Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Item Cu Fe Zn P LFCSP 9 X 9 mm (7.1mm exposed pad) 64 Pb-free Molding Compound % of Compound Weight (g) 84.0 6.44 E-02 16.0 1.23 E-02 PPM 274664 52317 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 PPM 528446 12735 653 162 Weight (g) 1.24 E-01 2.99 E-03 1.53 E-04 3.80 E-05 Ag Internal Leadframe Plating Weight (g) % of Plating 6.24 E-04 100.0 Sn External Leadframe Plating % of Plating Weight (g) 4.94 E-03 100.0 Item PPM 2661 Molding Compound Method PPM Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS Analysis performed by GC/MS Not Detected Not Detected Analysis performed by GC/MS PPM 21060 Bond Wires % of Wire 99.99 Weight (g) 2.17 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 2.00 E-02 PPM 85339 Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Weight (g) 2.09 E-03 6.26 E-04 8.90 E-05 8.90 E-05 8.90 E-05 PPM Item Ag Resin Metal Oxide Amine Gamma Butyrolactone Item Pb Cd Hg Cr+6 PBB PBDE 9255 8901 2670 380 380 380 Package Totals PPM Weight (g) 1000000 2.34 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary 8/7/06 Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Item Cu Fe Zn P Ag Item Sn Pb LFCSP 9 X 9 mm (7.1mm exposed pad) 64 SnPb Molding Compound % of Compound Weight (g) 84.0 6.44 E-02 16.0 1.23 E-02 PPM 274306 52248 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Weight (g) 1.24 E-01 2.99 E-03 1.53 E-04 3.80 E-05 PPM 527758 12718 652 162 Internal Leadframe Plating Weight (g) % of Plating 1.17 E-03 100.0 PPM 4975 External Leadframe Plating % of Plating Weight (g) 4.54 E-03 85.00 8.02 E-04 15.00 PPM 19346 3416 Au Bond Wires % of Wire 99.99 Weight (g) 1.53 E-03 PPM 6500 Si Chip % of Chip 100.0 Weight (g) 2.00 E-02 PPM 85228 Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Weight (g) 2.09 E-03 6.26 E-04 8.90 E-05 8.90 E-05 8.90 E-05 PPM 8889 2666 379 379 379 Item Ag Resin Metal Oxide Amine Gamma Butyrolactone Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS Analysis performed by GC/MS Not Detected Not Detected Analysis performed by GC/MS Package Totals PPM Weight (g) 1000000 2.35 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary 9/4/06