pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Item
Cu
Fe
Zn
P
Ag
Item
Sn
LFCSP
4 X 4 X 1.45mm (1.75mm exposed pad)
16
Pb Free
Molding Compound
% of Compound
84.0
16.0
Weight (g)
4.99 E-03
9.50 E-04
PPM
94557
18011
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
Weight (g)
2.26 E-02
5.45 E-04
2.78 E-05
6.96 E-06
PPM
428484
10328
527
132
Internal Leadframe Plating
% of Plating
Weight (g)
5.30 E-04
100.0
PPM
10044
External Leadframe Plating
Weight (g)
% of Plating
100.0
7.70 E-04
PPM
14592
Au
Bond Wires
% of Wire
99.9
Weight (g)
6.00 E-04
PPM
11371
Si
Chip
% of Chip
100.0
Weight (g)
1.27 E-02
PPM
240676
Die Attach
% of Die Attach
77.0
23.0
Weight (g)
6.93 E-03
2.07 E-03
PPM
131330
39228
Item
Ag
Resin
Lead
Zn borosilicate glass frit
Seal Glass
85.0
15.0
3.23 E-05
5.70 E-06
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
EPA 3060A & 7196A. UV-VIS
None Detected
Analysis performed by GC/MS
None Detected
Analysis performed by GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
US EPA 3052. ICP-OES
None Detected
EPA 3060A & 7196A. UV-VIS
None Detected
Analysis performed by GC/MS
None Detected
Analysis performed by GC/MS
612
108
Package Totals
Weight (g)
PPM
1000000
5.28 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
9/11/06