Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Subtotal Item Cu Fe Zn P Subtotal LFCSP 6 X 6 X 0.85 (3.70 mm exposed pad) 36 Pb-free Molding Compound % of Compound 84.0 16.0 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Weight (g) 3.63 E-02 6.91 E-03 4.32 E-02 PPM 392045 74678 466723 Weight (g) 4.19 E-02 1.03 E-03 5.20 E-05 1.30 E-05 4.30 E-02 PPM 452572 11148 562 140 464422 Ag Internal Leadframe Plating % of Plating Weight (g) 4.32 E-04 100.0 Sn External Leadframe Plating % of Plating Weight (g) 100.0 1.02 E-03 Item PPM 4667 Bond Wires % of Wire 99.99 Weight (g) 1.86 E-03 PPM 20071 Si Chip % of Chip 100.0 Weight (g) 2.39 E-03 PPM 25861 Weight (g) 4.67 E-04 1.40 E-04 2.00 E-05 2.00 E-05 2.00 E-05 6.67 E-04 PPM Die Attach Material % of Die Attach 70.0 21.0 3.0 3.0 3.0 Molding Compound Method PPM Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/ 3550C. GC/MS. Not Detected EPA Method 3540C/ 3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Material Method PPM Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/ 3550C. GC/MS. Not Detected EPA Method 3540C/ 3550C. GC/MS. PPM 11051 Au Item Ag Resin Metal Oxide Amine Gamma Butyrolactone Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 5045 1512 216 216 216 7205 Package Totals Weight (g) PPM 1000000 9.26 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary