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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Sn
LFCSP
5 X 5 X 0.85 (3.1 mm exposed pad)
32
Pb-free
Molding Compound
% of Compound
84.0
16.0
Weight (g)
1.98 E-02
3.78 E-03
2.36 E-02
PPM
257056
48963
306019
Weight (g)
3.44 E-02
8.46 E-04
4.20 E-05
1.10 E-05
3.53 E-02
PPM
527980
12726
650
162
541518
Internal Leadframe Plating
% of Plating
Weight (g)
7.40 E-04
100.0
PPM
12505
External Leadframe Plating
% of Plating
Weight (g)
100.0
1.15 E-03
PPM
19639
Leadframe
% of Leadframe
97.50
2.35
0.12
0.03
Au
Bond Wires
% of Wire
99.99
Weight (g)
8.43 E-04
PPM
15655
Si
Chip
% of Chip
100.0
Weight (g)
5.05 E-03
PPM
86918
Weight (g)
7.66 E-04
2.30 E-04
3.30 E-05
3.30 E-05
3.30 E-05
1.10 E-03
PPM
12422
3727
532
532
532
17745
Item
Ag
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Subtotal
Die Attach Material
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Material
Method
PPM
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
Not Detected EPA Method 3051A13052. ICP-OES.
3
EPA Method 3060A & 7196A. UV-VIS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
Not Detected EPA Method 3540C/ 3550C. GC/MS.
Package Totals
Weight (g)
PPM
1000000
6.78 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary