SUR50N03-06P Datasheet

SUR50N03-06P
Vishay Siliconix
New Product
N-Channel 30-V (D-S) 175_C MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (W)
ID (A)b
0.0065 @ VGS = 10 V
84b
0.0095 @ VGS = 4.5 V
59b
VDS (V)
30
D TrenchFETr Power MOSFET
D 175_C Junction Temperature
D Optimized for Low-Side Synchronous
Rectifier Operation
D 100% Rg Tested
APPLICATIONS
D DC/DC Converters
− Desktop CPU Core
D Synchronous Rectifiers
D
TO-252
Reverse Lead DPAK
Drain Connected to Tab
G
D
G
S
Top View
Ordering Information:
SUR50N03-06P—E3
SUR50N03-06P-T4—E3 (altrenate tape orientation)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
TA = 25_C
TC = 25_C
Continuous Drain Current
Continuous Source Current (Diode Conduction)a
TC = 25_C
Maximum Power Dissipation
TA = 25_C
Operating Junction and Storage Temperature Range
V
27
84b
ID
59b
TC = 100_C
Pulsed Drain Current
Unit
IDM
100
IS
25
A
88
PD
W
8.3a
TJ, Tstg
−55 to 175
_C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction
Junction-to-Ambient
to Ambienta
Symbol
t v 10 sec
Steady State
Maximum Junction-to-Case
RthJA
RthJC
Typical
Maximum
15
18
40
50
1.4
1.7
Unit
_C/W
C/W
Notes
a. Surface Mounted on FR4 Board, t v 10 sec.
b. Based on maximum allowable junction temperature, package limitation current is 50 A.
Document Number: 72182
S-32693—Rev. A, 19-Jan-04
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SUR50N03-06P
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Typa
Symbol
Test Condition
Min
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
1.0
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 125_C
50
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currentb
ID(on)
VDS = 5 V, VGS = 10 V
3.0
A
0.0053
VGS = 10 V, ID = 20 A, TJ = 125_C
rDS(on)
gfs
0.0065
0.0105
VGS = 4.5 V, ID = 20 A
Forward Transconductanceb
0.0078
VDS = 15 V, ID = 20 A
nA
mA
50
VGS = 10 V, ID = 20 A
Drain-Source
Drain
Source On
On-State
State Resistanceb
V
W
0.0095
20
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
Turn-On Delay Timec
td(on)
Rise Timec
3100
VGS = 0 V, VDS = 25 V, f = 1 MHz
1
1.9
3.1
21
30
10
VDS = 15 V, VGS = 4.5 V, ID = 50 A
W
nC
7.5
VDD = 15 V, RL = 0.3 W
ID ^ 50 A, VGEN = 10 V, Rg = 2.5 W
td(off)
Fall Timec
pF
p
255
tr
Turn-Off Delay Timec
565
tf
12
20
12
20
30
45
10
15
ns
Source-Drain Diode Ratings and Characteristic (TC = 25_C)
Pulsed Current
ISM
Diode Forward Voltageb
VSD
IF = 100 A, VGS = 0 V
1.2
1.5
V
trr
IF = 50 A, di/dt = 100 A/ms
35
70
ns
Source-Drain Reverse Recovery Time
100
A
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
c. Independent of operating temperature.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
200
100
VGS = 10 thru 6 V
5V
80
I D − Drain Current (A)
I D − Drain Current (A)
160
120
80
4V
40
60
40
TC = 125_C
20
25_C
−55_C
3V
0
0
0
2
4
6
8
VDS − Drain-to-Source Voltage (V)
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2
10
0
1
2
3
4
5
VGS − Gate-to-Source Voltage (V)
Document Number: 72182
S-32693—Rev. A, 19-Jan-04
SUR50N03-06P
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Transconductance
On-Resistance vs. Drain Current
120
0.0150
g fs − Transconductance (S)
r DS(on)− On-Resistance ( W )
TC = −55_C
100
25_C
80
125_C
60
40
20
0
0.0125
0.0100
VGS = 4.5 V
0.0075
VGS = 10 V
0.0050
0.0025
0.0000
0
10
20
30
40
50
0
20
40
ID − Drain Current (A)
V GS − Gate-to-Source Voltage (V)
C − Capacitance (pF)
3000
2500
2000
1500
Coss
1000
Crss
500
100
40
50
Gate Charge
10
Ciss
3500
80
ID − Drain Current (A)
Capacitance
4000
60
0
VDS = 15 V
ID = 50 A
8
6
4
2
0
0
5
10
15
20
25
30
0
10
VDS − Drain-to-Source Voltage (V)
2.0
20
30
Qg − Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
100
1.5
I S − Source Current (A)
r DS(on)− On-Resistance ( W )
(Normalized)
VGS = 10 V
ID = 20 A
1.0
0.5
0.0
−50
−25
0
25
50
75
100
125
TJ − Junction Temperature (_C)
Document Number: 72182
S-32693—Rev. A, 19-Jan-04
150
175
TJ = 150_C
TJ = 25_C
10
1
0
0.3
0.6
0.9
1.2
1.5
VSD − Source-to-Drain Voltage (V)
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SUR50N03-06P
Vishay Siliconix
New Product
THERMAL RATINGS
Maximum Drain Current vs.
Ambiemt Temperature
Limited
by rDS(on)
24
10, 100 ms
100
I D − Drain Current (A)
I D − Drain Current (A)
Safe Operating Area
1000
30
18
12
6
10
1 ms
10 ms
100 ms
1
1s
10 s
TA = 25_C
Single Pulse
0.1
0
0
25
50
75
100
125
150
100 s
dc
0.01
175
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
TA − Ambient Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10−4
10−3
10−2
10−1
1
10
100
1000
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10−4
10−3
10−2
10−1
1
10
100
Square Wave Pulse Duration (sec)
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Document Number: 72182
S-32693—Rev. A, 19-Jan-04
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Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
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Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
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Document Number: 91000
Revision: 18-Jul-08
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