Materials Declaration CSP_BGA - Stacked Die 8 X 8 mm 96 SnAgCu 0.40 mm Package Body Size LeadCount Option Ball Size Item SiO2 Filler Epoxy resin Phenol resin Metal Hydroxide Carbon black Subtotal Item Copper Fiber glass Epoxy Resin Nickel Gold Subtotal Molding Compound % of Compound 86.20 6.00 6.00 1.50 0.30 Laminate % of Laminate 40.0 31.6 25.0 3.0 0.4 Mold Compound Weight (g) 3.68 E-02 2.56 E-03 2.56 E-03 6.41 E-04 1.28 E-04 4.27 E-02 PPM 305221 21245 21245 Weight (g) 1.61 E-02 1.27 E-02 1.00 E-02 1.21 E-03 1.61 E-04 4.02 E-02 PPM 133246 105264 83279 9993 1332 333115 Weight (g) 2.30 E-02 7.14 E-04 1.19 E-04 2.38 E-02 PPM 190442 5920 987 197349 Weight (g) 2.31 E-03 2.33 E-05 2.33 E-03 PPM 19119 193 19312 Weight (g) 1.10 E-02 PPM 91256 Weight (g) 1.74 E-04 1.13 E-04 6.15 E-05 3.08 E-05 3.08 E-05 4.10 E-04 PPM Weight (g) 1.64 E-04 1.64 E-04 8.20 E-05 4.10 E-04 PPM Weight (g) 1.23 E-04 8.20 E-05 6.15 E-05 6.15 E-05 3.08 E-05 3.08 E-05 2.05 E-05 4.10 E-04 PPM Weight (g) 1.21 E-01 PPM 1000000 1062 348773 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method USEPA Method 3052. ICP-AES USEPA Method 3052. ICP-AES USEPA Method 3052. ICP-AES USEPA 3060A & 7196A US EPA 8081A/8270D/3540C/3550C. GC/MS US EPA 8081A/8270D/3540C/3550C. GC/MS Die Attach 1 Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS EPA Method 3540C/3550C. GC/MS Solder Ball Sn Ag Cu Subtotal Au Pd Subtotal Si Item Silicon dioxide Diester resin Functionalized ester Epoxy resin Polymeric material Subtotal Item Proprietary filler Proprietary bismaleimide Proprietary polymer Subtotal Item Mixture of fused and amorphous silica Bismaleimide resin Di-ester resin Functionalized ester Epoxy resin Polymeric material 1,3-di-2-propenyl-2 benzene, epoxidized Subtotal % of Plating 96.50 3.00 0.50 Bond Wires % of Wire 99.00 1.00 Chip % of Chip 100.0 Die Attach 1 % of Die Attach 42.50 27.50 15.00 7.50 7.50 Die Attach 2 % of Die Attach 40.00 40.00 20.00 Die Attach 3 % of Die Attach 30.00 20.00 15.00 15.00 7.50 7.50 5.00 Die Attach 2 Die Attach 3 1444 935 510 255 255 3398 1359 1359 680 3398 1019 680 510 510 255 255 170 3398 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS EPA Method 3540C/3550C. GC/MS Method US EPA 3050B. ICP-AES BS EN1122:2001. ICP-AES USEPA 3052. ICP-AES US EPA 3060A & 7196A. UV-VIS USEPA 3540C. Analysis was performed by GC/MS USEPA 3540C. Analysis was performed by GC/MS