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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon Black
Subtotal
Item
Cu
FE
Zn
P
Subtotal
Ag
Item
Sn
TQFP - EP
14 X 14 X 1.0
80
Pb-free
Molding Compound
% of Compound
88
11.5
0.5
Weight (g)
2.80 E-01
3.65 E-02
1.59 E-03
3.18 E-01
PPM
514410
67224
2923
584558
Weight (g)
1.77 E-01
4.37 E-03
2.18 E-04
5.50 E-05
1.82 E-01
PPM
326086
8031
401
101
334619
Internal Leadframe Plating
% of Plating
Weight (g)
8.00 E-04
100
PPM
1472
External Leadframe Plating
Weight (g)
% of Plating
100
1.39 E-02
PPM
25570
Leadframe
% of Leadframe
97.45
2.4
0.12
0.03
Au
Bond Wires
% of Wire
99.99
Weight (g)
2.80 E-03
PPM
5151
Si
Chip
% of Chip
100
Weight (g)
2.21 E-02
PPM
40625
Weight (g)
3.05 E-03
8.70 E-04
4.35 E-04
4.35 E-03
PPM
5604
1601
800
8005
Item
Ag Filler
Resin
Anhydride
Subtotal
Die Attach
% of Die Attach
70
20
10
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES or USEPA 7473. Hg Analyzer.
USEPA 3060A & 7196A.
USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS.
USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
Analysis was performed by GC/MS.
Analysis was performed by GC/MS.
Package Totals
PPM
Weight (g)
1000000
5.44 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary