GP2AP002S30F GP2AP002S30F Proximity Sensor ■Description ■Agency approvals/Compliance GP2AP002S30F provide a digital detection system integrated into one package the light emitting element and a light receiving element. So small package size, it is easy to mount on the equipment. 1. Compliant with RoHS directive (2002/95/EC) ■Applications 1. Mobile phone 2. Smartphone, Tablet 3. Digital single-lens reflex camera ■Features 1. Drastically reduced LED current consumption by employing a light modulation system 2. Compact size (4.0 × 2.0 × 1.25t mm) 3. Built-in LED for simple optical design 4. I2C output type Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: OP13036EN 1 GP2AP002S30F ■ Schematic Internal Block Diagram Vcc Output buffer AMP LEDA Synchronized Signal Detection ● ● Vout ● LED driver LEDC ● I2C Interface Oscillator Vio SDA SCL Power on Reset GND Sheet No.: OP13036EN 2 GP2AP002S30F ■Outline Dimensions This letter means : Model No. : Direction discrimination 4 IR Emitter 1.25±0.1 R0.45 IR Detector R0.45 2 0.05 2 1.375 0.05 2 1.275 ⑥ ⑦ ⑧ ② ① ④ ③ P=1.075 ④ ⑤ ③ ⑥ ② ⑦ 0.45 1 1 ⑤ 0.45 0.4 0.675 Pin ① ② ③ ④ ⑤ ⑥ ① ⑧ ⑦ ⑧ 1) area : Au plating 2) area : Resist plating Pin name LED Anode LED Cathode Supply voltage Output Symbol LEDA LEDC Vcc Vout Ground Logic I/O voltage I2C DATA BUS I2C CLOCK GND Vio SDA SCL 3) Adhesion of resin to tne terminal area shall be allowed Max.0.2mm SCALE MATERIAL FINISH Name 10/1 UNIT 1=1/1mm Terminal : Cu Package : Epoxy resin Terminal : Ni(≧3μm), Au(≧0.1μm) GP2AP002S30F Outline dimension Drawing No. C Y 1 5 0 6 0 i 0 2 Sheet No.: OP13036EN 3 GP2AP002S30F ■Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage LED supply voltage Vcc VLED -0.3 to 3.8 -0.3 to 3.8 V V LED peak forward current ILED mA Logic I/O supply voltage Vio SDA/SCL pull-up voltage - °C °C Operating temperature Topr 300 -0.3 to Vcc+0.3 and 3.8V or less Vio-0.3 to Vio+0.3 and 3.8V or less -25 to +85 Storage temperature Soldering temperature Tstg Tsol -40 to +85 260 V V Ta=25°C (unless otherwise specified) Remarks Cf. 7)Notes, 5) Directions for power-line connection Cf. 7)Notes, 5) Directions for power-line connection °C peak temperature duration:10sec ■Recommended Operating Conditions Parameter Symbol Operating condition Unit Supply voltage LED supply voltage Vcc VLED 2.4 to 3.6 2.4 to 3.6 V V Operating temperature Topr -25 to 85 °C Logic I/O supply voltage SCL, SDA input low level Vio VIL 1.65 to Vcc -0.3 to 0.2×Vio V V SCL, SDA input high level VIH 0.8×Vio to Vio+0.3 V Ta=25°C (unless otherwise specified) Remarks ■Electrical and Optical Characteristics Parameter operating mode Current consumption shutdown mode LED peak current Peak emission wavelength Ta=25°C ,Vcc=3.3V, VLED=3.3V RLED=6.8Ω (unless otherwise specified) Symbol Min. Typ. Max. Unit Remarks No detection object, Ev=0 lx. ICC 240 600 *1, except for LED and driver uA No input signal. ICC-S 1.0 *1, except for LED and driver ILED 170 mA λp 940 nm Vout terminal High level output voltage VOH Vout terminal Low level output voltage Response time (H→L) VOL tpHL - - 0.5 50 Response time (L→H) Rise time tpLH tr - 1 50 - tf - 1 - Maximum detection distance Lon 25 65 - Minimum no detection distance Loff - 78 150 V IOL=1mA, *2 ms *2 ms μs *2, CL=15pF μs *3, Detection object: mm KODAK Gray Card (r = 0.18) Operation mode B1 mm Wake up time Maximum acceptable illuminance tsdw Ev 3000 - 100 - ms *4 lx *5 SCL clock frequency SCL 4 - 400 kHz Fall time Vio-0.5 Vio-0.3 Vio+0.3 V IOH=0.3mA,*2 *1. Current consumption through VLED terminal (including LED and its driver output) depends on actual environment and situations. (See attached document【1】1-1) Sheet No.: OP13036EN 4 GP2AP002S30F *2. Parameters defined for Vout output waveform specifications. With detection object State of the object to be detected tpHL Without detection object tpLH tr tf VOH 90% Vout output (at normal output mode) 50% 10% VOL *3. Detection distance KODAK Gray Card d GP2AP002S30F GP2AP002S30F output example vs. distance characteristics (operation mode B1) Minimum No Detection Distance Maximum Detection Distance VO value Detection→ ←No Detection 1 0 0 20 40 60 80 100 120 140 160 180 200 Distance, d (mm) Sheet No.: OP13036EN 5 GP2AP002S30F *4. Wake up time, tsdw, is defined as a delay of the 1 st LED emission after issuing the I2C write command to release GP2AP002S30F from the shutdown mode. Note that there should be no external light noise sources in this particular examination. Also, by definition, it does not matter where reflective object is, but it is recommended that the object should be placed at d << Lon because VO is initialized to 0 and the next expected change is 0 to 1. *5. Test set-up for “Maximum Acceptable Illuminance” measurement GP2AP002S30F Light source A Emitter/Detector surface Illuminance should be measured and evaluated at Emitter/Detector surface of GP2AP002S30F. The maximum acceptable illuminance, Ev, is a maximum level of illuminance at which GP2AP002S30F should keep its sensing result, VO, as "0" (no detection) as long as no reflective objects exist. However, GP2AP002S30F may start to exhibit false detection with external light noise beyond this level. See attached document【1】1-10 for more details. ■Supplement ●This product is built-in photodiode. ●Compliance with each regulation 1) The RoHS directive (2002/95/EC) This product complies with the RoHS directive (2002/95/EC). Object substances : mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) 2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Toxic and hazardous substances Hexavalent Polybrominated Polybrominated Category Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) Proximity sensor ✓ ✓ ✓ ✓ ✓ ✓ ✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard . ●This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform) ●Brominated flame retardants Specific brominated flame retardants such as the PBB and PBDE are not used in this device at all. ●Product mass : Approx . 0.017 g ●Country of origin : China ●Packing : Refer to the attached sheet, Page 16. ●Moisture level: MSL3 Sheet No.: OP13036EN 6 GP2AP002S30F ■Notes ●Before the circuit design In circuit designing, make allowance for the degradation of the light emitting diode output that results from long continuous operation. (50% degradation/5 years) ●Please take proper methods to prevent ESD. The IC built in GP2AP002S30F is ESD-sensitive because it is fabricated by sub-micron CMOS process. For example, in handling GP2AP002S30F, human body and soldering iron etc. should be grounded. ●As it takes at most 100ms to let GP2AP002S30F go to active operation from shut-down mode, please take this delay into system design consideration. Also, if the host system relies on the actual value of this delay, e.g. to do frequent software shutdown, please thoroughly make sure that the operation be successful in any realistic situation. ●Regarding to prevention of malfunction To prevent GP2AP002S30F from faulty operation due to external light noise sources, do not set the detection surface to these sources directly. Under very unlikely situation, GP2AP002S30F output may fall into malfunction (See attached document【1】1-10 for more detail). It can be reset by letting GP2AP002S30F go shutdown once, and then activating GP2AP002S30F again. In case of this, take it into consideration, in software implementation, to prepare a method to reset GP2AP002S30F. Also, if some other electronic components are placed close to this device, faulty operation may occur. (The light reflection caused by the other components may slip into the photo-detecting portion of the device and may cause faulty operation.) ●Directions for power-line connection Avoid that GP2AP002S30F’s SDA/SCL terminals are pulled-up to the other power line than GP2AP002S30F’s Vio terminal even if they are in the same operating voltage. See also ●Recommended external circuit. For example, when you shut down GP2AP002S30F by letting Vcc and Vio terminals go to GND level (instead of using software shutdown function), and if GP2AP002S30F’s SDA/SCL terminals are still pulled-up to another active power line, these terminals will draw significant currents from a pull-up resister through internal ESD devices and the SCL and SDA lines are pulled-down, which causes system error (I2C bus error). Also, when you consider reducing total current consumption of the I 2C devices by turning off the power line(s), avoid that one of the Vcc and Vio terminals of GP2AP002S30F is turned off and the other is kept on. It never shuts down GP2AP002S30F’s current consumption, but possibly yields excessive current between these power lines. Please consider making use of “software shutdown” function. However, when you do have to turn off one of these power lines (Vcc, Vio, SDA/SCL pull-up level), all of them in GP2AP002S30F should be turned off for the purpose of choking GP2AP002S30F’s current consumption regardless of the register setting for the software shutdown function. ●Directions for I2C-bus interface GP2AP002S30F is equipped with a 7-bit address as a slave device on the I2C bus interface. Through the SDA and SCL terminals, GP2AP002S30F’s registers can be set up, and also GP2AP002S30F’s sensing result can be read out. However, the read format specified for GP2AP002S30F is a proprietary one that differs from the normal read format (immediately after the first byte) or the combined format shown in the I 2C-bus specification version 2.1, January 2000. For more details to let GP2AP002S30F operate properly, see attached document【1】1-2, I2C-bus interface, and【2】 recommended operation mode / register setting procedure. ●After being mounted and soldered, if GP2AP002S30F is deformed by external force or impact, e.g. something falls onto the device, it may result in defective implementation such as lift-off of the terminals. Careful handling should be taken. ●For soldering Refer to the page 10 ●For cleaning Cleaning shall carry out as the below items to avoid keeping solvent, solder and flux on the device (1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min or less (2) Ultrasonic cleaning : Please don't carry out ultrasonic cleaning. (3) The cleaning shall be carried out with solvent below. Solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol Sheet No.: OP13036EN 7 GP2AP002S30F ●Recommended external circuit (Top View) Vcc R1 CX1 VLED N.C. CX4 RLED CX2 Vout ④ Vcc ③ GND ⑤ Vio ⑥ LEDC ② LEDA ① ⑦ SCL ⑧ SDA Vio pull-up level Rp CX3 Components Recommended values CX1 4.7uF (Ceramic) CX2 0.1uF (Ceramic) CX3 1.0uF (Ceramic) CX4 10uF (Ceramic) R1 RLED Rp 1/20W 1/20W 1/20W Rp 10 Ω 6.8Ω±1% (VCC=VLED=3.3V) 10k Ω (*) Notes: Place the capacitors CX1 ~ CX4 as close as possible to the corresponding terminals. For CX1 ~ CX3, at most 5mm or less is preferable. Depending on the level and / or frequency component(s) of the power supply noise, CX’s and R1 listed above may not completely eliminate its influence. Therefore, to avoid GP2AP002S30F's false detection which can be greatly influenced by the supply noises, please carefully make sure that there is no problem with the actual electrical implementation. Whenever considering to change VLED voltage, choose proper value for RLED so that the desired ILED is obtained. SDA terminal (as output) and LEDA terminal are NMOS open-drain output. On the other hand, Vout terminal is CMOS output, but it has no high-impedance state. (*) To determine the appropriate value for Rp’s, see section 16 of The I 2C-Bus Specification. Sheet No.: OP13036EN 8 GP2AP002S30F ●Foot pattern of PCB Dimensions are shown for reference. (Top View) 4 2 2 ③ ② ① ⑤ ⑥ ⑦ 0.2 ⑧ ② ① 1 1 ④ ⑤ P=1.075 0.95 0.95 ⑧ ⑥ ⑦ 0.675 0.45 ③ 0.45 ④ Mount center 3.9 1. Dimension in parenthesis are shown for reference. 2. Unit : mm Pin Pin name Symbol ① LED Anode LEDA ② LED Cathode LEDC ③ Vcc Vcc ④ Output Vout ⑤ Ground GND ⑥ Logic I/O Supply Voltage Vio ⑦ I2C DATA BUS SDA ⑧ 2 I C CLOCK SCL ●Recommendable size of solder creamed paste (Reference) : Soldering paste area *Dimension in parenthesis are shown for reference. Unit : mm Sheet No.: OP13036EN 9 GP2AP002S30F ■Precautions for Soldering 1. In case of solder reflow Reflow is allowed only twice at the temperature and the time within the temperature profile as shown in the figure below. Reflow interval shall be within 7days under conditions, 10 to 30°C, 70%RH or less. MAX 260°C 1~5°C/s 220°C 190°C 1~5°C/s 150°C 1~5°C/s 25°C MAX10s MAX120s MAX50s 2. Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. Also avoid immersing the resin part in the soldering. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins. Please use after confirmation the conditions fully actual solder reflow machine. Sheet No.: OP13036EN 10 GP2AP002S30F ■Taping specifications 1. Application This packing specification sheets specify the taping specifications for GP2AP002S30F. 2. Taping method 2-1. Taping material Name Reel Carrier tape Cover tape Material PPE PC PET Counter measure for ESD Conductive type Conductive type Conductive type 2-2. Tape structure and Dimensions (Refer to the page 12.) The tape shall have a structure in which a cover tape is sealed pressed on the carrier tape of conductive Polycarbonate. 2-3. Reel structure and Dimensions (Refer to the page 13.) The taping reel shall be conductive plastic with its dimensions as shown in the attached drawing. 2-4. Direction of product insertion (Refer to the page 13.) Product direction in carrier tape shall be that IR emitter places on the hole side of the tape. 2-5. The way to repair taped failure devices The way to repair taped failure devices cut a bottom of carrier tape with a cutter, and after replacing to good devices, the cutting portion shall be sealed with adhesive tape. 3. Adhesiveness of cover tape The exfoliation force between carrier tape cover tape shall be 0.2N to 1.2N for the angle from 160 degrees to 180 degrees. 4. Rolling method and quantity Wind the tape back on the reel so that the cover tape will be outside the tape. Attach 16cm or more of blank tape to the trailer and 40cm or more of blank tape to the leader and fix the both ends with adhesive tape. One reel shall contain 2000pcs. There must not be continuously two or more Stock-Outs. 5. Safety protection during shipping There shall be no deformation of component or degradation of electrical characteristics due to shipping. Sheet No.: OP13036EN 11 GP2AP002S30F 6-1. Tape structure and Dimensions F G J I E C B A H L D K Sheet No.: OP13036EN 12 GP2AP002S30F 6-2. Reel structure and Dimensions f e d c g b a 6-3. Direction of product insertion Humidity Indicator Pull out direction IR EMITTER Barcode Label (Based on EIAJ C-3) Sheet No.: OP13036EN 13 GP2AP002S30F ■Taping moisture-proof packing 1. Application This packing specification sheets apply to the moist-proof packing for the GP2AP002S30F in the taping package. 2. Packaging specifications 2-1. Packaging material Name Material Aluminum laminate bag Label Siccative Packing case Pads Indicator Aluminum polyethylene Paper(-made) Paper Paper Paper Counter measure for ESD Conductive type Non Non Non Non Non Quantity Refer to 2.2 2-2. Packaging method (1) Fill necessary information to barcode labels. (2) Paste one of the barcode labels and a moisture indicator to a tape reel (contains 2,000 devices per reel). (3) Seal the aluminum laminated bag that contains the tape reel and siccative, and paste one of the barcode labels. (4) Pack 5 aluminum laminated bags (contains 1 reel each) into the designated packing case, where paper pads are placed on the bottom and top of the packing case, as well as each layer of the aluminum laminated bags. Package shape Product Quantity Moisture-proof sack Quantity 1 model 2000pcs. / reel * 1reel / laminated bag Tape reel (φ180mm) Minimum order / shipment quantity should be 1 laminated bag. (5) The packing case would be then sealed with the craft tape, with barcode label (based on EIAJ C-3) (Total of 10,000pcs. per carton) * Except for the case that device is removed. 