Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn TQFP - EP (6.0 mm) 10 X 10 X 1.0 64 Pb-free Molding Compound % of Compound 88 11.5 0.5 Weight (g) 1.36 E-01 1.77 E-02 7.71 E-04 1.54 E-01 PPM 493638 64509 2804 560950 Weight (g) 8.21 E-02 2.02 E-03 1.01 E-04 2.50 E-05 8.43 E-02 PPM 298683 7357 367 91 306498 Internal Leadframe Plating % of Plating Weight (g) 9.60 E-04 100 PPM 3491 External Leadframe Plating Weight (g) % of Plating 100 6.50 E-03 PPM 23623 Leadframe % of Leadframe 97.45 2.40 0.12 0.03 Au Bond Wires % of Wire 99.99 Weight (g) 1.52 E-03 PPM 5542 Si Chip % of Chip 100 Weight (g) 2.28 E-02 PPM 82891 Weight (g) 3.27 E-03 9.35 E-04 4.68 E-04 4.68 E-03 PPM 11902 3400 1702 17004 Item Ag Filler Resin Anhydride Subtotal Die Attach % of Die Attach 70 20 10 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method USEPA 3052. ICP-AES. USEPA 3052. ICP-AES. USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS. USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. Analysis was performed by GC/MS. Analysis was performed by GC/MS. Package Totals PPM Weight (g) 1000000 2.75 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multi-aromatic Resin Carbon Black Item Cu Fe Zn P TQFP - EP (6.0 mm) 10 X 10 X 1.0 64 SnPb Molding Compound % of Compound 88 11.5 0.5 Leadframe % of Leadframe 97.45 2.40 0.12 0.03 Weight (g) 1.36 E-01 1.77 E-02 7.71 E-04 1.54 E-01 PPM 492679 64383 2798 559861 Weight (g) 8.21 E-02 2.02 E-03 1.01 E-04 2.50 E-05 8.43 E-02 PPM 298103 7342 367 91 305903 Internal Leadframe Plating % of Plating Weight (g) 9.60 E-04 100 Ag Item Sn Pb External Leadframe Plating Weight (g) % of Plating 85 5.98 E-03 15 1.06 E-03 7.03 E-03 PPM Weight (g) 1.52 E-03 PPM Si Chip % of Chip 100 Weight (g) 2.28 E-02 PPM 82730 Weight (g) 3.27 E-03 9.35 E-04 4.68 E-04 4.68 E-03 PPM 11879 3394 1699 16971 Die Attach % of Die Attach 70 20 10 Molding Compound Method USEPA 3052. ICP-AES. USEPA 3052. ICP-AES. USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS. USEPA 8081A/8270D/3540C/3550C. Analysis by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3060A & 7196A. UV-VIS. Analysis was performed by GC/MS. Analysis was performed by GC/MS. PPM 21690 3829 25519 Bond Wires % of Wire 99.99 Item PPM None Detected None Detected None Detected None Detected None Detected None Detected 3484 Au Ag Filler Resin Anhydride Item Pb Cd Hg Cr+6 PBB PBDE 5531 Package Totals Weight (g) PPM 1000000 2.76 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary