TEMPFET BTS 112A Features ● ● ● ● N channel Enhancement mode Temperature sensor with thyristor characteristic The drain pin is electricalIy shorted to the tab 1 Pin 1 2 3 G D S Type VDS ID RDS(on) Package Ordering Code BTS 112A 60 V 12 A 0.15 Ω TO-220AB C67078-S5014-A3 2 3 Maximum Ratings Parameter Symbol Values Unit Drain-source voltage VDS 60 V Drain-gate voltage, RGS = 20 kΩ VDGR 60 Gate-source voltage VGS ± 20 Continuous drain current, TC = 33 °C ID 12 ISO drain current TC = 85 °C, VGS = 10 V, VDS = 0.5 V ID-ISO 2.5 Pulsed drain current, TC = 25 °C ID puls 48 Short circuit current, Tj = – 55 ... + 150 °C ISC 27 Short circuit dissipation, Tj = – 55 ... + 150 °C PSCmax 400 Power dissipation Ptot 40 Operating and storage temperature range Tj, Tstg – 55 ... + 150 DIN humidity category, DIN 40 040 – E IEC climatic category, DIN IEC 68-1 – 55/150/56 Thermal resistance Chip-case Chip-ambient Semiconductor Group A W °C – K/W Rth JC Rth JA 1 ≤ 3.1 ≤ 75 04.97 BTS 112A Electrical Characteristics at Tj = 25 ˚C, unless otherwise specified. Parameter Symbol Values min. typ. Unit max. Static Characteristics Drain-source breakdown voltage VGS = 0, ID = 0.25 mA V(BR)DSS Gate threshold voltage VGS = VDS, ID = 1.0 mA VGS(th) Zero gate voltage drain current VGS = 60 V, VDS = 0 Tj = 25 °C Tj = 150 °C I DSS Gate-source leakage current VGS = ± 20 V, VDS = 0 Tj = 25 °C Tj = 150 °C I GSS Drain-source on-state resistance VGS = 10 V, ID = 7.5 A RDS(on) V 60 – – 2.5 3.0 3.5 µA – – 0.1 10 1.0 100 – – 10 2 100 4 nA µA Ω – 0.12 0.15 3.0 5.7 – Dynamic Characteristics Forward transconductance VDS ≥ 2 × ID × RDS(on)max, ID = 7.5 A gfs Input capacitance VGS = 0, VDS = 25 V, f = 1 MHz Ciss Output capacitance VGS = 0, VDS = 25 V, f = 1 MHz Coss Reverse transfer capacitance VGS = 0, VDS = 25 V, f = 1 MHz Crss S pF – 360 480 – 160 250 – 50 90 Turn-on time ton, (ton = td(on) + tr) td(on) VCC = 30 V, VGS = 10 V, ID = 3 A, RGS = 50 Ω t – 15 25 – 30 45 Turn-off time toff, (toff = td(off) + tf) td(off) VCC = 30 V, VGS = 10 V, ID = 3 A, RGS = 50 Ω t – 40 55 – 55 75 r f Semiconductor Group 2 ns BTS 112A Electrical Characteristics (cont’d) at Tj = 25 °C, unless otherwise specified. Parameter Symbol Values Unit min. typ. max. Reverse Diode Continuous source current IS – – 12 Pulsed source current I SM – – 48 Diode forward on-voltage I F = 24 A, VGS = 0 VSD – 1.5 1.8 Reverse recovery time I F = I S, diF/dt = 100 A/µs, VR = 30 V t rr – 60 – Reverse recovery charge I F = I S, diF/dt = 100 A/µs, VR = 30 V Q rr A V ns µC – 0.1 – – 1.4 1.5 – – 10 Temperature Sensor Forward voltage ITS(on) = 10 mA, Tj = – 55 ... + 150 °C Sensor override, tp ≤ 100 µs Tj = – 55 ... + 160 °C VTS(on) Forward current Tj = – 55 ... + 150 °C Sensor override, tp ≤ 100 µs Tj = – 55 ... + 160 °C ITS(on) Holding current, VTS(off) = 5.0 V, Tj = 25 °C Tj = 150 °C IH Switching temperature VTS = 5.0 V TTS(on) Turn-off time VTS = 5.0 V, ITS(on) = 2 mA toff Semiconductor Group 3 V mA – – 10 – – 600 0.05 0.05 0.1 0.2 0.5 0.3 150 – – 0.5 – 2.5 °C µs BTS 112A Examples for short-circuit protection at Tj = – 55 ... + 150 °C, unless otherwise specified. Parameter Symbol Examples Unit 1 2 – Drain-source voltage VDS 15 30 – Gate-source voltage VGS 6.8 5.0 – Short-circuit current ISC 27 11 – A Short-circuit dissipation PSC 400 330 – W Response time Tj = 25 °C, before short circuit tSC(off) 20 20 – Short-circuit protection ISC = f (VDS) Parameter: VGS Diagram to determine ISC for Tj = – 55 ... +150°C Semiconductor Group ms Max. gate voltage VGS(SC) = f (VDS) Parameter: Tj = – 55 ... + 150 °C 4 V BTS 112A Max. power dissipation Ptot = f (TC) Typ. drain-source on-state resistance RDS(on) = f (ID) Parameter: VGS Typical output characteristics ID = f (VDS) Parameter: tp = 80 µs Safe operating area ID = f (VDS) Parameter: D = 0.01, TC = 25 °C Semiconductor Group 5 BTS 112A Drain-source on-state resistance RDS(on) = f (Tj) Parameter: ID = 5 A, VGS = 10 V Gate threshold voltage VGS(th) = f (Tj) Parameter: VDS = VGS, ID = 1 mA Typ. transfer characteristic ID = f (VGS) Parameter: tp = 80 µs, VDS = 25 V Typ. transconductance gfs = f (ID) Parameter: tp = 80 µs, VDS = 25 V Semiconductor Group 6 BTS 112A Continuous drain current ID = f (TC) Parameter: VGS ≥ – 10 V Forward characteristics of reverse diode IF = f (VSD) Parameter: Tj, tp = 80 µs Typ. gate-source leakage current IGSS = f (TC) Parameter: VGS = – 20 V, VDS = 0 Typ. capacitances C = f (VDS) Parameter: VGS = 0, f = 1 MHz Semiconductor Group 7 BTS 112A Transient thermal impedance ZthJC = f (tp) Parameter: D = tp/T Semiconductor Group 8 BTS 112A Package Outlines TO 220 AB Standard TO 220 AB SMD Version E 3045 Tape & reel E 3045 A 4.4 3.7 1.3 15.6 9.2 17.5 1) 2) 13.5 3) 4.6 1 12.8 2.8 9.9 9.5 Ordering Code C67078-S5014-A3 0.75 2.54 1.05 2.54 0.5 2.4 GPT05155 1) punch direction, burr max. 0.04 2) dip tinning 3) max. 14.5 by dip tinning press burr max. 0.05 Semiconductor Group 9 Ordering Code C67078-S5014-A4 C67078-S5014-A5