pdf

Materials Declaration
Package
Body Size
LeadCount
Option
PLCC
4.4
44
PbFree
Molding Compound
% of Compound
Weight (g)
2
3.53 E-02
86
1.52 E+00
4
7.06 E-02
7.5
1.32 E-01
0.5
8.82 E-03
PPM
14577
626820
29155
54665
3644
Cu
Zr
Leadframe
% of Leadframe
99.9
0.1
PPM
235678
236
PPM
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
3.92 E-03
100
PPM
Sn
External Leadframe Plating
% of Plating
Weight (g)
100
2.22 E-02
Item
Epoxy Cresol Novolac
SiO2 Filler
Phenol Resin
Epoxy Resin
Carbon Black
Item
Item
Weight (g)
5.70 E-01
5.71 E-04
1620
Weight (g)
1.98 E-03
PPM
Au
Si
Chip
% of Chip
100
Weight (g)
4.99 E-02
PPM
20626
Die Attach
% of Die Attach
25
75
Weight (g)
1.80 E-03
5.41 E-03
PPM
Resin
Ag Filler
Package Totals
Weight (g)
2.42 E+00
PPM
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Molding Compound
Method
Die Attach Paste
Method
9178
Bond Wires
% of Wire
99.9
Item
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
819
745
2237
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
12/23/05
Materials Declaration
Package
Body Size
LeadCount
Option
PLCC
4.4
44
Sn/Pb
Molding Compound
% of Compound
Weight (g)
16
2.78 E-01
72
1.25 E+00
8
1.39 E-01
2.2
3.83 E-02
1.6
2.78 E-02
0.2
3.48 E-03
PPM
131654
592445
65827
18102
13165
1646
Item
Pb
Cd
Hg
Cr+6
Cu
Zr
Leadframe
% of Leadframe
99.9
0.1
PPM
158825
159
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
2.63 E-03
100
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
85
7.14 E-04
15
1.26 E-04
Item
Epoxy Cresol Novolac
SiO2 Filler
Phenol Novolac
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Item
Die Attach Paste
Weight (g)
3.36 E-01
3.36 E-04
PPM
1244
Method
ICP AES
ICP AES
ICP AES
ICP AES
338
60
Weight (g)
1.41 E-03
PPM
Au
Si
Chip
% of Chip
100
Weight (g)
2.96 E-02
PPM
13978
Die Attach
% of Die Attach
25
75
Weight (g)
1.00 E-03
3.00 E-03
PPM
Resin
Ag Filler
PPM
<2
<2
<2
<2
Not Detected
Not Detected
PPM
Bond Wires
% of Wire
99.99
Item
Molding Compound
Method
PPM
<2
US EPA method #3052 & 6010B
Not Detected BS EN 1122:2001 ICP AES
<2
US EPA method #3052 & 7471A
<2
US EPA method #3060A & 6010B
665
473
1419
Package Totals
Weight (g)
PPM
1000000
2.11 E+00
AMK-P-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
12/23/05