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Materials Declaration
CSP_BGA - Stacked Die
8 X 8 mm
96
SnAgCu
0.40 mm
Package
Body Size
LeadCount
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
Subtotal
Item
Copper
Fiber glass
Epoxy Resin
Nickel
Gold
Subtotal
Molding Compound
% of Compound
86.20
6.00
6.00
1.50
0.30
Laminate
% of Laminate
40.0
31.6
25.0
3.0
0.4
Mold Compound
Weight (g)
3.68 E-02
2.56 E-03
2.56 E-03
6.41 E-04
1.28 E-04
4.27 E-02
PPM
305221
21245
21245
Weight (g)
1.61 E-02
1.27 E-02
1.00 E-02
1.21 E-03
1.61 E-04
4.02 E-02
PPM
133246
105264
83279
9993
1332
333115
Weight (g)
2.30 E-02
7.14 E-04
1.19 E-04
2.38 E-02
PPM
190442
5920
987
197349
Weight (g)
2.31 E-03
2.33 E-05
2.33 E-03
PPM
19119
193
19312
Weight (g)
1.10 E-02
PPM
91256
Weight (g)
1.74 E-04
1.13 E-04
6.15 E-05
3.08 E-05
3.08 E-05
4.10 E-04
PPM
Weight (g)
1.64 E-04
1.64 E-04
8.20 E-05
4.10 E-04
PPM
Weight (g)
1.23 E-04
8.20 E-05
6.15 E-05
6.15 E-05
3.08 E-05
3.08 E-05
2.05 E-05
4.10 E-04
PPM
Weight (g)
1.21 E-01
PPM
1000000
1062
348773
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
USEPA Method 3052. ICP-AES
USEPA Method 3052. ICP-AES
USEPA Method 3052. ICP-AES
USEPA 3060A & 7196A
US EPA 8081A/8270D/3540C/3550C. GC/MS
US EPA 8081A/8270D/3540C/3550C. GC/MS
Die Attach 1
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS
EPA Method 3540C/3550C. GC/MS
Solder Ball
Sn
Ag
Cu
Subtotal
Au
Pd
Subtotal
Si
Item
Silicon dioxide
Diester resin
Functionalized ester
Epoxy resin
Polymeric material
Subtotal
Item
Proprietary filler
Proprietary bismaleimide
Proprietary polymer
Subtotal
Item
Mixture of fused and amorphous silica
Bismaleimide resin
Di-ester resin
Functionalized ester
Epoxy resin
Polymeric material
1,3-di-2-propenyl-2 benzene, epoxidized
Subtotal
% of Plating
96.50
3.00
0.50
Bond Wires
% of Wire
99.00
1.00
Chip
% of Chip
100.0
Die Attach 1
% of Die Attach
42.50
27.50
15.00
7.50
7.50
Die Attach 2
% of Die Attach
40.00
40.00
20.00
Die Attach 3
% of Die Attach
30.00
20.00
15.00
15.00
7.50
7.50
5.00
Die Attach 2
Die Attach 3
1444
935
510
255
255
3398
1359
1359
680
3398
1019
680
510
510
255
255
170
3398
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS
EPA Method 3540C/3550C. GC/MS
Method
US EPA 3050B. ICP-AES
BS EN1122:2001. ICP-AES
USEPA 3052. ICP-AES
US EPA 3060A & 7196A. UV-VIS
USEPA 3540C. Analysis was performed by GC/MS
USEPA 3540C. Analysis was performed by GC/MS