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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Mutiaromatic Resin
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Sn
LFCSP
4 X 4 X 0.85
24
Pb Free
Molding Compound
% of Compound
Weight (g)
84
1.18 E-02
16
2.25 E-03
1.40 E-02
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
PPM
280402
53414
333816
Weight (g)
2.21 E-02
5.44 E-04
2.70 E-05
7.00 E-06
2.27 E-02
PPM
524497
12926
642
166
538231
Internal Leadframe Plating
% of Plating
Weight (g)
5.04 E-04
100
PPM
11975
External Leadframe Plating
% of Plating
Weight (g)
100
7.27 E-04
PPM
17274
Bond Wires
% of Wire
99.99
Weight (g)
4.17 E-04
PPM
Au
Si
Chip
% of Chip
100
Weight (g)
2.97 E-03
PPM
70570
Weight (g)
5.37 E-04
1.61 E-04
2.30 E-05
2.30 E-05
2.30 E-05
7.67 E-04
PPM
12760
3826
547
547
547
18225
Item
Ag Filler
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Subtotal
Die Attach
% of Die Attach
70
21
3
3
3
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS
Not Detected EPA Method 3540C/3550C. GC/M/S.
Not Detected EPA Method 3540C/3550C. GC/M/S.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS
EPA Method 3540C/3550C. GC/M/S.
EPA Method 3540C/3550C. GC/M/S.
9908
Package Totals
Weight (g)
PPM
1000000
4.21 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Mutiaromatic Resin
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Sn
Pb
Subtotal
LFCSP
4 X 4 X 0.85
24
SnPb
Molding Compound
% of Compound
Weight (g)
84
1.18 E-02
16
2.25 E-03
1.40 E-02
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
PPM
280003
53338
333341
Weight (g)
2.21 E-02
5.44 E-04
2.70 E-05
7.00 E-06
2.27 E-02
PPM
523751
12908
641
166
537465
Internal Leadframe Plating
% of Plating
Weight (g)
5.04 E-04
100
PPM
11958
External Leadframe Plating
% of Plating
Weight (g)
85
6.69 E-04
15
1.18 E-04
7.87 E-04
PPM
15873
2800
18673
Bond Wires
% of Wire
99.99
Weight (g)
4.17 E-04
PPM
Au
Si
Chip
% of Chip
100
Weight (g)
2.97 E-03
PPM
70469
Weight (g)
5.37 E-04
1.61 E-04
2.30 E-05
2.30 E-05
2.30 E-05
7.67 E-04
PPM
12741
3820
546
546
546
18199
Item
Ag Filler
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Subtotal
Die Attach
% of Die Attach
70
21
3
3
3
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3051A/3052. ICP-OES
Not Detected EPA Method 3060A & 7196A. UV-VIS
Not Detected EPA Method 3540C/3550C. GC/M/S.
Not Detected EPA Method 3540C/3550C. GC/M/S.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS
EPA Method 3540C/3550C. GC/M/S.
EPA Method 3540C/3550C. GC/M/S.
9894
Package Totals
Weight (g)
PPM
1000000
4.21 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary