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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Item
Cu
Ni
Si
Mg
LFCSP
4X4
16
Pb Free
Molding Compound
% of Compound
Weight (g)
84.0
3.03 E-02
16.0
5.78 E-03
PPM
484324
92252
Leadframe
% of Leadframe
96.2
3.0
0.65
0.15
PPM
193069
6021
1305
301
Weight (g)
1.21 E-02
3.77 E-04
8.17 E-05
1.89 E-05
Internal Leadframe Plating
Weight (g)
% of Plating
4.00 E-05
100.0
PPM
Ag
PPM
Sn
External Leadframe Plating
Weight (g)
% of Plating
100.0
2.50 E-04
Item
639
Molding Compound
Method
PPM
Not Detected
US EPA 3052
Not Detected
US EPA 3052
Not Detected
US EPA 3052
Not Detected
US EPA 3060A & 7196A
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
US EPA 3052
Not Detected
US EPA 3052
Not Detected
US EPA 3052
Not Detected
US EPA 3060A & 7196A
Analysis performed by GC/MS
Not Detected
Analysis performed by GC/MS
Not Detected
3996
Weight (g)
2.38 E-04
PPM
Au
Bond Wires
% of Wire
99.9
Si
Chip
% of Chip
100.0
Weight (g)
8.89 E-03
PPM
141856
Die Attach
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Weight (g)
3.18 E-03
9.53 E-04
1.36 E-04
1.36 E-04
1.36 E-04
PPM
50703
15211
2173
2173
2173
Item
Ag
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
3806
Package Totals
PPM
Weight (g)
1000000
6.26 E-02
AMK-CP-C
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
6/27/06