Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black Subtotal Item Cu Cr Sn Zn Subtotal Ag Item Sn TQFP - EP 12 X 12 X 1.0 (6.0 mm ep) 80 Pb-Free Molding Compound % of Compound 88 11.5 0.5 Molding Compound Weight (g) 2.11 E-01 2.75 E-02 1.20 E-03 2.39 E-01 PPM 556661 72746 3163 632570 Weight (g) 1.07 E-01 3.23 E-04 2.69 E-04 2.15 E-04 1.08 E-01 PPM 282236 854 711 568 284369 Internal Leadframe Plating % of Plating 100 Weight (g) 9.60 E-04 PPM 2537 External Leadframe Plating % of Plating 100 Weight (g) 7.37 E-03 PPM 19474 Leadframe % of Leadframe 99.25 0.3 0.25 0.2 Au Bond Wires % of Wire 99.99 Weight (g) 1.66 E-03 PPM 4395 Si Chip % of Chip 100 Weight (g) 1.74 E-02 PPM 46094 Weight (g) 2.80 E-03 7.99 E-04 4.00 E-04 4.00 E-03 PPM 7392 2112 1057 10560 Item Ag Filler Resin Anhydride Subtotal Die Attach % of Die Attach 70 20 10 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method USEPA 3052. ICP-AES. USEPA 3052. ICP-AES. USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 8081A/8270D/3540C or 3550C. GC/MS. USEPA 8081A/8270D/3540C or 3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Package Totals PPM Weight (g) 1000000 3.78 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black Subtotal Item Cu Cr Sn Zn Subtotal TQFP - EP 12 X 12 X 1.0 (6.0 mm ep) 80 SnPb Molding Compound % of Compound 88 11.5 0.5 Leadframe % of Leadframe 99.25 0.3 0.25 0.2 Internal Leadframe Plating % of Plating 100 Ag Item Sn Pb Subtotal External Leadframe Plating % of Plating 85 15 Molding Compound Weight (g) 2.08 E-01 2.71 E-02 1.18 E-03 2.36 E-01 PPM 546110 71367 3103 620580 Weight (g) 1.07 E-01 3.23 E-04 2.69 E-04 2.15 E-04 1.08 E-01 PPM 280823 849 707 565 282945 Weight (g) 9.60 E-04 PPM Weight (g) 6.78 E-03 1.20 E-03 7.98 E-03 PPM 17825 3145 20970 Bond Wires % of Wire 99.99 Weight (g) 1.66 E-03 PPM Si Chip % of Chip 100 Weight (g) 2.16 E-02 PPM 56723 Weight (g) 3.16 E-03 9.04 E-04 4.52 E-04 4.52 E-03 PPM Item Die Attach % of Die Attach 70 20 10 PPM None Detected None Detected None Detected None Detected None Detected None Detected Method USEPA 3052. ICP-AES. USEPA 3052. ICP-AES. USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 8081A/8270D/3540C or 3550C. GC/MS. USEPA 8081A/8270D/3540C or 3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. 2524 Au Ag Filler Resin Anhydride Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 4373 8320 2377 1189 11885 Package Totals Weight (g) PPM 1000000 3.80 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary