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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon black
Subtotal
Item
Cu
Cr
Sn
Zn
Subtotal
TQFP_EP
7 x 7 x 1.0 (3.5 mm exposed pad)
48
Pb-free
Molding Compound
% of Compound
Weight (g)
88.00
6.98 E-02
11.50
9.12 E-03
0.50
3.97 E-04
7.93 E-02
Leadframe
% of Leadframe
99.25
0.30
0.25
0.20
Weight (g)
4.10 E-02
1.24 E-04
1.03 E-04
8.30 E-05
4.13 E-02
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
5.60 E-04
100.0
Sn
External Leadframe Plating
% of Plating
Weight (g)
100.0
3.64 E-03
Item
Au
Bond Wires
% of Wire
99.99
PPM
513753
67137
2922
583812
PPM
301810
913
758
611
304092
PPM
4122
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 8081A/8270D/3540C/3550C.GC/MS.
USEPA 8081A/8270D/3540C/3550C.GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method /3550C. GC/MS.
EPA Method /3550C. GC/MS.
PPM
26800
Weight (g)
1.26 E-03
PPM
Weight (g)
7.34 E-03
PPM
54042
Weight (g)
1.70 E-03
4.86 E-04
2.43 E-04
2.43 E-03
PPM
12528
3577
1789
17894
9238
Chip
Si
Item
Ag
Resin
Anhydride
Subtotal
% of Chip
100.0
Die Attach
% of Die Attach
70.0
20.0
10.0
Package Totals
PPM
Weight (g)
1000000
1.36 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon black
Subtotal
Item
Cu
Cr
Sn
Zn
Subtotal
TQFP_EP
7 x 7 x 1.0 (3.5 mm exposed pad)
48
SnPb
Molding Compound
% of Compound
Weight (g)
88.00
6.98 E-02
11.50
9.12 E-03
0.50
3.97 E-04
7.93 E-02
Leadframe
% of Leadframe
99.25
0.30
0.25
0.20
Weight (g)
4.10 E-02
1.24 E-04
1.03 E-04
8.30 E-05
4.13 E-02
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
5.60 E-04
100.0
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
Weight (g)
85.0
3.35 E-03
15.0
5.91 E-04
3.94 E-03
Item
Bond Wires
% of Wire
99.99
Au
PPM
512621
66989
2916
582526
PPM
301145
911
756
610
303422
PPM
4113
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 8081A/8270D/3540C/3550C.GC/MS.
USEPA 8081A/8270D/3540C/3550C.GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method /3550C. GC/MS.
EPA Method /3550C. GC/MS.
PPM
24604
4341
28945
Weight (g)
1.26 E-03
PPM
Weight (g)
7.34 E-03
PPM
Weight (g)
1.70 E-03
4.86 E-04
2.43 E-04
2.43 E-03
PPM
9217
Chip
% of Chip
100.0
Si
Item
Ag
Resin
Anhydride
Subtotal
Die Attach
% of Die Attach
70.0
20.0
10.0
53923
12500
3569
1785
17854
Package Totals
Weight (g)
PPM
1000000
1.36 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary