SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces RoHS Pb GREEN SP03-3.3 (SO-8) Series Description This new broadband protection device from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Agency Approvals - Pending Features Agency Agency File Number nanoseconds E128662 package (JEDEC SO-8) linear capacitance Pinout 8 2 7 3 6 4 5 and metallic protection IEC61000-4-5, 100A (8/20μs) SP03-3.3 (SO-8) 1 component Applications SO-8 (Top View) Ethernet Functional Block Diagram Line in Pin 1 and 8 Line out Pin 2, 3, 6, and 7 Ground Line out Line in Pin 4 and 5 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 97 SP03-3.3 (SO-8) Series SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Absolute Maximum Ratings Parameter Rating Units Peak Pulse Current (8/20μs) 150 A Peak Pulse Power (8/20μs) 3300 W IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV IEC 61000-4-2, Air Discharge, (Level 4) 30 kV Telcordia GR 1089 (Intra-Building) (2/10μs) 100 A ITU K.20 (5/310μs) 40 A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units 170 °C/W Operating Temperature Range -55 to 125 °C Storage Temperature Range SOIC Package -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) (SOIC - Lead Tips Only) 300 °C Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VRWM - - - 3.3 V Reverse Breakdown Voltage VBR IT= 2μA 3.3 - - V Reverse Breakdown Voltage VBR IT= 50μA 3.3 - - V Reverse Leakage Current IR VRWM= 3.3V, T= 25°C - - 1 μA Clamping Voltage, Line-Ground VC IPP= 50A, tp=8/20 μs - - 11.5 V Clamping Voltage, Line-Ground VC IPP= 100A, tp=8/20 μs - - 15 V Clamping Voltage, Line-Line VC IPP= 50A, tp=8/20 μs - - 13.5 V Clamping Voltage, Line-Line VC Reverse Stand-Off Voltage Junction Capacitance SP03-3.3 (SO-8) Series Cj IPP= 100A, tp=8/20 μs - - 18 V Between I/O Pins and Ground VR=0V, f= 1MHz - 16 25 pF Between I/O Pins VR=0V, f= 1MHz - 8 12 pF 98 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time Figure 2: Current Derating Curve 120 Percentage of Rated Current (%I P) Peak Pulse Current (A) 1000 100 10 100 80 60 40 20 1 1 10 10 0 0 10 0 0 0 20 40 60 80 100 120 140 160 Ambient Temperature (C) Pulse decay time (μs) Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 20 100 18 VC Clamping Voltage (V) Percentage of IPP (%) 16 80 60 40 20 14 12 Line to Line 10 8 6 Line to Ground 4 0 0 0 5 10 15 20 25 30 35 0 40 10 20 30 40 Figure 5: Capacitance vs. Reverse Voltage 60 70 80 90 100 Figure 6: Forward Voltage vs. Forward Current 7 20 18 6 Line to Ground Ground-to-Line Forward Voltage (V) 16 Capacitance (pF) 50 IP Peak Impulse Current (A) Time, μs 14 12 10 8 Line to Line 6 4 5 4 3 2 1 2 0 0 0 0.5 1 1.5 2 2.5 0 3 Reverse Voltage (V) ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 10 20 30 40 50 60 70 80 90 100 Forward Current (A) 99 SP03-3.3 (SO-8) Series SP03-3.3 (SO-8) 2 SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Application Example The following schematic shows a high-speed data interface protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements TIP 1 8 2 7 3 6 4 5 to chipset (Ethernet PHY, T3/E3 PHY, etc.) RING TeleLink (0461 1.25) SP03-3.3 Soldering Parameters Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP03-3.3 (SO-8) Series 260°C 100 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Package Dimensions - Mechanical Drawings and Recommended Solder Pad Outline Package MS-012 (SO-8) Pins 8 JEDEC MO-223 Issue A Millimetres Inches LF A 1.35 1.75 0.053 o A1 0.10 0.25 0.004 Min Recommended Soldering Pad Outline (Reference Only) Min Max 0.010 A2 1.25 1.65 0.043 0.065 B 0.31 0.51 0.012 0.020 c 0.017 0.25 0.007 0.010 D 4.80 5.00 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e L Part Numbering System Max 1.27 BSC 0.050 BSC 1.27 0.40 0.016 0.050 Product Characteristics SP XX XX X T G G= Green T= Tape & Reel Series Working Voltage Package Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Subsitute Material Silicon Body Material Flammability Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. LF SP03-3.3 XXXXXXXX First Line: Part number Second Line: Date code Ordering Information Part Number Package Marking Min. Order Qty. 2500 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 101 SP03-3.3 (SO-8) Series SP03-3.3 (SO-8) Silicon Protection Array Lead Plating SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Embossed Carrier Tape & Reel Specification - SOIC Package Dimensions Millimetres Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 2.05 0.077 0.081 P2 D 1.5 D1 10P0 0.063 4.1 40.0 +/- 0.20 0.154 12.1 0.468 P 8.1 0.311 A0 6.3 6.5 0.248 B0 5.1 5.3 0.2 K0 2 2.2 0.30 +/- 0.05 0.161 1.574 +/- 0.008 W t 102 1.6 1.50 Min P0 SP03-3.3 (SO-8) Series Inches Min 0.476 0.256 0.087 0.012 +/- 0.002 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.