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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon Black
Subtotal
Item
Cu
Cr
Sn
Zn
Subtotal
Ag
Item
Sn
TQFP - EP
12 X 12 X 1.0 (6.5 mm ep)
80
Pb-free
Molding Compound
% of Compound
88
11.5
0.5
Molding Compound
Weight (g)
2.11 E-01
2.75 E-02
1.20 E-03
2.39 E-01
PPM
556661
72746
3163
632570
Weight (g)
1.07 E-01
3.23 E-04
2.69 E-04
2.15 E-04
1.08 E-01
PPM
282236
854
711
568
284369
Internal Leadframe Plating
% of Plating
100
Weight (g)
9.60 E-04
PPM
2537
External Leadframe Plating
% of Plating
100
Weight (g)
7.37 E-03
PPM
19474
Leadframe
% of Leadframe
99.25
0.3
0.25
0.2
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.66 E-03
PPM
4395
Si
Chip
% of Chip
100
Weight (g)
1.74 E-02
PPM
46094
Weight (g)
2.80 E-03
7.99 E-04
4.00 E-04
4.00 E-03
PPM
7392
2112
1057
10560
Item
Ag Filler
Resin
Anhydride
Subtotal
Die Attach
% of Die Attach
70
20
10
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 8081A/8270D/3540C or 3550C. GC/MS.
USEPA 8081A/8270D/3540C or 3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Package Totals
PPM
Weight (g)
1000000
3.78 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary