Materials Declaration Package Body Size LeadCount Option SOIC 300 mils 24 PbFree - Batwing Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Leadframe Item Cu Fe P Zn Molding Compound % of Compound Weight (g) 5.9 2.77 E-02 87 4.12 E-01 3 1.42 E-02 4.15 1.97 E-02 PPM 41811 621816 21442 29661 % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 1.72 E-01 4.15 E-03 5.30 E-05 2.12 E-04 PPM 259414 6252 80 320 Weight (g) 1.41 E-03 PPM 100 Weight (g) 4.43 E-03 PPM 100 Weight (g) 8.50 E-04 PPM 99.99 Weight (g) 4.66 E-03 PPM 100 Weight (g) 2.75 E-04 1.03 E-03 6.90 E-05 PPM 20 75 5 Internal Leadframe Plating % of Plating Ag External Leadframe Plating Item Sn % of Plating 2131 Item Pb Cd Hg Cr+6 PBB PBDE PPM Item Pb Cd Hg Cr+6 PBB PBDE PPM Molding Compound Method Die Attach Paste 6687 Bond Wires % of Wire Au 1282 Chip % of Chip Si Die Attach Item Resin Ag Filler Aromatic Amine % of Die Attach Package Totals Weight (g) 6.63 E-01 7030 415 1555 104 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method Materials Declaration Package Body Size LeadCount Option SOIC 300 mils 24 SnPb - Batwing Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Leadframe Item Cu Fe P Zn Molding Compound % of Compound Weight (g) 5.9 2.77 E-02 87 4.12 E-01 3 1.42 E-02 4.15 1.97 E-02 PPM 41788 621474 21431 29645 % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 1.72 E-01 4.15 E-03 5.30 E-05 2.12 E-04 PPM 259271 6249 80 320 Weight (g) 1.41 E-03 PPM 100 Weight (g) 4.08 E-03 7.20 E-04 PPM 85 15 Weight (g) 8.50 E-04 PPM 99.99 Weight (g) 4.66 E-03 PPM 100 Weight (g) 2.75 E-04 1.03 E-03 6.90 E-05 PPM 20 75 5 Internal Leadframe Plating % of Plating Ag External Leadframe Plating Item Sn Pb % of Plating 2130 Item Pb Cd Hg Cr+6 PBB PBDE PPM Item Pb Cd Hg Cr+6 PBB PBDE PPM Molding Compound Method Die Attach Paste 6148 1085 Bond Wires % of Wire Au 1281 Chip % of Chip Si Die Attach Item Resin Ag Filler Aromatic Amine % of Die Attach Package Totals Weight (g) 6.63 E-01 7026 414 1554 104 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method Materials Declaration Package Body Size LeadCount Option SOIC 300 mils 24 Pb Free Molding Compound % of Compound Weight (g) 10 3.95 E-02 85 3.35 E-01 3 1.18 E-02 1.5 5.92 E-03 0.5 1.97 E-03 PPM 62281 529390 18684 9342 3114 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 310453 7483 96 382 Internal Leadframe Plating % of Plating Weight (g) 1.82 E-03 100 PPM Ag External Leadframe Plating % of Plating Weight (g) 100 4.27 E-03 PPM Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Item Sn Au Si Item Resin Ag Filler Weight (g) 1.97 E-01 4.74 E-03 6.05 E-05 2.42 E-04 Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 2868 6739 Bond Wires % of Wire 99.99 Weight (g) 1.02 E-03 PPM Chip % of Chip 100 Weight (g) 2.79 E-02 PPM 43991 Die Attach % of Die Attach 25 75 Weight (g) 5.65 E-04 1.70 E-03 PPM 1610 892 2675 Package Totals Weight (g) PPM 1000000 6.34 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn Molding Compound % of Compound Weight (g) 10 3.95 E-02 85 3.35 E-01 3 1.18 E-02 1.5 5.92 E-03 0.5 1.97 E-03 PPM 62281 529390 18684 9342 3114 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 310453 7483 96 382 Weight (g) 1.97 E-01 4.74 E-03 6.05 E-05 2.42 E-04 Internal Leadframe Plating % of Plating Weight (g) 1.82 E-03 100 Ag Item Sn Pb Au Si Item Resin Ag Filler SOIC 300 mils 24 Sn/Pb External Leadframe Plating % of Plating Weight (g) 85 3.63 E-03 15 6.41 E-04 PPM Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 2868 PPM 5728 1011 Bond Wires % of Wire 99.99 Weight (g) 1.02 E-03 PPM Chip % of Chip 100 Weight (g) 2.79 E-02 PPM 43991 Die Attach % of Die Attach 25 75 Weight (g) 5.65 E-04 1.70 E-03 PPM 1610 892 2675 Package Totals Weight (g) PPM 1000000 6.34 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary