pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Item
Cu
Fe
Zn
P
LFCSP
9 X 9 mm (7.1mm exposed pad)
64
Pb-free
Molding Compound
% of Compound
Weight (g)
84.0
6.44 E-02
16.0
1.23 E-02
PPM
274664
52317
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
PPM
528446
12735
653
162
Weight (g)
1.24 E-01
2.99 E-03
1.53 E-04
3.80 E-05
Ag
Internal Leadframe Plating
Weight (g)
% of Plating
6.24 E-04
100.0
Sn
External Leadframe Plating
% of Plating
Weight (g)
4.94 E-03
100.0
Item
PPM
2661
Molding Compound
Method
PPM
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3060A & 7196A. UV-VIS
Not Detected
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3060A & 7196A. UV-VIS
Analysis performed by GC/MS
Not Detected
Not Detected
Analysis performed by GC/MS
PPM
21060
Bond Wires
% of Wire
99.99
Weight (g)
2.17 E-03
PPM
Au
Si
Chip
% of Chip
100.0
Weight (g)
2.00 E-02
PPM
85339
Die Attach
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Weight (g)
2.09 E-03
6.26 E-04
8.90 E-05
8.90 E-05
8.90 E-05
PPM
Item
Ag
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
9255
8901
2670
380
380
380
Package Totals
PPM
Weight (g)
1000000
2.34 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
8/7/06
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Item
Cu
Fe
Zn
P
Ag
Item
Sn
Pb
LFCSP
9 X 9 mm (7.1mm exposed pad)
64
SnPb
Molding Compound
% of Compound
Weight (g)
84.0
6.44 E-02
16.0
1.23 E-02
PPM
274306
52248
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
Weight (g)
1.24 E-01
2.99 E-03
1.53 E-04
3.80 E-05
PPM
527758
12718
652
162
Internal Leadframe Plating
Weight (g)
% of Plating
1.17 E-03
100.0
PPM
4975
External Leadframe Plating
% of Plating
Weight (g)
4.54 E-03
85.00
8.02 E-04
15.00
PPM
19346
3416
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.53 E-03
PPM
6500
Si
Chip
% of Chip
100.0
Weight (g)
2.00 E-02
PPM
85228
Die Attach
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Weight (g)
2.09 E-03
6.26 E-04
8.90 E-05
8.90 E-05
8.90 E-05
PPM
8889
2666
379
379
379
Item
Ag
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3060A & 7196A. UV-VIS
Not Detected
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3052. ICP-OES
Not Detected
US EPA 3060A & 7196A. UV-VIS
Analysis performed by GC/MS
Not Detected
Not Detected
Analysis performed by GC/MS
Package Totals
PPM
Weight (g)
1000000
2.35 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
9/4/06