View detail for Atmel AT07216: SAM G55 Schematic Checklist

APPLICATION NOTE
AT07216: SAM G55 Schematic Checklist
Atmel | SMART SAM G55
Introduction
A good hardware design comes from a proper schematic. Since SAM G55
devices have a fair number of pins and functions, the schematic for these devices
can be large and quite complex.
This application note describes a common checklist which should be used when
building and reviewing the schematics of a SAM G55 application design.
The document covers the following general aspect:
 Power supply strategies
 Clock and crystal oscillators
 JTAG and SWD debug ports
 USB port
 Bootloader driven pins
 Suggested reading
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Schematic Checklist
1.1
Power Supply Strategy
1.1.1
49-pin WLCSP Package
Single power supply strategy is mandatory on SAM G55. VDDCORE should always be connected to VDDOUT.
Figure 1-1 shows the standard power supply for the 49-pin WLCSP package. It is mandatory to guarantee a
minimum of 3.0V on VDDIO if USB functionality is used. Otherwise VDDIO can be lowered down to 1.62V.
Figure 1-1.
Power Supply Schematic Example for 49-pin WLCSP Package
Peripheral
I/Os
Flash
Memories
USB
ADC
Main supply
(1.62V - 3.6V)
VDDIO
4.7µF
100nF
(1)(2)
(1)(2)(3)
Voltage
Regulator
100nF
(1)(2)
2.2µF
VDDOUT
(1)(2)
100nF
VDDCORE
Core
(1)(2)(3)
Memories
(SRAM, FLASH)
PLL
Peripherals
SAM G55
Note:
2
1.
2.
3.
These values are given only as a typical example.
Capacitors should be placed as close as possible to each pin in the signal group, vias should be avoided.
Decoupling capacitors must be connected as close as possible to the microcontroller and on each concerned
pin.
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G55 Schematic Checklist [APPLICATION NOTE]
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Main supply
4.7µF
100nF
VDDIO
100nF
VDDIO
100nF
VDDIO
SAM G55
The checklist, Table 1-1, must be followed in order to ensure correct hardware configuration for power supply.
Table 1-1.
Single Power Supply Checklist
Signal name
Recommended pin connection
Description
3.0 to 3.6V if USB is used
1.62V to 3.6V otherwise
Decoupling/Filtering capacitors
(100nF and 4.7μF)(1)(2)
Powers the peripheral I/Os, USB, Flash memory (dual
rail), ADC, 32kHz crystal oscillator and oscillator pads.
Decoupling/Filtering capacitors must be added to improve
start-up stability and reduce source voltage drop.
VDDOUT
Decoupling/filtering capacitor
(100nF and 2.2μF)(1)(2)
1.2V output of the main voltage regulator. Decoupling/Filtering capacitors must be added to guarantee stability.
VDDCORE
Must be connected directly to
VDDOUT pin.
Decoupling/filtering capacitor
(100nF)(1)(2)
Powers the Core, the embedded memories (SRAM,
Flash), the PLL and integrated peripherals.
GND
Ground
Ground pins GND are common to VDDIO and VDDCORE
VDDIO
Note:
1.
2.
These values are given only as a typical example.
Capacitors should be placed as close as possible to each pin in the signal group, vias should be avoided.
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1.1.2
64-pin LQFP/LQFN Packages
The 64-pin packages have VDDUSB pin which needs to be powered independently if USB functionality is
required. If not, VDDUSB can be directly connected to the Main Supply. VDDCORE should always be
connected to VDDOUT. Figure 1-2 shows the standard power supply for the 64-pin LQFP/LQFN packages.
Figure 1-2.
Power Supply Schematic Example for 64-pin LQFP/LQFN Packages
VDDUSB
USB
4.7µF
(1)(2)
100nF
(1)(2)(3)
Flash
Memories
Peripheral
I/Os
ADC
Main supply
(1.62V - 3.6V)
VDDIO
4.7µF
100nF
(1)(2)
(1)(2)(3)
Voltage
Regulator
100nF
(1)(2)
2.2µF
VDDOUT
(1)(2)
100nF
VDDCORE
Core
(1)(2)(3)
Memories
(SRAM, Flash)
PLL
Peripherals
SAM G55
Note:
4
1.
2.
3.
These values are given only as a typical example.
Capacitors should be placed as close as possible to each pin in the signal group, vias should be avoided.
Decoupling capacitors must be connected as close as possible to the microcontroller and on each concerned
pin.
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G55 Schematic Checklist [APPLICATION NOTE]
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Main supply
4.7µF
100nF
VDDIO
100nF
VDDIO
100nF
VDDIO
SAM G55
The checklist, Table 1-2, must be followed in order to ensure correct hardware configuration for power supply.
Table 1-2.
Note:
1.2
Single Power Supply Checklist
Signal name
Recommended pin connection
Description
VDDIO
1.62V to 3.6V
Decoupling/Filtering capacitors
(100nF and 4.7μF)(1)(2)
Powers the peripheral I/Os, Flash memory (dual rail),
ADC, 32kHz crystal oscillator and oscillator pads.
Decoupling/Filtering capacitors must be added to improve
start-up stability and reduce source voltage drop.
VDDUSB
3.0V to 3.6V
If USB is not used, VDDUSB
can be connected to Main Supply.
Decoupling/Filtering capacitors
(100nF and 4.7μF)(1)(2)
Powers USB cells.
Decoupling/Filtering capacitors must be added to improve
start-up stability and reduce source voltage drop.
VDDOUT
Decoupling/filtering capacitor
(100nF and 2.2μF)(1)(2)
1.2V output of the main voltage regulator.
Decoupling/Filtering capacitors must be added to
guarantee stability.
VDDCORE
Must be connected directly to
VDDOUT pin.
Decoupling/filtering capacitor
(100nF)(1)(2)
Powers the Core, the embedded memories (SRAM,
Flash), the PLL, and integrated peripherals.
GND
Ground
Ground pins GND are common to VDDIO and VDDCORE
1.
2.
These values are given only as a typical example.
Capacitors should be placed as close as possible to each pin in the signal group, vias should be avoided.
Clocks and Oscillators Configuration
There are three possible configurations for Main and 32kHz clocks:

Oscillator in Normal Mode

Oscillator in Bypass

Internal RC Oscillator
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1.2.1
Main Clock/Oscillators
Figure 1-3 shows a standard main crystal hardware implementation.
Figure 1-3.
Main Crystal Schematic Example
CL
SAM G55
XIN
XOUT
R = 1k if Crystal Frequency
is lower than 8MHz
CCRYSTAL
CLEXT
CLEXT
The checklist, Table 1-3, must be followed in order to ensure correct hardware configuration for main
Clock/Oscillators.
Table 1-3.
Main Clock, Oscillators Checklist
Signal name
Recommended pin connection
Description
Internal Equivalent Load Capacitance
(CL = 12.5pF to 17.5pF):
Crystals between 3 and 20MHz
PB9/XIN
PB8/XOUT
Main Oscillator
in Normal
Mode
PB9/XIN
PB8/XOUT
Main Oscillator
in Bypass
Mode
8/16/24MHz
Fast Internal
RC Oscillator
6
Capacitors on XIN and XOUT
(crystal load capacitance
dependent)
1kΩ resistor on XOUT only required for crystals with frequencies lower than 8MHz.
Crystal Load Capacitance, ESR, Drive Level, and Shunt
Capacitance to validate.
The external load capacitance is calculated with the
following formula:
CLEXT=2 (Ccrystal-CL-CPCB)
Refer to the Crystal Oscillators Design Consideration Information section of the SAM G5x Series Datasheet.
By default, at start-up the chip runs out of the Master
Clock using the fast RC oscillator running at 8MHz.
PB9/XIN: external clock source
PB8/XOUT: can be left unconnected or used as GPIO.
1.62V to 3.6V Square wave signal (VDDIO)
External Clock Source up to 50MHz Duty Cycle:
40 to 60%
By default, at start-up the chip runs out of the Master
Clock using the fast RC oscillator running at 8MHz.
PB9/XIN and PB8/XOUT: can be
left unconnected or used as GPIO
Powered up by VDDIO
The output frequency is configurable through the PMC
registers.
The Fast RC oscillator is calibrated in production.
The frequency can be trimmed by software.
Duty Cycle: 40 to 60%
By default, at start-up the chip runs out of the Master
Clock using the fast RC oscillator running at 8MHz.
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G55 Schematic Checklist [APPLICATION NOTE]
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1.2.2
32kHz Clock/Oscillators
Figure 1-4 shows a standard 32kHz crystal hardware implementation.
Figure 1-4.
32kHz Crystal Schematic Example
CL
SAM G55
XIN32
XOUT32
32.768kHz
CLEXT
C LEXT
The checklist, Table 1-4, must be followed in order to ensure correct hardware configuration for 32kHz
Clock/Oscillator.
Table 1-4.
32kHz Clock, Oscillators Checklist
Signal name
Recommended pin connection
Description
Internal parasitic capacitance Cpara=0.5pF (typ.)
PA7/XIN32
PA8/XOUT32
32kHz crystal
used
PA7/XIN32
PA8/XOUT32
32kHz oscillator in bypass
mode
1.3
Crystal Load Capacitance, ESR, Drive Level and Shunt
Capacitance to validate.
32.768kHz Crystal Capacitors on
XIN32 and XOUT32 (crystal load
capacitance dependent).
CLEXTmax=24pF
CLEXT= 2x(Ccrystal-Cpara- Cpcb)
Refer to the Crystal Oscillators Design Consideration Information section of the SAM G5x Series Datasheet.
By default, at start-up the chip runs out of the
embedded 32kHz RC oscillator
PA7/XIN32: external clock source
PA8/XOUT32: can be left unconnected or use as GPIO.
1.62V to 3.6V Square wave signal (VDDIO)
External Clock Source up to 50MHz Duty Cycle:
40 to 60%
By default, at start-up the chip runs out of the Master
Clock using the fast RC oscillator running at 8MHz.
Serial Wire and JTAG
Figure 1-5, Figure 1-6, Figure 1-7, and Figure 1-8 show a standard JTAG/SWD hardware implementation with
10-pin Cortex-M connector and 20-pin connector. It is recommended to establish accessibility to a JTAG/SWD
connector for debug in any case.
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Figure 1-5.
JTAG Schematic Example: 10-pin Cortex-M Connector
VDDIO
100k
1
3
5
7
9
VTref
GND
GND
NC
NC
SWDIO/TMS
SWCLK/TCK
SWO/TDO
TDI
nRESET
100k
100k
2
4
6
8
10
TMS
TCK
TDO
TDI
nRST
10 pin Cortex-M connector
Figure 1-6.
JTAG Schematic Example: JTAG 20-pin Connector
VDDIO
100k
100k
100k
1
3
5
7
9
11
13
15
17
19
TDI
TMS
TCK
TDO
nRST
VTref
nTRST
TDI
TMS
TCK
RTCK
TDO
nSRST
DBGRQ
5V-Target
NC
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
2
4
6
8
10
12
14
16
18
20
JTAG 20-pin connector
Figure 1-7.
SWD Schematic Example: 10-pin Cortex-M Connector
VDDIO
100k
1
3
5
7
9
VTref
GND
GND
NC
NC
SWDIO/TMS
SWCLK/TCK
SWO/TDO
TDI
nRESET
2
4
6
8
10
10 pin Cortex-M connector
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G55 Schematic Checklist [APPLICATION NOTE]
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100k
SWDIO
SWCLK
SWO
nRST
Figure 1-8.
SWD Schematic Example: SWD 20-pin Connector
VDDIO
100k
100k
1
3
5
7
9
11
13
15
17
19
SWDIO
SWCLK
TRACESWO
nRST
VTref
Not Used
Not Used
SWDIO
SWCLK
Not Used
SWO
RESET
Not Used
5V-Target
NC
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
2
4
6
8
10
12
14
16
18
20
SWD 20-pin connector
The checklist, Table 1-5, must be followed in order to ensure correct hardware configuration for JTAG/SWD.
Table 1-5.
Serial Wire and JTAG Checklist
Signal name
Recommended pin connection
Description
TCK/SWCLK/PB7
Application dependent.
If debug mode is not required this pin can
be use as GPIO.
Reset State:
- SWJ-DP Mode
- Internal pull-up disabled
- Schmitt Trigger enabled
TMS/SWDIO/PB6
Application dependent.
If debug mode is not required this pin can
be use as GPIO.
Reset state:
- SWJ-DP Mode
- Internal pull-up disabled
- Schmitt Trigger enabled
TDI/PB4
Application dependent.
If debug mode is not required this pin can
be use as GPIO.
Reset state:
- SWJ-DP Mode
- Internal pull-up disabled
- Schmitt Trigger enabled
TDO/TRACESWO/PB5
Application dependent.
If debug mode is not required this pin can
be use as GPIO.
Reset state:
- SWJ-DP Mode
- Internal pull-up disabled
- Schmitt Trigger enabled
JTAGSEL
Application dependent.
Must be tied to VDDIO to enter JTAG
Boundary Scan.
In harsh environments, It is strongly
recommended to tie this pin to GND.
Permanent Internal pull-down resistor
(15kΩ)
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1.4
Flash Memory
Signal name
Recommended pin connection
Application dependent.
If hardware erase is not required this pin
can be use as GPIO.
ERASE/PB12
Note:
1.5
Description
Internal pull-down resistor (15kΩ).
Must be tied to VDDIO to erase the General Purpose NVM bits (GPNVMx), the
whole Flash content and the security bit.
Reset state:
Erase Input, with a 15kΩ Internal pull down
and Schmitt trigger enabled
The minimum erase pin assertion for erase effectiveness is 200ms.
