Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn LFCSP 5 X 5 X 0.85 (3.1 mm exposed pad) 32 Pb-free Molding Compound % of Compound 84.0 16.0 Weight (g) 1.98 E-02 3.78 E-03 2.36 E-02 PPM 257056 48963 306019 Weight (g) 3.44 E-02 8.46 E-04 4.20 E-05 1.10 E-05 3.53 E-02 PPM 527980 12726 650 162 541518 Internal Leadframe Plating % of Plating Weight (g) 7.40 E-04 100.0 PPM 12505 External Leadframe Plating % of Plating Weight (g) 100.0 1.15 E-03 PPM 19639 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Au Bond Wires % of Wire 99.99 Weight (g) 8.43 E-04 PPM 15655 Si Chip % of Chip 100.0 Weight (g) 5.05 E-03 PPM 86918 Weight (g) 7.66 E-04 2.30 E-04 3.30 E-05 3.30 E-05 3.30 E-05 1.10 E-03 PPM 12422 3727 532 532 532 17745 Item Ag Resin Metal Oxide Amine Gamma Butyrolactone Subtotal Die Attach Material % of Die Attach 70.0 21.0 3.0 3.0 3.0 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/ 3550C. GC/MS. Not Detected EPA Method 3540C/ 3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Material Method PPM Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. Not Detected EPA Method 3051A13052. ICP-OES. 3 EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/ 3550C. GC/MS. Not Detected EPA Method 3540C/ 3550C. GC/MS. Package Totals Weight (g) PPM 1000000 6.78 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary