Materials Declaration Package Body Size Ball Count Option CSPBGA 8X8 64 Pb-free Ball Size 0.60 mm Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Item BT Resin Glass fiber Cu Ni Soldermask Au Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Molding Compound Weight (g) 6.05 E-02 4.21 E-03 4.21 E-03 1.05 E-03 2.11 E-04 7.02 E-02 PPM 355211 24722 24722 6183 1239 412077 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 1.67 E-02 1.55 E-02 1.12 E-02 6.82 E-03 6.82 E-03 4.96 E-03 6.20 E-02 PPM 98241 90965 65492 40024 40024 29108 363855 Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 2.18 E-02 6.78 E-04 1.13 E-04 2.26 E-02 PPM 128100 3981 664 132745 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA 3060A & USEPA 7196A USEPA 3540C/3550C. Analysis was performed by GC/MS USEPA 3540C/3550C. Analysis was performed by GC/MS Die Attach Paste Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Sn Ag Cu Solder Ball % of Solder Ball 96.5 3.0 0.5 Au Bond Wires % of Wire 99.99 Weight (g) 5.30 E-04 PPM 3112 Si Chip % of Chip 100.0 Weight (g) 1.35 E-02 PPM 79127 Weight (g) 1.16 E-03 1.86 E-04 7.70 E-05 7.70 E-05 4.60 E-05 1.55 E-03 PPM 6818 1092 452 452 270 9084 Item Ag Diester Epoxy resin Functionalized ester Functionalized urethane Die Attach % of Die Attach 75.0 12.0 5.0 5.0 3.0 Package Totals PPM Weight (g) 1000000 1.70 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Materials Declaration Package Body Size Ball Count Option CSPBGA 8X8 64 Standard Ball Size 0.60 mm Item Silica fused Phenol & Epoxy resin Antimony Oxide Carbon black Item BT Resin Glass fiber Cu Ni Soldermask Au Sn Pb Ag Molding Compound % of Compound 75.5 20.0 3.0 1.5 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Solder Ball % of Solder Ball 62.0 36.0 2.0 Molding Compound Weight (g) 5.30 E-02 1.40 E-02 2.11 E-03 1.05 E-03 7.02 E-02 PPM 305550 80940 12140 6073 404702 Weight (g) 1.67 E-02 1.55 E-02 1.12 E-02 6.82 E-03 6.82 E-03 4.96 E-03 6.20 E-02 PPM 96483 89337 64320 39308 39308 28587 357343 Weight (g) 1.59 E-02 9.24 E-03 5.13 E-04 2.57 E-02 PPM 91754 53276 2958 147988 Bond Wires % of Wire 99.99 Weight (g) 5.30 E-04 PPM Si Chip % of Chip 100.0 Weight (g) 1.35 E-02 PPM 77711 Weight (g) 1.12 E-03 3.19 E-04 8.00 E-05 8.00 E-05 1.60 E-03 PPM Die Attach % of Die Attach 70.0 20.0 5.0 5.0 PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA 3060A & USEPA 7196A USEPA 3540C/3550C. Analysis was performed by GC/MS USEPA 3540C/3550C. Analysis was performed by GC/MS Die Attach Paste Method USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA 3060A & USEPA 7196A USEPA 3540C/3550C. Analysis was performed by GC/MS USEPA 3540C/3550C. Analysis was performed by GC/MS Laminate Au Item Ag Epoxy resin Amine Silane Item Pb Cd Hg Cr+6 PBB PBDE 3057 6436 1840 461 461 9198 Package Totals PPM Weight (g) 1000000 1.73 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS