GP2AP002S00F GP2AP002S00F Proximity Sensor ■Description ■Agency approvals/Compliance GP2AP002S00F provide a digital detection system integrated into one package the light emitting element and a light receiving element. So small package size, it is easy to mount on the equipment. 1. Compliant with RoHS directive (2002/95/EC) ■Applications 1. Mobile phone 2. Smartphone, Tablet 3. Digital single-lens reflex camera ■Features 1. Disparities in detecting distance results are greatly reduced using a built-in circuit for reduction of light-detecting sensitivity disparities 2.Compact size(4.0 × 2.0 × 1.25t mm) 3.Built-in LED for simple optical design 4.I2C output type Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: OP13009EN 1 GP2AP002S00F ■ Schematic Internal Block Diagram Vcc Output buffer AMP LEDA Synchronized Signal Detection ● ● Vout ● LED driver LEDC ● Vio 2 IC Interface Oscillator SDA SCL Power on Reset GND Sheet No.: OP13009EN 2 GP2AP002S00F ■Outline Dimensions 1) area: Au plating 2) Unspecified tolerance shall be 0.2. 3) Adhesion of resin to the terminal area shall be allowed Max. 0.2mm. Sheet No.: OP13009EN 3 GP2AP002S00F ■Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage LED supply voltage Vcc VLED -0.3 to 3.8 -0.3 to 3.8 V V LED peak forward current ILED mA Logic I/O supply voltage Vio SDA/SCL pull-up voltage - °C °C Operating temperature Topr 300 -0.3 to Vcc+0.3 and 3.8V or less Vio-0.3 to Vio+0.3 and 3.8V or less -25 to +85 Storage temperature Soldering temperature Tstg Tsol -40 to +85 260 V V Ta=25°C (unless otherwise specified) Remarks Cf: Refer to the page 7, Directions for power-line connection Cf: Refer to the page 7, Directions for power-line connection °C peak temperature duration:10sec ■Recommended Operating Conditions Parameter Symbol Operating condition Unit Supply voltage LED supply voltage Vcc VLED 2.4 to 3.6 2.4 to 3.6 V V Operating temperature Topr -25 to 85 °C Logic I/O supply voltage SCL, SDA input low level Vio VIL 1.65 to Vcc -0.3 to 0.2×Vio V V SCL, SDA input high level VIH 0.8×Vio to Vio+0.3 V Ta=25°C (unless otherwise specified) Remarks ■Electrical and Optical Characteristics Parameter operating mode Current consumption shutdown mode LED peak current Peak emission wavelength Ta=25°C ,Vcc=3.3V, VLED=3.3V RLED=6.8Ω (unless otherwise specified) Symbol Min. Typ. Max. Unit Remarks No detection object, Ev=0 lx. ICC 240 600 *1, except for LED and driver uA No input signal. ICC-S 1.0 *1, except for LED and driver ILED 170 mA λp 940 nm Vout terminal High level output voltage Vout terminal Low level output voltage VOH VOL Response time (H→L) tpHL - - 50 ms *2 Response time (L→H) Rise time tpLH tr - 1 50 - ms μs *2, CL=15pF tf - 1 - μs Maximum detection distance Lon 25 65 - mm Minimum no detection distance Wake up time Loff tsdw - 78 - 150 100 mm ms *4 Maximum acceptable illuminance SCL clock frequency Ev SCL 3000 4 - 400 lx *5 kHz Fall time Vio-0.5 Vio-0.3 Vio+0.3 0.5 V V IOH=0.3mA,*2 IOL=1mA, *2 *3, Detection object: KODAK Gray Card (r = 0.18) Operation mode B1 *1. Current consumption through VLED terminal (including LED and its driver output) depends on actual environment and situations. (See attached document【1】1-1) Sheet No.: OP13009EN 4 GP2AP002S00F *2. Parameters defined for Vout output waveform specifications With detection object State of the object to be detected tpHL Without detection object tpLH tr tf VOH 90% Vout output (at normal output mode) 50% 10% VOL *3. Detection distance KODAK Gray Card d GP2AP002S00F GP2AP002S00F output example vs. distance characteristics (operation mode B1) Mimimum No Detection Distance Maximum Detection Distance VO value detection→ ←no detection 1 0 0 20 40 60 80 100 120 140 160 180 200 Distance, d (mm) Sheet No.: OP13009EN 5 GP2AP002S00F *4. Wake up time, tsdw, is defined as a delay of the 1st LED emission after issuing the I2C write command to release GP2AP002S00F from the shutdown mode. Note that there should be no external light noise sources in this particular examination. Also, by definition, it does not matter where reflective object is, but it is recommended that the object should be placed at d << Lon because VO is initialized to 0 and the next expected change is 0 to 1. *5. Test set-up for “Maximum Acceptable Illuminance” measurement GP2AP002S00F Light source A Emitter/Detector surface Illuminance should be measured and evaluated at Emitter/Detector surface of GP2AP002S00F. The maximum acceptable illuminance, Ev, is a maximum level of illuminance at which GP2AP002S00F should keep its sensing result, VO, as "0" (no detection) as long as no reflective objects exist. However, GP2AP002S00F may start to exhibit false detection with external light noise beyond this level. See attached document【1】1-10 for more details. ■Supplement ●This product is built-in photodiode. ●Compliance with each regulation 1) The RoHS directive(2002/95/EC) This product complies with the RoHS directive(2002/95/EC) . Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE) 2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Toxic and hazardous substances Hexavalent Polybrominated Polybrominated Category Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) Proximity sensor ✓ ✓ ✓ ✓ ✓ ✓ ✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard . ●This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform) ●Brominated flame retardants Specific brominated flame retardants such as the PBB and PBDE are not used in this device at all. ●Product mass : Approx . 0.017 g ●Country of origin : China ●Packing : Refer to the attached sheet, Page 11. ●Moisture level: MSL3 Sheet No.: OP13009EN 6 GP2AP002S00F ■Notes ●Before the circuit design In circuit designing, make allowance for the degradation of the light emitting diode output that results from long continuous operation. (50% degradation/5 years) ●Please take proper methods to prevent ESD. The IC built in GP2AP002S00F is ESD-sensitive because it is fabricated by sub-micron CMOS process. For example, in handling GP2AP002S00F, human body and soldering iron etc. should be grounded. ●As it takes at most 100ms to let GP2AP002S00F go to active operation from shut-down mode, please take this delay into system design consideration. Also, if the host system relies on the actual value of this delay, e.g. to do frequent software shutdown, please thoroughly make sure that the operation be successful in any realistic situation. ●Regarding to prevention of malfunction To prevent GP2AP002S00F from faulty operation due to external light noise sources, do not set the detection surface to these sources directly. Under very unlikely situation, GP2AP002S00F output may fall into malfunction (See attached document 【1】1-10 for more detail). It can be reset by letting GP2AP002S00F go shutdown once, and then activating GP2AP002S00F again. In case of this, take it into consideration, in software implementation, to prepare a method to reset GP2AP002S00F. Also, if some other electronic components are placed close to this device, faulty operation may occur. (The light reflection caused by the other components may slip into the photo-detecting portion of the device and may cause faulty operation.) ●Directions for power-line connection Avoid that GP2AP002S00F’s SDA/SCL terminals are pulled-up to the other power line than GP2AP002S00F’s Vio terminal even if they are in the same operating voltage. See also 10) Recommended external circuit. For example, when you shut down GP2AP002S00F by letting Vcc and Vio terminals go to GND level (instead of using software shutdown function), and if GP2AP002S00F’s SDA/SCL terminals are still pulled-up to another active power line, these terminals will draw significant currents from a pull-up resister through internal ESD devices and the SCL and SDA lines are pulled-down, which causes system error (I2C bus error). Also, when you consider reducing total current consumption of the I 2C devices by turning off the power line(s), avoid that one of the Vcc and Vio terminals of GP2AP002S00F is turned off and the other is kept on. It never shuts down GP2AP002S00F’s current consumption, but possibly yields excessive current between these power lines. Please consider making use of “software shutdown” function. However, when you do have to turn off one of these power lines (Vcc, Vio, SDA/SCL pull-up level), all of them in GP2AP002S00F should be turned off for the purpose of choking GP2AP002S00F’s current consumption regardless of the register setting for the software shutdown function. ●Directions for I2C-bus interface GP2AP002S00F is equipped with a 7-bit address as a slave device on the I2C bus interface. Through the SDA and SCL terminals, GP2AP002S00F’s registers can be set up, and also GP2AP002S00F’s sensing result can be read out. However, the read format specified for GP2AP002S00F is a proprietary one that differs from the normal read format (immediately after the first byte) or the combined format shown in the I 2C-bus specification version 2.1, January 2000. For more details to let GP2AP002S00F operate properly, see attached document【1】1-2, I2C-bus interface, and 【2】 recommended operation mode / register setting procedure. ●After being mounted and soldered, if GP2AP002S00F is deformed by external force or impact, e.g. something falls onto the device, it may result in defective implementation such as lift-off of the terminals. Careful handling should be taken. ●For soldering Refer to the page 10 ●For cleaning Cleaning shall carry out as the below items to avoid keeping solvent, solder and flux on the device (1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min or less (2) Ultrasonic cleaning : Please don't carry out ultrasonic cleaning. (3) The cleaning shall be carried out with solvent below. Solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol Sheet No.: OP13009EN 7 GP2AP002S00F ●Recommended external circuit (Top View) Components Recommended values CX1 4.7uF (Ceramic) CX2 0.1uF (Ceramic) CX3 1.0uF (Ceramic) CX4 10uF (Ceramic) R1 RLED Rp 1/20W 1/20W 1/20W 10 Ω 6.8Ω±1％ (VCC=VLED=3.3V) 10k Ω (*) Notes: Place the capacitors CX1～CX4 as close as possible to the corresponding terminals. For CX1~CX3, at most 5mm or less is preferable. Depending on the level and/or frequency component(s) of the power supply noise, CX’s and R1 listed above may not completely eliminate its influence. Therefore, to avoid GP2AP002S00F's false detection which can be greatly influenced by the supply noises, please carefully make sure that there is no problem with the actual electrical implementation. Whenever considering to change VLED voltage, choose proper value for RLED so that the desired ILED is obtained. SDA terminal (as output) and LEDA terminal are NMOS open-drain output. On the other hand, Vout terminal is CMOS output, but it has no high-impedance state. (*) To determine the appropriate value for Rp’s, see section 16 of The I 2C-Bus Specification. Sheet No.: OP13009EN 8 GP2AP002S00F ●Foot pattern of PCB Dimensions are shown for reference. Top View Mount center 1. Dimension in parenthesis are shown for reference. 2. Unit : mm Pin Pin name Symbol ① LED Anode LEDA ② LED Cathode LEDC ③ Vcc Vcc ④ Output Vout ⑤ Ground GND ⑥ Logic I/O Supply Voltage Vio ⑦ I2C DATA BUS SDA ⑧ 2 I C CLOCK SCL ●Recommendable size of solder creamed paste (Reference) : Soldering paste area * Dimension in parenthesis are shown for reference. Unit : mm Sheet No.: OP13009EN 9 GP2AP002S00F ■Precautions for Soldering 1. In case of solder reflow Reflow is allowed only twice at the temperature and the time within the temperature profile as shown in the figure below. Reflow interval shall be within 7days under conditions, 10 to 30°C, 70%RH or less. MAX 260°C 1~5°C/s 220°C 190°C 1~5°C/s 150°C 1~5°C/s 25°C MAX10s MAX120s MAX50s 2. Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. Also avoid immersing the resin part in the soldering. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins. Please use after confirmation the conditions fully actual solder reflow machine. Sheet No.: OP13009EN 10 GP2AP002S00F ■Packing Packing Inner Packing ① Inner Packaging drawing Caver tape 2,000pcs products Carrier tape ②Inner packing material:・Reel(PPE) ・Carrier tape (PC) ・Caver tape(PET) ③Quantity :2,000pcs./Reel Taping reel containing products Outer Packaging EIAJ C-3 Label ① Outer Packaging drawing Silica gel Humidity indicator EIAJ C-3 Label Aluminium laminated sack Aluminium laminated sack containing a taping reel Cushioning material Aluminium laminated bag with tape-reel (5 bags) Packing case Kraft tape EIAJ C-3 Label ② Outer packing material: Packing case(Corrugated cardboard), Cushioning material (Urethane) Aluminium laminated bag (Alumi-Polyethylene) Humidity indicator card (paper), Label(paper), silica gel, craft tape ③ Quantity: 10,000pcs./box ④ The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated. Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin ⑤ Regular packaged mass: Approximately 700g Sheet No.: OP13009EN 11 GP2AP002S00F ■Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: OP13009EN 12