BSS 131 SIPMOS ® Small-Signal Transistor • N channel • Enhancement mode • Logic Level • VGS(th) = 0.8...2.0V Pin 1 Pin 2 G Pin 3 S Type VDS ID RDS(on) Package Marking BSS 131 240 V 0.1 A 16 Ω SOT-23 SRs Type BSS 131 BSS 131 Ordering Code Q62702-S565 Q67000-S229 D Tape and Reel Information E6327 E6433 Maximum Ratings Parameter Symbol Drain source voltage VDS VDGR Drain-gate voltage RGS = 20 kΩ Values 240 V 240 Gate source voltage VGS ± 14 Gate-source peak voltage,aperiodic Vgs ± 20 Continuous drain current ID TA = 26 °C A 0.1 IDpuls DC drain current, pulsed TA = 25 °C 0.4 Ptot Power dissipation TA = 25 °C Semiconductor Group Unit W 0.36 1 Sep-13-1996 BSS 131 Maximum Ratings Parameter Symbol Values Unit Chip or operating temperature Tj -55 ... + 150 °C Storage temperature Tstg -55 ... + 150 Thermal resistance, chip to ambient air RthJA ≤ 350 ≤ 285 Therminal resistance, chip-substrate- reverse side 1)RthJSR DIN humidity category, DIN 40 040 E IEC climatic category, DIN IEC 68-1 1) For package mounted on aluminium K/W 55 / 150 / 56 15 mm x 16.7 mm x 0.7 mm Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol Values min. typ. Unit max. Static Characteristics Drain- source breakdown voltage V(BR)DSS VGS = 0 V, ID = 0.25 mA, Tj = 25 °C V 240 - - 0.8 1.4 2 VDS = 240 V, VGS = 0 V, Tj = 25 °C - 0.1 1 VDS = 240 V, VGS = 0 V, Tj = 125 °C - 2 60 VDS = 130 V, VGS = 0 V, Tj = 25 °C - - 30 Gate threshold voltage VGS(th) VGS=VDS, ID = 1 mA Zero gate voltage drain current Gate-source leakage current IDSS IGSS VGS = 20 V, VDS = 0 V Drain-Source on-state resistance - 1 10 Ω RDS(on) - 12 16 VGS = 4.5 V, ID = 0.1 A - 15 26 2 nA nA VGS = 10 V, ID = 0.1 A Semiconductor Group µA Sep-13-1996 BSS 131 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol Values min. typ. Unit max. Dynamic Characteristics Transconductance gfs VDS≥ 2 * ID * RDS(on)max, ID = 0.1 A Input capacitance 0.06 pF - 60 80 - 8 12 - 3.5 5 Crss VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time - Coss VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance 0.14 Ciss VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance S td(on) ns VDD = 30 V, VGS = 10 V, ID = 0.26 A RGS = 50 Ω Rise time - 5 8 - 8 12 - 12 16 - 15 20 tr VDD = 30 V, VGS = 10 V, ID = 0.26 A RGS = 50 Ω Turn-off delay time td(off) VDD = 30 V, VGS = 10 V, ID = 0.26 A RGS = 50 Ω Fall time tf VDD = 30 V, VGS = 10 V, ID = 0.26 A RGS = 50 Ω Semiconductor Group 3 Sep-13-1996 BSS 131 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol Values min. typ. Unit max. Reverse Diode Inverse diode continuous forward current IS TA = 25 °C Inverse diode direct current,pulsed - 0.1 - - 0.4 VSD VGS = 0 V, IF = 0.2 A, Tj = 25 °C Semiconductor Group - ISM TA = 25 °C Inverse diode forward voltage A V - 4 0.8 1.2 Sep-13-1996 BSS 131 Power dissipation Ptot = ƒ(TA) Ptot Drain current ID = ƒ(TA) parameter: VGS ≥ 10 V 0.40 0.11 W A 0.32 ID 0.09 0.08 0.28 0.07 0.24 0.06 0.20 0.05 0.16 0.04 0.12 0.03 0.08 0.02 0.04 0.01 0.00 0 0.00 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120 TA °C 160 TA Safe operating area ID=f(VDS) Drain-source breakdown voltage V(BR)DSS = ƒ(Tj) parameter : D = 0.01, TC=25°C 285 V 275 V(BR)DSS270 265 260 255 250 245 240 235 230 225 220 215 -60 -20 20 60 100 °C 160 Tj Semiconductor Group 5 Sep-13-1996 BSS 131 Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs , Tj = 25 °C 0.24 Ptot = 0W A Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 °C 50 l k jihgf e d VGS [V] 0.20 ID a Ω 0.18 0.16 c 0.14 0.12 0.10 0.08 0.06 a 2.0 b 2.5 c 3.0 d 3.5 e 4.0 f 4.5 g 5.0 h 6.0 i 7.0 j 8.0 b k 9.0 l 10.0 b RDS (on) 40 35 30 25 20 c 15 k i jg e df h 10 0.04 a 0.02 5 0.00 0 VGS [V] = a 2.5 2.0 b 3.0 c 3.5 d 4.0 e f 4.5 5.0 g 6.0 h i 7.0 8.0 j 9.0 k 10.0 0 1 2 3 4 5 6 7 8 V 10 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 VDS A 0.18 ID Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 µs Typ. forward transconductance gfs = f (ID) parameter: tp = 80 µs, 0.32 0.24 S A 0.20 ID gfs 0.24 0.18 0.16 0.20 0.14 0.16 0.12 0.10 0.12 0.08 0.08 0.06 0.04 0.04 0.02 0.00 0 0.00 1 2 3 4 5 6 7 8 V 10 VGS Semiconductor Group 6 0.00 0.04 0.08 0.12 0.16 0.20 0.24 A ID 0.30 Sep-13-1996 BSS 131 Drain-source on-resistance RDS (on) = ƒ(Tj ) parameter: ID = 0.1 A, VGS = 10 V Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = 1 mA 40 4.6 Ω V 4.0 RDS (on) 32 VGS(th) 28 3.6 3.2 24 2.8 2.4 98% 20 98% 2.0 16 typ typ 1.6 12 1.2 2% 8 0.8 4 0.4 0 0.0 -60 -20 20 60 100 °C 160 -60 -20 20 60 100 °C Tj 160 Tj Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj , tp = 80 µs 10 3 10 0 pF A C IF 10 2 10 -1 Ciss 10 1 10 -2 Coss Tj = 25 °C typ Tj = 150 °C typ Crss Tj = 25 °C (98%) Tj = 150 °C (98%) 10 0 0 5 10 Semiconductor Group 15 20 25 30 V VDS 40 10 -3 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD 7 Sep-13-1996 BSS 131 Package outlines SOT-23 Dimensions in mm Semiconductor Group 8 Sep-13-1996