Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Item Cu Fe Zn P Ag Item Sn LFCSP 4 X 4 X 1.45mm (1.75mm exposed pad) 16 Pb Free Molding Compound % of Compound 84.0 16.0 Weight (g) 4.99 E-03 9.50 E-04 PPM 94557 18011 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Weight (g) 2.26 E-02 5.45 E-04 2.78 E-05 6.96 E-06 PPM 428484 10328 527 132 Internal Leadframe Plating % of Plating Weight (g) 5.30 E-04 100.0 PPM 10044 External Leadframe Plating Weight (g) % of Plating 100.0 7.70 E-04 PPM 14592 Au Bond Wires % of Wire 99.9 Weight (g) 6.00 E-04 PPM 11371 Si Chip % of Chip 100.0 Weight (g) 1.27 E-02 PPM 240676 Die Attach % of Die Attach 77.0 23.0 Weight (g) 6.93 E-03 2.07 E-03 PPM 131330 39228 Item Ag Resin Lead Zn borosilicate glass frit Seal Glass 85.0 15.0 3.23 E-05 5.70 E-06 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected EPA 3060A & 7196A. UV-VIS None Detected Analysis performed by GC/MS None Detected Analysis performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected US EPA 3052. ICP-OES None Detected EPA 3060A & 7196A. UV-VIS None Detected Analysis performed by GC/MS None Detected Analysis performed by GC/MS 612 108 Package Totals Weight (g) PPM 1000000 5.28 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/11/06