Materials Declaration Package Body Size Ball Count Option Ball Size Item BGA 27 X 27 297 Pb-Free 0.6mm Molding Compound % of Compound 10 77 10 0.5 2.5 Weight (g) 1.22E-01 9.40E-01 1.22E-01 6.11E-03 3.05E-02 PPM 47627 366728 47627 2381 11907 Laminate % of Laminate 25 25 19 11 7.8 12.2 Weight (g) 2.71E-01 2.71E-01 2.06E-01 1.19E-01 8.46E-02 9.97E-02 PPM 105691 105691 80325 46504 32975 38894 Sn Ag Cu Solder Ball % of Solder Ball 96.5 3 0.5 Weight (g) 2.40 E-01 7.46 E-03 1.24 E-03 PPM 93600 2909 484 Weight (g) 6.01 E-03 PPM Au Bond Wires % of Wire 99 Si Chip % of Chip 100 Weight (g) 3.19 E-02 PPM 12441 Die Attach % of Die Attach 75 5 12.5 2.5 5 Weight (g) 3.60 E-03 2.40 E-04 6.00 E-04 1.20 E-04 2.40 E-04 PPM Epoxy resin SiO2 Filler Phenol Resin Carbon Black Metal Hydroxide Item BT-Epoxy Glass Fiber Copper Nickel Gold Solder Mask (AUS303) Item Ag Resin Diester Functionalized urethene Functionalized ester Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not detected SGS Test Report Not detected SGS Test Report Not detected SGS Test Report Not detected SGS Test Report Not detected SGS Test Report Not detected SGS Test Report Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not detected US EPA Method #3050B Not detected EN 1122:2001, Method B Not detected US EPA Method #3052 Not detected US EPA Method #7196A, #3060A Not detected US EPA Method #3540 or #3550 Not detected US EPA Method #3540 or #3551 Laminate Item Pb Cd Hg Cr+6 PBB PBDE PPM Method 2344 1404 94 234 47 94 Package Totals PPM Weight (g) 1000000 2.56 E+00 STS-B-J Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1/11/06 Materials Declaration Package Body Size Ball Count Option Ball Size Item BGA 27 X 27 297 SnPbAg 0.6mm Molding Compound % of Compound 71 25 3 1 Weight (g) 8.83900E-01 3.11220E-01 3.73500E-02 1.24489E-02 PPM 337533 118845 14263 4754 Laminate % of Laminate 25 25 19 11 7.8 12.2 Weight (g) 2.71E-01 2.71E-01 2.06E-01 1.19E-01 8.46E-02 9.97E-02 PPM 103486 103486 78649 45534 32288 38083 Solder Ball % of Solder ball 62 36 2 Weight (g) 1.75 E-01 1.02 E-01 5.65 E-03 PPM 66837 38808 2156 Weight (g) 6.01 E-03 PPM Gold Bond Wires % of Wire 99 Si Chip % of Chip 100 Weight (g) 3.19 E-02 PPM 12182 Die Attach % of Die Attach 75 15 5 5 Weight (g) 1.57500E-03 3.15000E-04 1.05000E-04 1.05000E-04 Silica Epoxy Resin Antimony Oxide Carbon Black Item BT-Epoxy Glass Fiber Copper Nickel Gold Solder Mask (AUS5) Tin Lead Silver Item Ag Resin Amine Silane Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not detected US EPA Method #3052 Not detected US EPA Method #3052 Not detected US EPA Method #3052 Not detected US EPA Method #7196A, #3060A Not detected Analysis was performed by GC/MS Not detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not detected US EPA Method #3052 Not detected US EPA Method #3052 Not detected US EPA Method #3052 Not detected US EPA Method #7196A, #3060A Not detected Analysis was performed by GC/MS Not detected Analysis was performed by GC/MS Laminate Item Pb Cd Hg Cr+6 PBB PBDE PPM Method 2295 PPM 601 120 40 40 Package Totals Weight (g) PPM 1000000 2.62 E+00 STS-B-C Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1/11/06