pdf

Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Item
BT Resin
Glass fiber
Cu
Ni
Soldermask
Au
BGA
19 X 19
324
Pb-free
0.60 mm
Molding Compound
% of Compound
Weight (g)
86.2
3.73 E-01
6.0
2.60 E-02
6.0
2.60 E-02
1.5
6.49 E-03
0.3
1.30 E-03
4.33 E-01
Laminate
% of Laminate
27.0
25.0
18.0
11.0
11.0
8.0
Molding Compound
PPM
281649
19605
19605
4901
980
326740
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Weight (g)
1.49 E-01
1.38 E-01
9.90 E-02
6.05 E-02
6.05 E-02
4.40 E-02
5.50 E-01
PPM
112148
103841
74765
45690
45690
33229
415362
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
5.00
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Weight (g)
2.62 E-01
8.14 E-03
1.36 E-03
2.71 E-01
PPM
197695
6146
1024
204865
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA 3060A & USEPA 7196A
USEPA 3540C/3550C. Analysis was performed by GC/MS
USEPA 3540C/3550C. Analysis was performed by GC/MS
Die Attach Paste
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Laminate
Sn
Ag
Cu
Solder Ball
% of Solder Ball
96.5
3.0
0.5
Bond Wires
% of Wire
99.99
Weight (g)
9.76 E-03
PPM
Au
Si
Chip
% of Chip
100.0
Weight (g)
5.15 E-02
PPM
38884
Weight (g)
6.74 E-03
1.08 E-03
4.49 E-04
4.49 E-04
2.69 E-04
8.98 E-03
PPM
Item
Ag
Diester
Epoxy resin
Functionalized ester
Functionalized urethane
Die Attach
% of Die Attach
75.0
12.0
5.0
5.0
3.0
7367
5086
814
339
339
203
6782
Package Totals
PPM
Weight (g)
1000000
1.32 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
Fused silica
Epoxy resin
Phenol resin
Crystalline silica
Carbon black
Antimony trioxide
BGA
19 X 19
324
Standard
0.60 mm
Molding Compound
% of Compound
72.8
10.3
10.3
4.7
0.9
0.9
Molding Compound
Weight (g)
3.15 E-01
4.47 E-02
4.47 E-02
2.03 E-02
4.07 E-03
4.07 E-03
4.33 E-01
PPM
231363
32843
32843
14911
2989
2989
317938
Weight (g)
1.49 E-01
1.38 E-01
9.90 E-02
6.05 E-02
6.05 E-02
4.40 E-02
5.50 E-01
PPM
109127
101044
72751
44459
44459
32334
404174
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA 3060A & USEPA 7196A
USEPA 3540C/3550C. Analysis was performed by GC/MS
USEPA 3540C/3550C. Analysis was performed by GC/MS
Die Attach Paste
Item
BT Resin
Glass fiber
Cu
Ni
Soldermask
Au
Sn
Pb
Ag
Laminate
% of Laminate
27.0
25.0
18.0
11.0
11.0
8.0
Solder Ball
% of Solder Ball
62.0
36.0
2.0
Weight (g)
1.91 E-01
1.11 E-01
6.16 E-03
3.08 E-01
PPM
140296
81462
4526
226283
Bond Wires
% of Wire
99.99
Weight (g)
9.76 E-03
PPM
Au
Si
Chip
% of Chip
100.0
Weight (g)
5.15 E-02
PPM
37837
Weight (g)
6.33 E-03
1.58 E-03
5.94 E-04
2.37 E-04
2.37 E-04
8.98 E-03
PPM
Item
Ag
Epoxy resin
Silane compound
Phenolic resin
Curing agent & hardener
Die Attach
% of Die Attach
70.5
17.6
6.6
2.6
2.6
Laminate
7169
4652
1163
437
174
174
6599
Package Totals
PPM
Weight (g)
1000000
1.36 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA3052. ICP-OES
USEPA 3060A & USEPA 7196A
USEPA 3540C/3550C. Analysis was performed by GC/MS
USEPA 3540C/3550C. Analysis was performed by GC/MS
Method
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3052. ICP-OES
US EPA Method 3060A & 7196A. UV-VIS
Analysis was performed by GC/MS
Analysis was performed by GC/MS