Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon black Subtotal Item Cu Cr Sn Zn Subtotal TQFP_EP 7 x 7 x 1.0 (3.5 mm exposed pad) 48 Pb-free Molding Compound % of Compound Weight (g) 88.00 6.98 E-02 11.50 9.12 E-03 0.50 3.97 E-04 7.93 E-02 Leadframe % of Leadframe 99.25 0.30 0.25 0.20 Weight (g) 4.10 E-02 1.24 E-04 1.03 E-04 8.30 E-05 4.13 E-02 Ag Internal Leadframe Plating % of Plating Weight (g) 5.60 E-04 100.0 Sn External Leadframe Plating % of Plating Weight (g) 100.0 3.64 E-03 Item Au Bond Wires % of Wire 99.99 PPM 513753 67137 2922 583812 PPM 301810 913 758 611 304092 PPM 4122 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method USEPA 3052. ICP-AES. USEPA 3052. ICP-AES. USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 8081A/8270D/3540C/3550C.GC/MS. USEPA 8081A/8270D/3540C/3550C.GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method /3550C. GC/MS. EPA Method /3550C. GC/MS. PPM 26800 Weight (g) 1.26 E-03 PPM Weight (g) 7.34 E-03 PPM 54042 Weight (g) 1.70 E-03 4.86 E-04 2.43 E-04 2.43 E-03 PPM 12528 3577 1789 17894 9238 Chip Si Item Ag Resin Anhydride Subtotal % of Chip 100.0 Die Attach % of Die Attach 70.0 20.0 10.0 Package Totals PPM Weight (g) 1000000 1.36 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon black Subtotal Item Cu Cr Sn Zn Subtotal TQFP_EP 7 x 7 x 1.0 (3.5 mm exposed pad) 48 SnPb Molding Compound % of Compound Weight (g) 88.00 6.98 E-02 11.50 9.12 E-03 0.50 3.97 E-04 7.93 E-02 Leadframe % of Leadframe 99.25 0.30 0.25 0.20 Weight (g) 4.10 E-02 1.24 E-04 1.03 E-04 8.30 E-05 4.13 E-02 Ag Internal Leadframe Plating % of Plating Weight (g) 5.60 E-04 100.0 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 85.0 3.35 E-03 15.0 5.91 E-04 3.94 E-03 Item Bond Wires % of Wire 99.99 Au PPM 512621 66989 2916 582526 PPM 301145 911 756 610 303422 PPM 4113 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method USEPA 3052. ICP-AES. USEPA 3052. ICP-AES. USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 8081A/8270D/3540C/3550C.GC/MS. USEPA 8081A/8270D/3540C/3550C.GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method /3550C. GC/MS. EPA Method /3550C. GC/MS. PPM 24604 4341 28945 Weight (g) 1.26 E-03 PPM Weight (g) 7.34 E-03 PPM Weight (g) 1.70 E-03 4.86 E-04 2.43 E-04 2.43 E-03 PPM 9217 Chip % of Chip 100.0 Si Item Ag Resin Anhydride Subtotal Die Attach % of Die Attach 70.0 20.0 10.0 53923 12500 3569 1785 17854 Package Totals Weight (g) PPM 1000000 1.36 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary