Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Item BT Resin Glass fiber Cu Ni Soldermask Au BGA 19 X 19 324 Pb-free 0.60 mm Molding Compound % of Compound Weight (g) 86.2 3.73 E-01 6.0 2.60 E-02 6.0 2.60 E-02 1.5 6.49 E-03 0.3 1.30 E-03 4.33 E-01 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Molding Compound PPM 281649 19605 19605 4901 980 326740 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 1.49 E-01 1.38 E-01 9.90 E-02 6.05 E-02 6.05 E-02 4.40 E-02 5.50 E-01 PPM 112148 103841 74765 45690 45690 33229 415362 Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 2.62 E-01 8.14 E-03 1.36 E-03 2.71 E-01 PPM 197695 6146 1024 204865 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA 3060A & USEPA 7196A USEPA 3540C/3550C. Analysis was performed by GC/MS USEPA 3540C/3550C. Analysis was performed by GC/MS Die Attach Paste Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Sn Ag Cu Solder Ball % of Solder Ball 96.5 3.0 0.5 Bond Wires % of Wire 99.99 Weight (g) 9.76 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 5.15 E-02 PPM 38884 Weight (g) 6.74 E-03 1.08 E-03 4.49 E-04 4.49 E-04 2.69 E-04 8.98 E-03 PPM Item Ag Diester Epoxy resin Functionalized ester Functionalized urethane Die Attach % of Die Attach 75.0 12.0 5.0 5.0 3.0 7367 5086 814 339 339 203 6782 Package Totals PPM Weight (g) 1000000 1.32 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Materials Declaration Package Body Size Ball Count Option Ball Size Item Fused silica Epoxy resin Phenol resin Crystalline silica Carbon black Antimony trioxide BGA 19 X 19 324 Standard 0.60 mm Molding Compound % of Compound 72.8 10.3 10.3 4.7 0.9 0.9 Molding Compound Weight (g) 3.15 E-01 4.47 E-02 4.47 E-02 2.03 E-02 4.07 E-03 4.07 E-03 4.33 E-01 PPM 231363 32843 32843 14911 2989 2989 317938 Weight (g) 1.49 E-01 1.38 E-01 9.90 E-02 6.05 E-02 6.05 E-02 4.40 E-02 5.50 E-01 PPM 109127 101044 72751 44459 44459 32334 404174 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA 3060A & USEPA 7196A USEPA 3540C/3550C. Analysis was performed by GC/MS USEPA 3540C/3550C. Analysis was performed by GC/MS Die Attach Paste Item BT Resin Glass fiber Cu Ni Soldermask Au Sn Pb Ag Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Solder Ball % of Solder Ball 62.0 36.0 2.0 Weight (g) 1.91 E-01 1.11 E-01 6.16 E-03 3.08 E-01 PPM 140296 81462 4526 226283 Bond Wires % of Wire 99.99 Weight (g) 9.76 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 5.15 E-02 PPM 37837 Weight (g) 6.33 E-03 1.58 E-03 5.94 E-04 2.37 E-04 2.37 E-04 8.98 E-03 PPM Item Ag Epoxy resin Silane compound Phenolic resin Curing agent & hardener Die Attach % of Die Attach 70.5 17.6 6.6 2.6 2.6 Laminate 7169 4652 1163 437 174 174 6599 Package Totals PPM Weight (g) 1000000 1.36 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA3052. ICP-OES USEPA 3060A & USEPA 7196A USEPA 3540C/3550C. Analysis was performed by GC/MS USEPA 3540C/3550C. Analysis was performed by GC/MS Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS