GP2W3120YP0F GP2W3120YP0F IrDA Compliant Transceiver Module 9.6 kb/s to 4 Mb/s (FIR) Low Profile Low Consumption Current ■Description ■Agency approvals/Compliance The GP2W3120YP0F is an infrared transceiver module for IrDA ver. 1.4 (FIR). The transceiver consisits of a pin-photo diode, infrared emitter and control IC in a single package. This device have remote control transmission function. 1. Compliant with IEC60825-1 class 1 eye safety standard 2. Compliant with RoHS directive (2002/95/EC) 3. Content status of six substances specified in “ Management Methods for Control of Pollution Caused by Electronic Information Products Regulation ” (popular name : China RoHS) (Chinese : 电子信息产品污染控制管理办法) ; refer to page 14 4. Lead (Pb) free device ■Features 1. Compliant with the IrDA 1.4 (FIR) Transmission speed : 9.6 kb/s to 4 Mb/s Transmission distance : 20 cm 2. Small package L 7.16 × W 2.73 × H 1.82 mm 3. Peak emission wavelength : 890 nm (Built-in shared single LED for RC and IrDA) 4. Side view type 5. Soldering reflow type 6. Shield type 7. Low consumption current due to shutdown function (Consumption current at shutdown mode : Max. 1.0 μA) 8. Operates from 2.7 to 3.3 V 9. With remote control function 10. With LP/HP mode switching function 11. With VIO terminal ■Applications 1. Mobile equipment (Cellular phone, Pager, Smart phone, PDAs, Portable printer, etc. ) 2. Digital imaging equipment (Digital camera, Photo imaging printer) 3. POS equipment 4. Personal computers 5. Personal information tools Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: E3-A00802EN Date Apr.02.2007 ©SHARP Corporation GP2W3120YP0F ■Block diagram SD⑤ ⑥VCC ⑦VIO Amplifier Receive Detector AGC Logic TXD-LP② Driver ④RXD ①LEDA Current controlled driver TXD-HP③ ⑧GND ■Outline Dimensions (Unit : mm) 1) area: Au plating 2) Unspecified tolerance shall be ± 0.2 mm 3) Adhesion of resin to the terminal area shall be allowed Max. 0.2 mm. ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ Terminal Symbol LED Anode LEDA Transmitter Data Input LP TXD-LP Transmitter Data Input HP TXD-HP Receiver Data Output RXD Shutdown SD VCC Supply Voltage VIO Logic I/O levels Ground GND Shield Ground SGND Product mass : approx. 0.05g Sheet No.: E3-A00802EN 2 GP2W3120YP0F ■Recommended PCB Foot Pattern Dimensions are shown for reference (Unit:mm) ● ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ● Terminal Symbol LED Anode LEDA Transmitter Data Input LP TXD-LP Transmitter Data Input HP TXD-HP Receiver Data Output RXD Shutdown SD VCC Supply Voltage VIO Logic I/O levels Ground GND Shield Ground SGND ■Recommended Size of Solder Creamed Paste (Reference) (unit : mm) Dimensions are shown for reference. Please open the solder mask as below so that the size of solder creamed paste for this device before reflow soldering must be as large as one of the foot pattern land indicated for reference. : Solder paste area Sheet No.: E3-A00802EN 3 GP2W3120YP0F ■Absolute Maximum Ratings *1 *2 Parameter Supply voltage LED Supply voltage Transmission Data Input LP Transmission Data Input HP Shut down Logic I/O levels Peak forward current Operating temperature Storage temperature Soldering temperature Symbol VCC VLED TXD-LP TXD-HP SD VIO IFM Topr Tstg Tsol (Ta=25℃) Rating -0.3 to 6.0 -0.3 to 3.6 -0.3 to VCC+0.3 -0.3 to VCC+0.3 -0.3 to VCC+0.3 -0.3 to VCC+0.3 330 -25 to +85 -40 to +85 260 Unit V V V V V V mA ℃ ℃ ℃ *1 Pulse operation (FIR 4 Mb/s) *2 Soldering reflow time : 10 seconds Sheet No.: E3-A00802EN 4 GP2W3120YP0F ■Electro-optical Characteristics Parameter Current consumption SIR mode at no input signal FIR mode Current consumption SIR mode at receiving FIR mode Current consumption All mode at Transmitting Current consumption at Shutdown mode Symbol ICC-SIR ICC-FIR ICC-RSIR ICC-RFIR ICC-T ICC-S High level output voltage Low level output voltage Rise time Fall time Low level pulse width Receiver (Topr=25±5℃, VCC=3.0V Unless otherwise specified) Maximum reception distance Input irradiance Overload irradiance Receiver Latency Receiver wakeup time SD input current SD terminal Input voltage Logic High SD terminal Input voltage Logic Low Jitter VOH VOL tr tf tw1 tw2 tw3 tw4 L Ee1 Ee2 Ee3 tl tsdw Iisd VIHSD VILSD tj Low power IE-LP High power IE-HP Low power High power ILED-LP ILED-HP tr tf λp Radiant intensity Transmitter LED peak current Rise time Fall time Peak emission wave length Rating No input signal, VILSD=0V Output terminal OPEN VILSD=0V Output terminal OPEN VIHTXD-LP=High or, VIHTXD-HP=High, VILSD=0V No input signal, VIHSD=VCC-1.2V Output terminal OPEN *3 MIN. ― ― ― ― TYP. 0.45 1.2 0.65 1.3 MAX. 0.6 1.55 ― ― Unit mA mA mA mA ― 27 55 mA ― 0.01 1.0 μA VIO-0.5 VIO-0.3 VIO+0.3 IOH=0.3mA *3 IOL=1mA ― ― *5 BR=4Mb/s,CL=15pF,Ta=25℃ ― 1 tw1,Ee1;BR=9.6kb/s,φ≦15° 1 tw2,Ee1;BR=115.2kb/s,φ≦15° 67 tw3,Ee2;BR=4Mb/s(single),φ≦15° 190 tw4,Ee2;BR=4Mb/s(double),φ≦15° 21 Ta=25℃ ― Except for pulse ― during a half of preamble 500 ― No input signal ― VIHSD=VCC, VILSD=GND -0.1 VCC-1.2 Shutdown mode Normal mode ― ℃ BR=4Mb/s, Ta=25 ― VLED=3.3V,RLED=4.3Ω 10 φ≦15°,Ta=25℃*4 VLED=3.3V,RLED=4.3Ω 25 φ=15°,Ta=25℃*4 V V ns ns μs μs ns ns cm ― ― ― ― ― ― ― ― ― ― ― ― ― 0 ― ― 30 0.6 50 50 24 4 195 320 ― 8.16 20.4 ― 500 1 +0.1 VCC 0.5 60 μW/cm 2 μW/cm 2 mW/cm μs ms μA V V ns ― ― mW/sr ― ― mW/sr Ta=25℃ LED(ON),1.5≦VIO≦1.8V LED(ON),1.8＜VIO≦VCC 100 150 ― ― 870 1.4 1.6 150 250 ― ― 890 ― ― 200 330 40 40 900 VCC VCC mA mA ns ns nm V V *4 VLED=3.3V,RLED=4.3Ω,Ta=25℃ *4 BR=4Mb/s,VLED=3.3V,Ta=25℃ 2 TXD-LP / TXD-HP high level input voltage VIHTXD TXD-LP / TXD-HP low level input voltage VILTXD LED(OFF) ― ― 0.6 V TXD-LP TXD-HP high level input current IIHTXD Ta=25℃ ― ― 20 μA TXD-LP TXD-HP low level input current IILTXD Ta=25℃ ― ― 8 μA Maximum optical pulse width tOPWM TXD pin stuck high 30 ― 300 μs *3 Refer to Fig. 2, 3 *4 Refer to Fig. 4,5,6 Sheet No.: E3-A00802EN 5 GP2W3120YP0F ■Recommended Operating Conditions Parameter Supply voltage LED Supply voltage Operating temperature Data rate Logic I/O levels Symbol VCC VLED Topr BR VIO (Ta=25℃) Conditions Rating 2.7 to 3.3 2.7 to 3.6 -25 to +85 9.6k to 4M 1.5 to VCC RLED=4.3Ω *5 Unit V V ℃ b/s V *5 When you make Duty 25 % of signal emit light continuously, please use continuation luminescence time in less than 10 seconds. ■Truth Table MODE Shutdown Transmitter Receiver LP HP SD H L L L L SW Off On On On On TXD-LP TXD-HP LED L L Off H L LP L H HP L L Off L L Off Receiver Don't Care Don't Care Don't Care IrDA Signal No Signal TR1 Off Off Off Off On TR2 RXD Off H(Pull-up) On L(echo) On L(echo) On L Off H H:high, L:Low LP : Low power IE, HP : High power IE (Note) Don’t input Transmitter LP high signal and HP high signal at the same time in transmitter mode. *RXD equivalent circuit TR1 TR2 600k typ. *TXD equivalent circuit SW TXD-LP TXD-HP 400kΩ typ. RXD Sheet No.: E3-A00802EN 6 GP2W3120YP0F Fig.1 Recommended External Circuit 9 SGND 1 LEDA 2 3 4 TXD TXD RXD -LP -HP 5 SD 6 7 V CC V IO GND 8 CX3 R LED CX2 R1 CX1 CX4 V LED V CC Components CX1 CX2 CX3 CX4 R1(1/16W) RLED 1/4W (Note2) 1/10W Recommended values 4.7μF(Ceramic)(Note1) 0.47μF(Ceramic)(Note1) 0.47μF(Ceramic)(Note1) 10μF(Ceramic)(Note1) 4.7Ω 4.3Ω(VLED=3.3V) 2.4Ω(VLED=2.85V) (Note1) Components choose the most suitable CX1, CX2, CX3, CX4 according to the noise level and noise frequency of power supply. (Nore2) In order to guarantee (10 mW/sr), VLED is required 3.3 V (RLED = 4.3 Ω), VLED is required 2.85 V (RLED= 2.4 Ω). Sheet No.: E3-A00802EN 7 GP2W3120YP0F Fig.2 Output Waveform Specification(Receiver side) tf tr VOH 90% 50% 10% VOL tw Fig.3 Standard Optical System(Receiver side) Ee : Light detector face illuminance<10 lx Transmitter* φ φ GP2W3120YP0F Oscilloscope L Data rate 9.6kb/s 115.2kb/s 4Mb/s 4Mb/s T1 103μs 8.68μs 500ns 500ns T2 19.5μs 1.63μs 125ns 250ns T2/T1 Radiant intensity 3/16 3.6mW/sr 3/16 40mW/sr 1/4 9mW/sr 1/2 9mW/sr φ : Indicates horizontal and vertical directions. * Transmitter shall use the standard transmitter (λp = 890 nm TYP.) which is adjusted the radiation intensity at 3.6 mW/sr (at 9.6 to 115.2 kb/s), 9 mW/sr (at 4 Mb/s). T2 Radiant intensity T1 Sheet No.: E3-A00802EN 8 GP2W3120YP0F Fig.4 Output Waveform Specification(Transmitter side) 90% IE 10% tr tf Fig.5 Standard Optical System(Transmitter side) GP2W3120YP0F Detector for radiant intensity measuring φ φ φ : Indicates horizontal and vertical directions. Fig.6 Recommended Circuit of Transmitter side RLED=4.3Ω VLED=3.3V 19.5μs (9.6kb/s) 1.63μs (115.2kb/s) 125ns (4Mb/s, single) 250ns (4Mb/s, double) VCC=3.0V C=10μF TXD-LP TXD-HP GP2W3120YP0F BR=9.6kb/s BR=115.2kb/s BR=4Mb/s Sheet No.: E3-A00802EN 9 GP2W3120YP0F Fig.7 High level output voltage(VOH) vs Logic I/O levels(VIO) (typ.) High level output voltage VOH (V) 4 3 2 1 0 1 2 3 4 Logic I/O levels VIO (V) ■Notes (1) When the system (program) is designed, the Turn Around Time shall be secured by considering 500 μs or more that is specified to IrDA. Then, this Turn Around Time means the time when this device does not temporarily detect the signal light, since the transmitted light form the transceiver reaches the detector side of the transceiver. (2) As it is necessary 1 ms or more (at Ta =25 °C, no input signal) to return from shut-down mode to readyoperation mode, please consider this point at the system (program) designing. Also, please confirm thoroughly the operation in actual application. (3) When there is much external disturbing light source is located near this transceiver and the detector face resceiver much external disturbing light, there is case that the pulse other than signal output is generated as noise on output terminal of this transceiver. Please consider the lay-out and structure to reduce disturbing light on the detector face. (4) In case that this sensor is adopted in IR communication system, please use it according to the signal method which is specified by [Serial Infrared Physical Layer Link Specification Version 1.4] published by Infrared Data Association. False operation may happen if the different signal method is used. (5) In circuit designing, make allowance for the degradation of light emitting diode output that results from long continuous operation. ( 50 % degradation/5 years) Sheet No.: E3-A00802EN 10 GP2W3120YP0F ■Soldering Method 1. In case of solder reflow Please carry out only two times soldering at the temperature and the time within the temperature profile as shown in the figure below. Reflow interval shall be within 3 days under conditions, 10 to 30℃, 70%RH or less. MAX 260℃ 200℃ 1 to 5℃/s MAX 165℃ 1 to 5℃/s 25℃ MAX10s MAX120s MAX70s 2. Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins. Please use after confirming the conditions fully by actual solder reflow machine. 3. Soldering ・Soldering iron shall be less than 25W, and temperature of point of soldering iron shall use at 300℃or less. ・Soldering time shall be within 5s. ・Soldered product shall treat at normal temperature. Sheet No.: E3-A00802EN 11 GP2W3120YP0F ■Package specification ●Tape and Reel package 2000 pcs/reel Carrier tape structure and Dimensions F E D G I J C B A H K (Unit : mm) A B C D E F 16.0±0.3 7.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 H I J K 7.45±0.1 0.32±0.05 2.1±0.1 2.8±0.1 G φ1.5+0.1 -0.0 Sheet No.: E3-A00802EN 12 GP2W3120YP0F Reel structure and Dimensions f e d g c b a Dimension List (Unit : mm) a b c d φ330±2 17.5±1.0 φ100±1 φ13±0.2 e f g φ21±0.8 22.4±1.0 2±0.5 Direction of product insertion Pull out direction Lens side Sheet No.: E3-A00802EN 13 GP2W3120YP0F ●Cleaning Instructions Solvent cleaning : Solvent temperature 45℃ or less, Immersion for 3 min or less Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. The cleaning shall be carried out with solvent below. Recommended Solvent materials : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol ●Presence of ODC etc. This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. • The RoHS directive (2002/95/EC) This product complies with the RoHS directive (2002/95/EC). Object substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) • Content of six substances specified in “ Management Methods for Control of Pollution Caused by Electronic Information Products Regulation ” (Chinese : 电子信息产品污染控制管理办法) Toxic and hazardous substances Category Infrared data communication device Hexavalent Polybrominated Polybrominated Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) ✓ ✓ ✓ ✓ ✓ ✓ ✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. Sheet No.: E3-A00802EN 14 GP2W3120YP0F ■Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: E3-A00802EN 15