INTEGRATED CIRCUITS DATA SHEET TDA3629 Light position controller Product specification File under Integrated Circuits, IC18 1996 Sep 04 Philips Semiconductors Product specification Light position controller TDA3629 FEATURES GENERAL DESCRIPTION • Low positional error The Light position controller (Leucht Weiten Steller, LWS) is a monolithic integrated circuit intended to be used in passenger cars. This device adapts the elevation of the light beam of the head light of the car to a state defined by the car driver using a potentiometer on the dashboard. • Low noise sensitivity due to hysteresis • Low supply current • Thermally protected • Broken wire and short-circuit indication on SET input • Brake function by short-circuiting the motor • Hysteresis level set externally. QUICK REFERENCE DATA SYMBOL IP(ss) PARAMETER supply current, steady state CONDITIONS MIN. TYP. MAX. UNIT note 1 − − 6 mA − IP − Im supply current, motor active Im < 900 mA − 80 mA Vm output voltage Im < 700 mA VP − 2 − .9 − V Im output current VP ≥ 12.3 V 670 − − mA ISET motor switch on current level VP = 12 V 6 9 12 µA Note 1. Steady state implies that the motor is not running (Im = 0) and VSET = VFB = 0.5VP. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA3629 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TDA3629T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 1996 Sep 04 2 Philips Semiconductors Product specification Light position controller TDA3629 BLOCK DIAGRAM VP1 VP2 handbook, full pagewidth 2(5) PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE TDA3629 7(12) SUPPLY SHORT-CIRCUIT ISET VP BROKEN WIRE SET 8(16) 3(6) INPUT STAGE FB WINDOWS AND COMPARATORS 1(1) OUTPUT STAGES VP ISET 6(11) Iref 5(9) MGE632 Pin numbers in parenthesis represent the TDA3629T. Fig.1 Block diagram. 1996 Sep 04 3 OUT1 OUT2 Philips Semiconductors Product specification Light position controller TDA3629 PINNING PIN SYMBOL DESCRIPTION TDA3629 TDA3629T FB 1 1 feedback input VP1 2 5 supply voltage 1 OUT1 3 6 output 1 n.c.(1) 4 2 to 4, 7, 8, 10, 13 to 15 not connected GND 5 9 ground OUT2 6 11 output 2 VP2 7 12 supply voltage 2 SET 8 16 set input Note 1. The pins which are not electrically connected should be connected to a copper area of the printed-circuit board which is as large as possible to improve heat transfer. handbook, halfpage FB 1 16 SET n.c. 2 15 n.c. 14 n.c. handbook, halfpage FB 1 VP1 2 OUT1 3 n.c. 4 8 SET n.c. 3 7 VP2 n.c. 4 6 OUT2 VP1 5 12 VP2 5 GND OUT1 6 11 OUT2 n.c. 7 10 n.c. n.c. 8 9 TDA3629 13 n.c. TDA3629T MGE633 GND MGE634 Fig.2 Pin configuration TDA3629. 1996 Sep 04 Fig.3 Pin configuration TDA3629T. 4 Philips Semiconductors Product specification Light position controller TDA3629 FUNCTIONAL DESCRIPTION The device is intended to control the elevation of the light beam of a head light of a passenger car. The driver can control the elevation of the light beam by rotating a potentiometer on the dashboard (the setting potentiometer). The device adapts the elevation of the light beam by activating the control motor. The elevation of the head light is fed back to the device by a second potentiometer (the feedback potentiometer). This feedback potentiometer is mechanically coupled to the motor. handbook, halfpage 100 position (%) The device operates only when the supply voltage is within certain limits. The device is switched off outside these boundaries. The under voltage detection detects whether the supply voltage is below the under voltage threshold. The motor will not be activated when this occurs, but it remains short-circuited by the output stages. The over voltage will switch off the total device when the supply voltage is higher than the over voltage threshold. 0 0 VSET(min) A thermal protection circuit becomes active if the junction temperature exceeds a value of approximately 160 °C. This circuit will reduce the motor current, which will result in a lower dissipation and hence a lower chip temperature. This condition will only occur when the motor is blocked at high ambient temperature. VSET(max) Vb VSET (V) Fig.4 Conversion gain. A detection of a broken wire of the slider of the setting potentiometer is included because it will be connected to the device by a wire several meters long. This detection circuit prevents the motor from rotating when the wire is broken. In this event the brake will remain active. The device is protected against electrical transients which may occur in an automotive environment. The device will shut off when positive transients on the battery line occur (see Figs 7 and 8). The motor will not be short-circuited in this event. The flyback diodes, illustrated in Fig.1, will remain present. The state of the output stages at the moment when the transient starts is preserved by internal flip-flops. Negative transients on the battery line (see Figs 7 and 8) will result in a set short-circuited to ground fault detection, because it will result in a voltage at the setting input which is below the short-circuited to ground threshold. The device however discharges the electrolytic capacitor during these transients. It will stop functioning when the resulting supply voltage becomes too low. The protection of VSET to VP circuit prevents the motor from rotating when the voltage at the VSET input is above the threshold value. This can be used to detect whether the wire from the slider of the setting potentiometer is short-circuited to the battery line. A protection of VSET short-circuited to ground is also present. The motor will be stopped if VSET becomes lower than the threshold level. The shaded areas in Fig.4 represent the parts where the short-circuit protection stages are active. Figure 4 shows that a position of 0 mm can not be reached, neither can a position of 100%. The minimum position that can be reached depends on the battery voltage Vb, although the maximum position does not. 1996 Sep 04 MGE635 5 Philips Semiconductors Product specification Light position controller TDA3629 The timing can be divided into several parts starting from a steady state (see Fig.5, the starting point, and Fig.10 for the application diagram): in this state (until T1) a large reference current is active, indicated by the dotted lines. When the setting potentiometer is rotated (started at T1 and indicated by VSET) and the input current ISET becomes higher than the reference current Iref (at time T2), the motor will start and the input current will decrease. At the same time the reference current is switched to a low level. During rotation of the motor the input current will decrease until it becomes lower than this low reference current; this occurs at time T4. At this time the brake becomes active, the motor will stop and the reference current is set to the higher value. The brake is realized by short-circuiting the motor. In general: this system does not use a linear adaptation strategy but an on-off strategy. This results in high accuracy and low noise sensitivity. The brake is active at any time during normal operation when the motor is not active. The polarity of the feedback potentiometer should be such that the voltage at the slider of the feedback potentiometer increases when OUT1 is high and OUT2 is low. handbook, full pagewidth V2 VSET V1 V2 VFB V1 ISET 0 Iref absolute motor current 0 T1 T2 T3 T4 time MGE636 Fig.5 Timing diagram. 1996 Sep 04 6 Philips Semiconductors Product specification Light position controller TDA3629 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). All voltages are defined with respect to ground. Positive currents flow into the device. Values measured in Fig.10. SYMBOL VP PARAMETER CONDITIONS supply voltage MIN. MAX. UNIT operating 8 18 V non-operating −0.3 +50 V −0.3 VP + 0.3 V −3 +3 kV −55 +150 °C Vn voltage on any other pin Ves electrostatic handling Tstg storage temperature Tamb ambient temperature −40 +105 °C Tvj virtual junction temperature note 2 −50 +150 °C Vb, tr voltage transients on Vb note 3 −150 +100 V RL load resistance note 4 10 − Ω tblock cumulative blocking time Im = 700 mA − 100 h note 1 Notes 1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor. 2. In accordance with IEC 747-1. An alternative definition of virtual junction temperature Tvj is: Tvj = Tamb + Pd × Rth vj-amb, where Rth vj-amb is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation Pd and ambient temperature Tamb. Additional information is given in section “Thermal aspects” in chapter “Test and application information”. 3. Wave forms illustrated in Figs 7 and 8 applied to the application diagram, Fig.10. 