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Materials Declaration
Package
Body Size
Ball Count
Option
CSPBGA
8X8
64
Pb-free
Ball Size
0.60 mm
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Item
BT Resin
Glass fiber
Cu
Ni
Soldermask
Au
Molding Compound
% of Compound
86.2
6.0
6.0
1.5
0.3
Laminate
% of Laminate
27.0
25.0
18.0
11.0
11.0
8.0
Molding Compound
Weight (g)
6.05 E-02
4.21 E-03
4.21 E-03
1.05 E-03
2.11 E-04
7.02 E-02
PPM
355211
24722
24722
6183
1239
412077
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Weight (g)
1.67 E-02
1.55 E-02
1.12 E-02
6.82 E-03
6.82 E-03
4.96 E-03
6.20 E-02
PPM
98241
90965
65492
40024
40024
29108
363855
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
5.00
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Weight (g)
2.18 E-02
6.78 E-04
1.13 E-04
2.26 E-02
PPM
128100
3981
664
132745
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA 3060A & USEPA 7196A
USEPA 3540C/3550C. Analysis was performed by GC/MS
USEPA 3540C/3550C. Analysis was performed by GC/MS
Die Attach Paste
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Laminate
Sn
Ag
Cu
Solder Ball
% of Solder Ball
96.5
3.0
0.5
Au
Bond Wires
% of Wire
99.99
Weight (g)
5.30 E-04
PPM
3112
Si
Chip
% of Chip
100.0
Weight (g)
1.35 E-02
PPM
79127
Weight (g)
1.16 E-03
1.86 E-04
7.70 E-05
7.70 E-05
4.60 E-05
1.55 E-03
PPM
6818
1092
452
452
270
9084
Item
Ag
Diester
Epoxy resin
Functionalized ester
Functionalized urethane
Die Attach
% of Die Attach
75.0
12.0
5.0
5.0
3.0
Package Totals
PPM
Weight (g)
1000000
1.70 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Materials Declaration
Package
Body Size
Ball Count
Option
CSPBGA
8X8
64
Standard
Ball Size
0.60 mm
Item
Silica fused
Phenol & Epoxy resin
Antimony Oxide
Carbon black
Item
BT Resin
Glass fiber
Cu
Ni
Soldermask
Au
Sn
Pb
Ag
Molding Compound
% of Compound
75.5
20.0
3.0
1.5
Laminate
% of Laminate
27.0
25.0
18.0
11.0
11.0
8.0
Solder Ball
% of Solder Ball
62.0
36.0
2.0
Molding Compound
Weight (g)
5.30 E-02
1.40 E-02
2.11 E-03
1.05 E-03
7.02 E-02
PPM
305550
80940
12140
6073
404702
Weight (g)
1.67 E-02
1.55 E-02
1.12 E-02
6.82 E-03
6.82 E-03
4.96 E-03
6.20 E-02
PPM
96483
89337
64320
39308
39308
28587
357343
Weight (g)
1.59 E-02
9.24 E-03
5.13 E-04
2.57 E-02
PPM
91754
53276
2958
147988
Bond Wires
% of Wire
99.99
Weight (g)
5.30 E-04
PPM
Si
Chip
% of Chip
100.0
Weight (g)
1.35 E-02
PPM
77711
Weight (g)
1.12 E-03
3.19 E-04
8.00 E-05
8.00 E-05
1.60 E-03
PPM
Die Attach
% of Die Attach
70.0
20.0
5.0
5.0
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA 3060A & USEPA 7196A
USEPA 3540C/3550C. Analysis was performed by GC/MS
USEPA 3540C/3550C. Analysis was performed by GC/MS
Die Attach Paste
Method
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA 3060A & USEPA 7196A
USEPA 3540C/3550C. Analysis was performed by GC/MS
USEPA 3540C/3550C. Analysis was performed by GC/MS
Laminate
Au
Item
Ag
Epoxy resin
Amine
Silane
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
3057
6436
1840
461
461
9198
Package Totals
PPM
Weight (g)
1000000
1.73 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS