MRA4003T3 Series Surface Mount Standard Recovery Power Rectifier SMA Power Surface Mount Package Features construction with glass passivation. Ideally suited for surface mounted Automotive application. • Compact Package with J−Bend Leads Ideal for Automated Handling • Stable, High Temperature, Glass Passivated Junction Mechanical Characteristics • Case: Molded Epoxy Epoxy meets UL 94 V−0 @ 0.125 in http://onsemi.com STANDARD RECOVERY RECTIFIERS 1.0 AMPERES 300−1000 VOLTS • Weight: 70 mg (Approximately) • Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 seconds in Solder Bath Polarity: Band in Plastic Body Indicates Cathode Lead Marking: MRA4003T3 = R13 Marking MRA4004T3 = R14 MRA4005T1 = R15 Marking: MRA4005T3 = R15 Marking: MRA4006T3 = R16 Marking: MRA4007T3 = R17 CASE 403D SMA PLASTIC MARKING DIAGRAM R1x ALYW ORDERING INFORMATION Device Package Shipping† SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel MRA4005T1 SMA 1500/Tape & Reel MRA4005T3 SMA 5000/Tape & Reel MRA4006T3 SMA 5000/Tape & Reel MRA4007T3 SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel MRA4003T3 MRA4003T3G MRA4004T3 MRA4004T3G MRA4007T3G R1x A L Y W = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS Please See the Table on the Following Page Semiconductor Components Industries, LLC, 2004 July, 2004 − Rev. 3 1 Publication Order Number: MRA4003T3/D MRA4003T3 Series MAXIMUM RATINGS Value Rating Symbol MRA4003T3 MRA4004T3 MRA4005T1, MRA4005T3 VRRM VRWM VR 300 400 600 Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Avg. Rectified Forward Current (At Rated VR, TL = 150°C) MRA4006T3 MRA4007T3 Unit 800 1000 Volts IO 1 Amp Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TL = 150°C) IFRM 2 Amps Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM 30 Amps Tstg, TC −55 to 150 °C TJ −55 to 175 °C Storage/Operating Case Temperature Operating Junction Temperature Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RθJL RθJA 16.2 88.3 °C/W Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 2) ELECTRICAL CHARACTERISTICS Value Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (IF = 1 A) (IF = 2 A) VF Maximum Instantaneous Reverse Current (at rated DC voltage) IR TJ = 25°C TJ = 100°C 1.1 1.18 1.04 1.12 10 50 Unit Volts A 100E−6 10 TJ = 150°C 1.0 −40°C 0.1 100°C 25°C IR , REVERSE CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS 1. Minimum Pad Size 2. 1 inch Pad Size 3. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2%. TJ = 150°C 10E−6 1.0E−6 100°C 100E−9 0.01 25°C 10E−9 1.0E−9 0.4 0.6 0.8 1.0 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0 Figure 1. Typical Forward Voltage 50 100 150 200 250 300 350 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current http://onsemi.com 2 400 1.6 PFO , AVERAGE POWER DISSIPATION (WATTS) IO, AVERAGE FORWARD CURRENT (AMPS) MRA4003T3 Series dc 1.4 Square Wave 1.2 1.0 Ipk/IO = 0.8 5 10 0.6 20 0.4 Freq = 20 kHz 0.2 0 0 20 80 40 60 100 120 TL, LEAD TEMPERATURE (°C) 140 1.8 dc 1.6 1.4 Square Wave 1.2 Ipk/IO = 1.0 5 0.8 10 0.6 20 0.4 0.2 0 0 160 Figure 3. Current Derating per Leg 0.5 1.0 1.5 IO, AVERAGE FORWARD CURRENT (AMPS) 2.0 Figure 4. Forward Power Dissipation per Leg C, CAPACITANCE (pF) 100 TJ = 25°C 10 1 0 20 40 60 80 100 120 140 160 VR, REVERSE VOLTAGE (VOLTS) 180 200 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 5. Capacitance 1.0 RJL (Min Pad Board) RJA (1 inch Pad Board) 0.1 RJL(t) = RJL * r(t) 0.01 0.001 10E−6 100E−6 1E−3 10E−3 100E−3 1E+0 t, TIME (s) Figure 6. Thermal Response http://onsemi.com 3 10E+0 100E+0 1E+3 10E+3 MRA4003T3 Series PACKAGE DIMENSIONS SMA PLASTIC PACKAGE CASE 403D−02 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. S A D DIM A B C D H J K S B POLARITY INDICATOR OPTIONAL AS NEEDED INCHES MIN MAX 0.160 0.180 0.090 0.115 0.075 0.095 0.050 0.064 0.002 0.006 0.006 0.016 0.030 0.060 0.190 0.220 MILLIMETERS MIN MAX 4.06 4.57 2.29 2.92 1.91 2.41 1.27 1.63 0.05 0.15 0.15 0.41 0.76 1.52 4.83 5.59 C K J H ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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