LITTELFUSE SP0333

SPA Silicon Protection Arrays
TM
Low Capacitance TVS protection for high-speed data interfaces
RoHS
Pb
GREEN
SP03-3.3 (SO-8) Series
Description
This new broadband protection device from Littelfuse
provides overvoltage protection for applications such
as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces,
ADSL2+, and VDSL2+. This new protector combines the
TVS diode element with a diode rectifier bridge to provide
both longitudinal and differential protection in one package.
This design innovation results in a capacitive loading
characteristic that is log-linear with respect to the signal
voltage across the device. This reduces intermodulation
(IM) distortion caused by a typical solid-state protection
solution. The application schematic provides the
connection information.
Agency Approvals - Pending
Features
Agency
Agency File Number
nanoseconds
E128662
package (JEDEC SO-8)
linear capacitance
Pinout
8
2
7
3
6
4
5
and metallic protection
IEC61000-4-5, 100A
(8/20μs)
SP03-3.3 (SO-8)
1
component
Applications
SO-8 (Top View)
Ethernet
Functional Block Diagram
Line in
Pin 1 and 8
Line out
Pin 2, 3, 6,
and 7
Ground
Line out
Line in
Pin 4 and 5
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
97
SP03-3.3 (SO-8) Series
SPA Silicon Protection Arrays
TM
Low Capacitance TVS protection for high-speed data interfaces
Absolute Maximum Ratings
Parameter
Rating
Units
Peak Pulse Current (8/20μs)
150
A
Peak Pulse Power (8/20μs)
3300
W
IEC 61000-4-2, Direct Discharge, (Level 4)
30
kV
IEC 61000-4-2, Air Discharge, (Level 4)
30
kV
Telcordia GR 1089 (Intra-Building) (2/10μs)
100
A
ITU K.20 (5/310μs)
40
A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
170
°C/W
Operating Temperature Range
-55 to 125
°C
Storage Temperature Range
SOIC Package
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 10s) (SOIC - Lead Tips Only)
300
°C
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VRWM
-
-
-
3.3
V
Reverse Breakdown Voltage
VBR
IT= 2μA
3.3
-
-
V
Reverse Breakdown Voltage
VBR
IT= 50μA
3.3
-
-
V
Reverse Leakage Current
IR
VRWM= 3.3V, T= 25°C
-
-
1
μA
Clamping Voltage, Line-Ground
VC
IPP= 50A, tp=8/20 μs
-
-
11.5
V
Clamping Voltage, Line-Ground
VC
IPP= 100A, tp=8/20 μs
-
-
15
V
Clamping Voltage, Line-Line
VC
IPP= 50A, tp=8/20 μs
-
-
13.5
V
Clamping Voltage, Line-Line
VC
Reverse Stand-Off Voltage
Junction Capacitance
SP03-3.3 (SO-8) Series
Cj
IPP= 100A, tp=8/20 μs
-
-
18
V
Between I/O Pins and Ground
VR=0V, f= 1MHz
-
16
25
pF
Between I/O Pins
VR=0V, f= 1MHz
-
8
12
pF
98
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA Silicon Protection Arrays
TM
Low Capacitance TVS protection for high-speed data interfaces
Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time
Figure 2: Current Derating Curve
120
Percentage of Rated Current (%I P)
Peak Pulse Current (A)
1000
100
10
100
80
60
40
20
1
1
10
10 0
0
10 0 0
0
20
40
60
80
100
120
140
160
Ambient Temperature (C)
Pulse decay time (μs)
Figure 3: Pulse Waveform
Figure 4: Clamping Voltage vs. Peak Pulse Current
20
100
18
VC Clamping Voltage (V)
Percentage of IPP (%)
16
80
60
40
20
14
12
Line to Line
10
8
6
Line to Ground
4
0
0
0
5
10
15
20
25
30
35
0
40
10
20
30
40
Figure 5: Capacitance vs. Reverse Voltage
60
70
80
90
100
Figure 6: Forward Voltage vs. Forward Current
7
20
18
6
Line to Ground
Ground-to-Line
Forward Voltage (V)
16
Capacitance (pF)
50
IP Peak Impulse Current (A)
Time, μs
14
12
10
8
Line to Line
6
4
5
4
3
2
1
2
0
0
0
0.5
1
1.5
2
2.5
0
3
Reverse Voltage (V)
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
10
20
30
40
50
60
70
80
90
100
Forward Current (A)
99
SP03-3.3 (SO-8) Series
SP03-3.3 (SO-8)
2
SPA Silicon Protection Arrays
TM
Low Capacitance TVS protection for high-speed data interfaces
Application Example
The following schematic shows a high-speed data interface
protects against both positive and negative induced surge
events. The TeleLink fuse provides overcurrent protection
(differential) and longitudinal (common mode) protection
from lightning induced surge events. Its surge rating is
compatible with the intra-building surge requirements
TIP
1
8
2
7
3
6
4
5
to chipset
(Ethernet PHY,
T3/E3 PHY, etc.)
RING
TeleLink (0461 1.25)
SP03-3.3
Soldering Parameters
Reflow Condition
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
SP03-3.3 (SO-8) Series
260°C
100
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA Silicon Protection Arrays
TM
Low Capacitance TVS protection for high-speed data interfaces
Package Dimensions - Mechanical Drawings and Recommended Solder Pad Outline
Package
MS-012 (SO-8)
Pins
8
JEDEC
MO-223 Issue A
Millimetres
Inches
LF
A
1.35
1.75
0.053
o
A1
0.10
0.25
0.004
Min
Recommended
Soldering Pad Outline
(Reference Only)
Min
Max
0.010
A2
1.25
1.65
0.043
0.065
B
0.31
0.51
0.012
0.020
c
0.017
0.25
0.007
0.010
D
4.80
5.00
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
L
Part Numbering System
Max
1.27 BSC
0.050 BSC
1.27
0.40
0.016
0.050
Product Characteristics
SP XX XX X T G
G= Green
T= Tape & Reel
Series
Working
Voltage
Package
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Flammability
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
Part Marking System
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
LF SP03-3.3
XXXXXXXX
First Line: Part number
Second Line: Date code
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
2500
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
101
SP03-3.3 (SO-8) Series
SP03-3.3 (SO-8)
Silicon
Protection Array
Lead Plating
SPA Silicon Protection Arrays
TM
Low Capacitance TVS protection for high-speed data interfaces
Embossed Carrier Tape & Reel Specification - SOIC Package
Dimensions
Millimetres
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
5.4
5.6
0.213
0.22
2.05
0.077
0.081
P2
D
1.5
D1
10P0
0.063
4.1
40.0 +/- 0.20
0.154
12.1
0.468
P
8.1
0.311
A0
6.3
6.5
0.248
B0
5.1
5.3
0.2
K0
2
2.2
0.30 +/- 0.05
0.161
1.574 +/- 0.008
W
t
102
1.6
1.50 Min
P0
SP03-3.3 (SO-8) Series
Inches
Min
0.476
0.256
0.087
0.012 +/- 0.002
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.