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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon Black
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Sn
TQFP - EP (6.0 mm)
10 X 10 X 1.0
64
Pb-free
Molding Compound
% of Compound
88
11.5
0.5
Weight (g)
1.36 E-01
1.77 E-02
7.71 E-04
1.54 E-01
PPM
493638
64509
2804
560950
Weight (g)
8.21 E-02
2.02 E-03
1.01 E-04
2.50 E-05
8.43 E-02
PPM
298683
7357
367
91
306498
Internal Leadframe Plating
% of Plating
Weight (g)
9.60 E-04
100
PPM
3491
External Leadframe Plating
Weight (g)
% of Plating
100
6.50 E-03
PPM
23623
Leadframe
% of Leadframe
97.45
2.40
0.12
0.03
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.52 E-03
PPM
5542
Si
Chip
% of Chip
100
Weight (g)
2.28 E-02
PPM
82891
Weight (g)
3.27 E-03
9.35 E-04
4.68 E-04
4.68 E-03
PPM
11902
3400
1702
17004
Item
Ag Filler
Resin
Anhydride
Subtotal
Die Attach
% of Die Attach
70
20
10
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS.
USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
Analysis was performed by GC/MS.
Analysis was performed by GC/MS.
Package Totals
PPM
Weight (g)
1000000
2.75 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multi-aromatic Resin
Carbon Black
Item
Cu
Fe
Zn
P
TQFP - EP (6.0 mm)
10 X 10 X 1.0
64
SnPb
Molding Compound
% of Compound
88
11.5
0.5
Leadframe
% of Leadframe
97.45
2.40
0.12
0.03
Weight (g)
1.36 E-01
1.77 E-02
7.71 E-04
1.54 E-01
PPM
492679
64383
2798
559861
Weight (g)
8.21 E-02
2.02 E-03
1.01 E-04
2.50 E-05
8.43 E-02
PPM
298103
7342
367
91
305903
Internal Leadframe Plating
% of Plating
Weight (g)
9.60 E-04
100
Ag
Item
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85
5.98 E-03
15
1.06 E-03
7.03 E-03
PPM
Weight (g)
1.52 E-03
PPM
Si
Chip
% of Chip
100
Weight (g)
2.28 E-02
PPM
82730
Weight (g)
3.27 E-03
9.35 E-04
4.68 E-04
4.68 E-03
PPM
11879
3394
1699
16971
Die Attach
% of Die Attach
70
20
10
Molding Compound
Method
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES.
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS.
USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3060A & 7196A. UV-VIS.
Analysis was performed by GC/MS.
Analysis was performed by GC/MS.
PPM
21690
3829
25519
Bond Wires
% of Wire
99.99
Item
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
3484
Au
Ag Filler
Resin
Anhydride
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
5531
Package Totals
Weight (g)
PPM
1000000
2.76 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary