SUR50N03-16P Datasheet

SUR50N03-16P
Vishay Siliconix
New Product
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (W)
ID (A)a
0.016 @ VGS = 10 V
15
APPLICATIONS
0.024 @ VGS = 4.5 V
12
D DC/DC Converters
− High-Side
D Synchronous Rectifiers
VDS (V)
30
D TrenchFETr Power MOSFET
D PWM Optimized
D 100% Rg Tested
D
TO-252
Reverse Lead DPAK
Drain Connected to Tab
G
D
G
S
Top View
Ordering Information:
SUR50N03-16P—E3
SUR50N03-16P-T4—E3 (altrenate tape orientation)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
TC = 25_C
Continuous Drain Currenta
TA = 25_C
15
10.6
IDM
IS
5
Single Pulse Avalanche Current
IAS
25
EAS
31.25
L = 0.1
0 1 mH
TC = 25_C
Maximum Power Dissipation
TA = 25_C
Operating Junction and Storage Temperature Range
A
40
Continuous Source Current (Diode Conduction)a
Single Pulse Avalanche Energy
V
36
ID
TA = 100_C
Pulsed Drain Current
Unit
mJ
40.8
PD
W
6.5a
TJ, Tstg
−55 to 175
_C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction
Junction-to-Ambient
to Ambienta
Maximum Junction-to-Case
Symbol
t v 10 sec
Steady State
RthJA
RthJC
Typical
Maximum
18
23
40
50
3.0
3.7
Unit
_C/W
C/W
Notes
a. Surface Mounted on FR4 Board, t v 10 sec.
Document Number: 72775
S-32696—Rev. A, 19-Jan-04
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SUR50N03-16P
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Typa
Symbol
Test Condition
Min
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
1.0
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 125_C
50
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currentb
ID(on)
VDS = 5 V, VGS = 10 V
0.016
0.025
VGS = 4.5 V, ID = 10 A
Forward Transconductanceb
gfs
mA
A
0.0128
VGS = 10 V, ID = 20 A, TJ = 125_C
rDS(on)
nA
40
VGS = 10 V, ID = 15 A
Drain-Source
Drain
Source On
On-State
State Resistanceb
V
3.0
0.019
VDS = 15 V, ID = 20 A
W
0.024
10
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
Gate Resistance
1150
VGS = 0 V, VDS = 25 V, f = 1 MHz
215
8.5
2.7
tr
Turn-Off Delay Timec
VDD = 15 V, RL = 0.3 W
ID ^ 50 A, VGEN = 10 V, Rg = 2.5 W
td(off)
Fall Timec
nC
2.5
td(on)
Rise Timec
13
5
VDS = 15 V, VGS = 4.5 V, ID = 50 A
Rg
Turn-On Delay Timec
pF
p
70
tf
5.5
9.40
7
15
20
30
25
40
12
20
W
ns
Source-Drain Diode Ratings and Characteristic (TC = 25_C)
Pulsed Current
ISM
Diode Forward Voltageb
VSD
IF = 20 A, VGS = 0 V
1.0
1.5
V
trr
IF = 40 A, di/dt = 100 A/ms
25
70
ns
Source-Drain Reverse Recovery Time
40
A
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
c. Independent of operating temperature.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
60
60
VGS = 10 thru 5 V
50
I D − Drain Current (A)
I D − Drain Current (A)
50
40
4V
30
20
10
40
30
20
TC = 125_C
10
25_C
3V
0
0
0
2
4
6
8
VDS − Drain-to-Source Voltage (V)
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2
−55_C
10
0
1
2
3
4
5
6
VGS − Gate-to-Source Voltage (V)
Document Number: 72775
S-32696—Rev. A, 19-Jan-04
SUR50N03-16P
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Transconductance
On-Resistance vs. Drain Current
60
0.05
TC = −55_C
r DS(on)− On-Resistance ( W )
g fs − Transconductance (S)
50
25_C
40
125_C
30
20
10
0
0.04
0.03
VGS = 4.5 V
0.02
VGS = 10 V
0.01
0.00
0
5
10
15
20
25
30
0
10
20
ID − Drain Current (A)
V GS − Gate-to-Source Voltage (V)
Ciss
C − Capacitance (pF)
900
600
Coss
Crss
0
60
15
18
VDS = 15 V
ID = 50 A
8
6
4
2
0
0
5
10
15
20
25
30
0
3
VDS − Drain-to-Source Voltage (V)
1.8
On-Resistance vs. Junction Temperature
9
12
Source-Drain Diode Forward Voltage
100
VGS = 10 V
ID = 15 A
1.5
1.2
0.9
0.6
−50
6
Qg − Total Gate Charge (nC)
I S − Source Current (A)
2.1
r DS(on)− On-Resistance ( W )
(Normalized)
50
Gate Charge
10
1200
300
40
ID − Drain Current (A)
Capacitance
1500
30
−25
0
25
50
75
100
125
TJ − Junction Temperature (_C)
Document Number: 72775
S-32696—Rev. A, 19-Jan-04
150
175
TJ = 150_C
TJ = 25_C
10
1
0
0.3
0.6
0.9
1.2
1.5
VSD − Source-to-Drain Voltage (V)
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SUR50N03-16P
Vishay Siliconix
New Product
THERMAL RATINGS
Maximum Drain Current vs.
Ambiemt Temperature
Safe Operating Area
100
20
10 ms
Limited
by rDS(on)
10
I D − Drain Current (A)
I D − Drain Current (A)
15
100 ms
10
5
0
0
25
50
75
100
125
150
1 ms
10 ms
100 ms
1
1s
10 s
0.1
TA = 25_C
Single Pulse
dc, 100 s
0.01
175
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
TA − Ambient Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10−4
10−3
10−2
10−1
1
10
100
1000
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10−4
10−3
10−2
10−1
1
10
100
Square Wave Pulse Duration (sec)
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Document Number: 72775
S-32696—Rev. A, 19-Jan-04
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Document Number: 91000
Revision: 18-Jul-08
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