Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Item Cu Ni Si Mg LFCSP 4X4 16 Pb Free Molding Compound % of Compound Weight (g) 84.0 3.03 E-02 16.0 5.78 E-03 PPM 484324 92252 Leadframe % of Leadframe 96.2 3.0 0.65 0.15 PPM 193069 6021 1305 301 Weight (g) 1.21 E-02 3.77 E-04 8.17 E-05 1.89 E-05 Internal Leadframe Plating Weight (g) % of Plating 4.00 E-05 100.0 PPM Ag PPM Sn External Leadframe Plating Weight (g) % of Plating 100.0 2.50 E-04 Item 639 Molding Compound Method PPM Not Detected US EPA 3052 Not Detected US EPA 3052 Not Detected US EPA 3052 Not Detected US EPA 3060A & 7196A Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Not Detected Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected US EPA 3052 Not Detected US EPA 3052 Not Detected US EPA 3052 Not Detected US EPA 3060A & 7196A Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Not Detected 3996 Weight (g) 2.38 E-04 PPM Au Bond Wires % of Wire 99.9 Si Chip % of Chip 100.0 Weight (g) 8.89 E-03 PPM 141856 Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Weight (g) 3.18 E-03 9.53 E-04 1.36 E-04 1.36 E-04 1.36 E-04 PPM 50703 15211 2173 2173 2173 Item Ag Resin Metal Oxide Amine Gamma Butyrolactone Item Pb Cd Hg Cr+6 PBB PBDE 3806 Package Totals PPM Weight (g) 1000000 6.26 E-02 AMK-CP-C Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/27/06