Materials Declaration Package Body Size LeadCount Option PLCC 4.4 44 PbFree Molding Compound % of Compound Weight (g) 2 3.53 E-02 86 1.52 E+00 4 7.06 E-02 7.5 1.32 E-01 0.5 8.82 E-03 PPM 14577 626820 29155 54665 3644 Cu Zr Leadframe % of Leadframe 99.9 0.1 PPM 235678 236 PPM Ag Internal Leadframe Plating % of Plating Weight (g) 3.92 E-03 100 PPM Sn External Leadframe Plating % of Plating Weight (g) 100 2.22 E-02 Item Epoxy Cresol Novolac SiO2 Filler Phenol Resin Epoxy Resin Carbon Black Item Item Weight (g) 5.70 E-01 5.71 E-04 1620 Weight (g) 1.98 E-03 PPM Au Si Chip % of Chip 100 Weight (g) 4.99 E-02 PPM 20626 Die Attach % of Die Attach 25 75 Weight (g) 1.80 E-03 5.41 E-03 PPM Resin Ag Filler Package Totals Weight (g) 2.42 E+00 PPM Item Pb Cd Hg Cr+6 PBB PBDE PPM Molding Compound Method Die Attach Paste Method 9178 Bond Wires % of Wire 99.9 Item Item Pb Cd Hg Cr+6 PBB PBDE 819 745 2237 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 12/23/05 Materials Declaration Package Body Size LeadCount Option PLCC 4.4 44 Sn/Pb Molding Compound % of Compound Weight (g) 16 2.78 E-01 72 1.25 E+00 8 1.39 E-01 2.2 3.83 E-02 1.6 2.78 E-02 0.2 3.48 E-03 PPM 131654 592445 65827 18102 13165 1646 Item Pb Cd Hg Cr+6 Cu Zr Leadframe % of Leadframe 99.9 0.1 PPM 158825 159 Ag Internal Leadframe Plating % of Plating Weight (g) 2.63 E-03 100 Item Pb Cd Hg Cr+6 PBB PBDE Sn Pb External Leadframe Plating % of Plating Weight (g) 85 7.14 E-04 15 1.26 E-04 Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Die Attach Paste Weight (g) 3.36 E-01 3.36 E-04 PPM 1244 Method ICP AES ICP AES ICP AES ICP AES 338 60 Weight (g) 1.41 E-03 PPM Au Si Chip % of Chip 100 Weight (g) 2.96 E-02 PPM 13978 Die Attach % of Die Attach 25 75 Weight (g) 1.00 E-03 3.00 E-03 PPM Resin Ag Filler PPM <2 <2 <2 <2 Not Detected Not Detected PPM Bond Wires % of Wire 99.99 Item Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B 665 473 1419 Package Totals Weight (g) PPM 1000000 2.11 E+00 AMK-P-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 12/23/05