Reset and Test Pins
Figure 1-9, shows a standard reset hardware implementation.
Figure 1-9.
Reset Hardware Implementation
VDDIO
100k
39
39
NRST
100nF
GND
SAM G55
Signal name
NRST
Recommended pin connection
Application dependent.
Can be connected to a push button for
hardware reset.
TST pin can be left unconnected in normal mode.
TST
In harsh environments, It is strongly
recommended to tie this pin to GND.
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G55 Schematic Checklist [APPLICATION NOTE]
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Description
By default, the NRST pin is configured as
an input Permanent internal pull-up resistor to VDDIO.
NRST pin is also used to enter in bootloader mode if toggled according to a specific sequence
(see the Bootloader section)
Permanent internal pull-down resistor
(15kΩ).
1.6
USB
1.6.1
USB Device Port
Figure 1-10 shows a typical USB device port hardware implementation. VBUS monitoring is done using a
standard PIO with internal pull-up disabled.
Figure 1-10.
USB Device Typical Implementation
Signal name
DM/PA21
Recommended pin connection
Description
Application dependent (see figure above)
Reset State:
- USB Mode
- Internal Pull-down
If USB device support is not required this
pin can be use as GPIO.
Application dependent (see figure above)
DP/PA22
1.6.2
If USB device support is not required this
pin can be use as GPIO.
Reset State:
- USB Mode
- Internal Pull-down
USB Host Port
Figure 1-11 shows a typical USB host port hardware implementation.
Figure 1-11.
USB Host Typical Implementation
DM
DP
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Signal name
DM/PA21
Recommended pin connection
Application dependent (see above figure)
In USB Host mode, an external pull-down
is required.
If USB host support is not required this
pin can be use as GPIO.
DP/PA22
Application dependent (see above figure)
In USB Host mode, an external pull-down
is required.
If USB host support is not required this
pin can be use as GPIO.
1.7
Description
Reset State:
- USB Mode
- Internal Pull-down
Reset State:
- USB Mode
- Internal Pull-down
PIOs
Signal name
Recommended pin connection
Description
At reset, all PIOs are in IO or System IO
mode with Schmitt trigger inputs and internal pull-up enabled.
PAx – PBx
1.8
Application dependent
(Pulled-up on VDDIO)
To reduce power consumption, if not used,
the concerned PIO can be configured as
an output and driven at ‘0’ with internal
pull-up disabled.
Bootloader
The SAM G55 embeds a bootloader in ROM memory. The table below gives the pins driven by the bootloader.
Signal name
Recommended pin connection
Description
NRST
Application dependent
Bootloader entry line / Reset Line
NCHG/PA01
Application dependent
Bootloader handshake
TWD/PA03
Application dependent
TWI3 data line
TWCK/PA04
Application dependent
TWI3 clock
NPCS0/PA11
Application dependent
SPI chip select
MISO/PA12
Application dependent
SPI master IN, slave OUT
MOSI/PA13
Application dependent
SPI master OUT, slave IN
SPCK/PA14
Application dependent
SPI clock
For more information on the bootloader, refer to the application note mentioned in Chapter 2 Suggested
Reading.
12
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G55 Schematic Checklist [APPLICATION NOTE]
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2
Suggested Reading
2.1
Device Datasheet
The device datasheet contains block diagrams of the peripherals and details about implementing firmware for
the device. It also contains the electrical specifications and expected characteristics of the device.
The datasheet is available on http://www.atmel.com/ in the Datasheets section of the product page.
2.2
Xplained Pro User Guide
The SAM G55 Xplained Pro user guide contains schematics that can be used as a starting point when
designing with the SAM G55 devices. This user guide is available on http://www.atmel.com/ in the documents
section of the SAM G55 Xplained Pro.
2.3
Bootloader
This application note describes how to use the SPI/TWI bootloader embedded in internal ROM, its entry
sequence, and how to use the available tool coming with this application note (firmware file generator).
The application note is available on http://www.atmel.com/ in the Application Note section of the product page
(literature number is AT09002).
2.4
ARM Documentation on Cortex-M4 Core

Cortex-M4 Devices Generic User Guide for revision r0p1

Cortex-M4 Technical Reference Manual for revision r0p1
These documents are available at http://www.arm.com/ in the infocenter section.
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Revision History
Doc Rev.
Date
Comments
42392C
04/2016
Section 1.5: removed reference to FFPI
42392B
09/2015
Section 1.8: TWI0 has been corrected to TWI3.
Some typos fixed.
42392A
01/2015
Initial document release.
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G55 Schematic Checklist [APPLICATION NOTE]
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