Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Mutiaromatic Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn LFCSP 4 X 4 X 0.85 24 Pb Free Molding Compound % of Compound Weight (g) 84 1.18 E-02 16 2.25 E-03 1.40 E-02 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 PPM 280402 53414 333816 Weight (g) 2.21 E-02 5.44 E-04 2.70 E-05 7.00 E-06 2.27 E-02 PPM 524497 12926 642 166 538231 Internal Leadframe Plating % of Plating Weight (g) 5.04 E-04 100 PPM 11975 External Leadframe Plating % of Plating Weight (g) 100 7.27 E-04 PPM 17274 Bond Wires % of Wire 99.99 Weight (g) 4.17 E-04 PPM Au Si Chip % of Chip 100 Weight (g) 2.97 E-03 PPM 70570 Weight (g) 5.37 E-04 1.61 E-04 2.30 E-05 2.30 E-05 2.30 E-05 7.67 E-04 PPM 12760 3826 547 547 547 18225 Item Ag Filler Resin Metal Oxide Amine Gamma Butyrolactone Subtotal Die Attach % of Die Attach 70 21 3 3 3 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/M/S. Not Detected EPA Method 3540C/3550C. GC/M/S. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS EPA Method 3540C/3550C. GC/M/S. EPA Method 3540C/3550C. GC/M/S. 9908 Package Totals Weight (g) PPM 1000000 4.21 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Mutiaromatic Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn Pb Subtotal LFCSP 4 X 4 X 0.85 24 SnPb Molding Compound % of Compound Weight (g) 84 1.18 E-02 16 2.25 E-03 1.40 E-02 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 PPM 280003 53338 333341 Weight (g) 2.21 E-02 5.44 E-04 2.70 E-05 7.00 E-06 2.27 E-02 PPM 523751 12908 641 166 537465 Internal Leadframe Plating % of Plating Weight (g) 5.04 E-04 100 PPM 11958 External Leadframe Plating % of Plating Weight (g) 85 6.69 E-04 15 1.18 E-04 7.87 E-04 PPM 15873 2800 18673 Bond Wires % of Wire 99.99 Weight (g) 4.17 E-04 PPM Au Si Chip % of Chip 100 Weight (g) 2.97 E-03 PPM 70469 Weight (g) 5.37 E-04 1.61 E-04 2.30 E-05 2.30 E-05 2.30 E-05 7.67 E-04 PPM 12741 3820 546 546 546 18199 Item Ag Filler Resin Metal Oxide Amine Gamma Butyrolactone Subtotal Die Attach % of Die Attach 70 21 3 3 3 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3051A/3052. ICP-OES Not Detected EPA Method 3060A & 7196A. UV-VIS Not Detected EPA Method 3540C/3550C. GC/M/S. Not Detected EPA Method 3540C/3550C. GC/M/S. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS EPA Method 3540C/3550C. GC/M/S. EPA Method 3540C/3550C. GC/M/S. 9894 Package Totals Weight (g) PPM 1000000 4.21 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary