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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
LFCSP
6 X 6 X 0.85 (3.70 mm exposed pad)
36
Pb-free
Molding Compound
% of Compound
84.0
16.0
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
Weight (g)
3.63 E-02
6.91 E-03
4.32 E-02
PPM
392045
74678
466723
Weight (g)
4.19 E-02
1.03 E-03
5.20 E-05
1.30 E-05
4.30 E-02
PPM
452572
11148
562
140
464422
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
4.32 E-04
100.0
Sn
External Leadframe Plating
% of Plating
Weight (g)
100.0
1.02 E-03
Item
PPM
4667
Bond Wires
% of Wire
99.99
Weight (g)
1.86 E-03
PPM
20071
Si
Chip
% of Chip
100.0
Weight (g)
2.39 E-03
PPM
25861
Weight (g)
4.67 E-04
1.40 E-04
2.00 E-05
2.00 E-05
2.00 E-05
6.67 E-04
PPM
Die Attach Material
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Molding Compound
Method
PPM
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Material
Method
PPM
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
PPM
11051
Au
Item
Ag
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
5045
1512
216
216
216
7205
Package Totals
Weight (g)
PPM
1000000
9.26 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary