E-03 4.07 E-03 4.33 E-01 PPM 219446 31151 31151 14143 2835 2835 301562 Item Pb Cd Hg Cr+6 PBB PBDE Mold Compound Method PPM None Detected USEPA 3052. ICP-OES None Detected USEPA 3052. ICP-OES None Detected USEPA 3052. ICP-OES None Detected USEPA 3060A & 7196A. UV-VIS None Detected Analysis was performed by GC/MS. None Detected Analysis was performed by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Item BT Resin Glass fiber Cu Ni Soldermask Au Subtotal Item Sn Pb Ag Subtotal Solder Ball % of Plating 62.0 36.0 2.0 Weight (g) 1.86 E-01 1.72 E-01 1.24 E-01 7.57 E-02 7.57 E-02 5.50 E-02 6.88 E-01 PPM 129463 119874 86309 52744 52744 38359 479494 Weight (g) 1.20 E-01 6.99 E-02 3.88 E-03 1.94 E-01 PPM 83862 48695 2705 135262 Item Bond Wires % of Wire 99.99 Weight (g) 1.35 E-02 PPM 9442 Item Chip % of Chip 100.0 Weight (g) 9.03 E-02 PPM 62941 Weight (g) 1.13 E-02 3.24 E-03 8.11 E-04 8.11 E-04 1.62 E-02 PPM 7910 2260 565 565 11300 Weight (g) 1.43 E+00 PPM 1000000 Au Si Item Ag Epoxy resin Amine Silane Subtotal Laminate % of Laminate 27.00 25.00 18.00 11.00 11.00 8.00 Die Attach % of Die Attach 70.0 20.0 5.0 5.0 Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS Analysis was performed by GC/MS. Analysis was performed by GC/MS. Laminate Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS Analysis was performed by GC/MS. Analysis was performed by GC/MS. Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Ball Size Item Silica fused Epoxy resin Phenol resin Metal hydroxide Carbon black Subtotal Item BT Resin Glass fiber Cu Ni Soldermask Au Subtotal Item Sn Ag Cu Subtotal BGA 19 x 19 mm 484 Pb-free 0.45 mm Molding Compound % of Compound 86.20 6.00 6.00 1.50 0.30 Laminate % of Laminate 27.00 25.00 18.00 11.00 11.00 8.00 Solder Ball % of Plating 96.50 3.00 0.50 Mold Compound Weight (g) 3.73 E-01 2.60 E-02 2.60 E-02 6.49 E-03 1.30 E-03 4.33 E-01 PPM 264287 18397 18397 4599 920 306599 Weight (g) 1.86 E-01 1.72 E-01 1.24 E-01 7.57 E-02 7.57 E-02 5.50 E-02 6.88 E-01 PPM 131625 121876 87751 53625 53625 39000 487501 Weight (g) 1.65 E-01 5.13 E-03 8.55 E-04 1.71 E-01 PPM 116909 3635 606 121149 Item Bond Wires % of Wire 99.99 Weight (g) 1.35 E-02 PPM Item Si Chip % of Chip 100.0 Weight (g) 9.03 E-02 PPM 63992 Weight (g) 1.18 E-02 1.89 E-03 7.87 E-04 7.87 E-04 4.72 E-04 1.57 E-02 PPM Weight (g) 1.41 E+00 PPM 1000000 Ag Diester Epoxy resin Functionalized ester Functionalized urethane Subtotal Die Attach % of Die Attach 75.0 12.0 5.0 5.0 3.0 Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method USEPA 3050B. ICP-AES EN1122: Method B:2001. ICP-AES USEPA 3052. ICP-AES USEPA 3060A & 7196A. Analysis was performed by GC/ECDMS or HPLC/DAD/MS. Analysis was performed by GC/ECDMS or HPLC/DAD/MS. Die Attach Au Item Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.0 PPM None Detected None Detected None Detected None Detected None Detected Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS Analysis was performed by GC/MS. Analysis was performed by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Laminate Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS Analysis was performed by GC/MS. Analysis was performed by GC/MS. Item 9599 8371 1339 558 558 334 11160 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary