Materials Declaration Package Body Size LeadCount Option Ball Size CSP_BGA - Stacked Die 6 x 6 mm 84 PbFree 0.30 mm Item Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Weight (g) 4.16 E-02 2.89 E-03 2.89 E-03 7.23 E-04 1.45 E-04 PPM 476077 33138 33138 8284 1657 Weight (g) 9.04 E-03 7.14 E-03 5.65 E-03 9.04 E-05 6.78 E-04 PPM 103565 81816 64728 1036 7767 Weight (g) 8.48 E-03 2.63 E-04 4.76 E-05 PPM 97063 3011 545 Bond Wires % of Wire 99.00 1.0 Weight (g) 1.42 E-03 1.43 E-05 PPM 16212 164 Chip % of Chip 100.0 Weight (g) 5.67 E-03 PPM 64929 Silicon dioxide Diester resin Functionalized este Epoxy resin Polymeric materia Die Attach 1 % of Die Attach 42.5 27.5 15.0 7.5 7.5 Weight (g) 1.28 E-04 8.25 E-05 4.50 E-05 2.25 E-05 2.25 E-05 PPM 1460 945 515 258 258 Item Proprietary filler Proprietary bismaleimide Proprietary polymer Die Attach 2 % of Die Attach 40.0 40.0 20.0 Weight (g) 2.80 E-05 2.80 E-05 1.40 E-05 PPM Item Mixture of fused and amorphous silica Bismaleimide resin Di-ester resin Functionalize ester Epoxy resin Polymeric materia 1,3-di-2-propenyl-2 benzene, epoxidize Die Attach 3 % of Die Attach 30.0 20.0 15.0 15.0 7.5 7.5 5.0 Weight (g) 6.90 E-05 4.60 E-05 3.45 E-05 3.45 E-05 1.73 E-05 1.73 E-05 1.15 E-05 PPM Weight (g) 8.73 E-02 PPM 1000000 SiO2 Filler Epoxy resin Phenol resin Metal Hydroxide Carbon black Item Cu Fiber glass Epoxy Resin Nickel Au Laminate % of Laminate 40.0 31.6 25.0 3.0 0.4 Solder Ball % of Plating 96.5 3.0 0.50 Sn Ag Cu Au Pd Si Item Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Mold Compound Method USEPA Method 3052; Analysis was performed by ICP-AES USEPA Method 3052; Analysis was performed by ICP-AES USEPA Method 3052; Analysis was performed by ICP-AES USEPA 7196A & USEPA 3060A USEPA 8081A/8270D/3540C/3550C. Analysis was performed by GC/MS USEPA 8081A/8270D/3540C/3550C. Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach 1 Method USEPA Method 3052; Analysis was performed by ICP-AES USEPA Method 3052; Analysis was performed by ICP-AES USEPA Method 3052; Analysis was performed by ICP-AES US EPA 3060A. UV-VIS US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS US EPA 3540C/3550C. Analysis was performed by HPLC/DAD, LC/MS or GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method US EPA 3050B, USEPA6010B. ICP US EPA 3050B, USEPA6010B, ICP US EPA 3052, USEPA 6010B, ICP US EPA 3060A, USEPA 7196A, UV. US EPA 3540C. Analysis was performed by GC/MS US EPA 3540C. Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Laminate Method EPA Method 3052; Analysis was performed by ICP-AES EPA Method 3052; Analysis was performed by ICP-AES EPA Method 3052; Analysis was performed by ICP-AES EPA 3060A. UV-VIS Analysis was performed by GC/MS. Analysis was performed by GC/MS. Die Attach 2 Die Attach 3 321 321 160 790 527 395 395 198 198 132 Note: The information provided in this declaration are true to the best of ADI's knowledg ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liabili any inaccuracy of such information ADI Proprietary Method US EPA 3050B, USEPA6010B. US EPA 3050B, USEPA6010B. US EPA 3052, USEPA 6010B. US EPA 3060A, USEPA 7196A. US EPA 3540C. Analysis was performed by GC/MS US EPA 3540C. Analysis was performed by GC/MS