3. Storage and Treatment after Unsealed 3-1. Storage conditions The delivered product should be stored with the conditions shown below; Storage temperature : 10 to 30°C Humidity : below 70%RH The warranty term for the shipped product shall be for 1 year after shipping to the designated place by the ordered customer. 3-2. Treatment after open (1) After unsealed, devices should be mounted under the temperature condition of 10 to 30°C, at the humidity condition of below 70%RH, within 7days. (2) In case that long term storage is needed, devices should either be stored in dry box, or re-sealed to moist-proof bag with siccative and leave them in the environment where the temperature is 10 to 30°C, at the humidity condition of below 70%RH. Devices must be mounted within 2 weeks. 3-3. Baking before mounting (Refer to the page 15.) In the event that the devices are not maintained in the storage conditions described above, or the enclosed siccative indicator already turned its color to pink, baking must be applied before devices are to be mounted. The case that GP2AP002S30F was not mounted under the temperature condition of 10 to 30°C, at humidity condition of 70%RH or lower within 7 days Baking process must be applied before devices are to be mounted. Please also note that baking should only be applied twice. Recommended condition : ①100°C, 12 to 24 hours ②125°C, 6 to 24hours ※Baking will not properly done in packing condition. To complete the baking properly, devices should be placed to the metal tray. Recommended condition of reel baking : 125°C, 6 to 24hours ※In the case of reel baking hung the reel in the oven by passing the shaft in the center hole of reel. Please avoid laying the reel. Sheet No.: OP13036EN 14 GP2AP002S30F 3-4. Baking treatment before mounting 3.4.1 Placement of reels in an oven (1) Please hang reels by using a center hole for fixing the reel. Please keep some space between reels for better air rotation in the oven. Please do not lay a reel down in the oven to avoid any damages for the tape edge And the flange of reel. (2) Please make sure the carrier tape does not have any slack in a reel before baking to avoid peeling the cover tale off. Since the tape using for fixing carrier tape is not heatproof, there is a case to remain glue. So if necessary, please change the tape to a heatproof one. Sheet No.: OP13036EN 15 GP2AP002S30F ■Packing 4-1. Inner Packing ① Inner Packing drawing Caver tape 2000pcs products Carrier tape ② Inner Packing material : ・Reel(PPE)・Carrier tape(PC)・Caver tape(PET) ③ Quantity : 2000pcs./Reel Taping reel containing products 4-2. Outer Packaging EIAJ C-3 Label Silica gel ① Outer packaging drawing Humidity indicator EIAJ C-3 Label Aluminium laminated sack containing a taping reel Aluminium laminated sack Cushioning material Aluminium laminated bag with tape-reel (5 bags) Packing case Kraft tape EIAJ C-3 Label ② Outer packing material : Packing case (Corrugated cardboard), Cushioning material (Urethane) Aluminium laminated bag (Alumi-Polyethylene) Humidity indicator card (paper), Label (paper), silica gel, craft tape ③ Quantity : 10000pcs./box ④ The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated. Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin ⑤ Regular packaged mass : Approximately 700g Sheet No.: OP13036EN 16 GP2AP002S30F ■Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: OP13036EN 17