4. Vb = 13 V; Tamb = 25 °C; duration 50 ms maximum; non repetitive. THERMAL CHARACTERISTICS In accordance with IEC 747-1. SYMBOL Rth vj-amb 1996 Sep 04 PARAMETER VALUE UNIT TDA3629 100 K/W TDA3629T 105 K/W thermal resistance from junction to ambient in free air 7 Philips Semiconductors Product specification Light position controller TDA3629 CHARACTERISTICS VP = 12 V; RL = 14 Ω. All voltages are defined with respect to ground. Positive currents flow into the device. Values measured in Fig.10 with RSET = RFB = 20 kΩ; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP(min) under voltage threshold VP(max) over voltage threshold 6 − 8 V Tamb = 25 °C 18 − 22 V Tamb = −40 to +105 °C 17.5 − 22.8 V IP(ss) supply current, steady state note 1 − − 6 mA IP − Im supply current, motor active Im < 400 mA; note 2 − − 40 mA Im < 900 mA; note 2 − − 80 mA Setting input (SET) VSET operating voltage 1.5 − 0.95VP V ISET input current RSET > 20 kΩ −250 − +250 µA VSET(sc) wire short-circuited to ground threshold output stages switched off − − 1 V wire short-circuited to battery threshold output stages switched off VP − − V broken ground set pull-up note 3 − − 160 mV ∆VSET Feedback input (FB) VFB voltage IFB(max) maximum input current 1.5 − 0.95VP V RFB > 20 kΩ −250 − +250 µA Im < 700 mA; Tamb = 25 °C; note 2 VP − 2.9 − − V Im < 700 mA; Tamb = −40 to +105 °C; note 2 VP − 3.4 − − V VP ≥ 12.3 V; Tamb = 25 °C; note 2 670 − − mA VP ≥ 12.3 V; Tamb = −40 to +105 °C; note 2 635 − − mA VP = 12 V 6 9 12 µA VP = 18 V 9 13 17 µA − 2.5 − µA Motor outputs Vm Im output voltage output current Reference current ISET motor switch-on level motor switch-off level 1996 Sep 04 8 Philips Semiconductors Product specification Light position controller TDA3629 Notes to the characteristics 1. Steady state implies that the motor is not running (Im = 0) and VSET = VFB = 0.5VP. 2. This is only valid when the temperature protection is not active. 3. ∆VSET is the difference in voltage on the set potentiometer between the situation when the ground wire is interrupted (VSET, br) and voltage on the set potentiometer during normal operation (when VSET = 0.17Vb = 2.72 V). The conditions for this test are: RSET = 20 kΩ; Vb = 16 V; ∆VSET = VSET, br − 2.72 V; see Fig.6. handbook, halfpage +Vb battery 830 Ω REMAINDER OF MODULE 390 Ω + 170 Ω RSET ground VSET, br − ground wire not connected MGE637 The 170 Ω, 830 Ω and 390 Ω resistors form the setting potentiometer in its worst case position. The given situation (combination of Vb, RSET and the position of the set potentiometer) forms the worst case situation. The given maximum of ∆VSET guarantees that any other module, connected to the same set potentiometer, will not start to activate its motor, when its motor switch-on level is higher than 0.01Vb (RSET ≥ 20 kΩ). Fig.6 Conditions for the test of note 3. QUALITY SPECIFICATION The quality of this device is in accordance with “SNW-FQ-611 part E”. The numbers of the quality specification can be found in the “Quality reference Handbook”. The handbook can be ordered using the code 9397 750 00192. 1996 Sep 04 9 Philips Semiconductors Product specification Light position controller TDA3629 TEST AND APPLICATION INFORMATION Automotive transients handbook, halfpage 112 Vb (V) PULSE 2 2 ms 12 0 time 0.5 ms PULSE 1 −88 MGE638 Fig.7 Worst case transients on Vb (continued in Fig.8). Worst case transients that may occur on the battery line Vb of the application (see Fig.10), are the pulses whose wave forms and the corresponding values are as illustrated in Figs 7 and 8. The signal source which generates these pulses (numbered pulses 1 and 2) has a series resistance (Ri) of 10 Ω. These pulses represent for instance the influence of switching of inductors on the battery line. The signal source which generates pulses 3 and 4 has a series resistance of 50 Ω. These pulses represent for instance the influence of ignition on the battery line. Their repetition rate is 100 ms. 90 ms pause handbook, full pagewidth 112 Vb (V) PULSE 3 10 ms 100 µs 12 0 time 100 µs 10 ms PULSE 4 90 ms pause MGE639 −138 Fig.8 Worst case transients on Vb (continued from Fig.7). 1996 Sep 04 10 Philips Semiconductors Product specification Light position controller TDA3629 The resistor in the feedback input line (RFB) is present to limit the current during the transients as illustrated in Figs 7 and 8. This resistor should have a value larger than 2 kΩ. RSET can be chosen freely but must also be larger than 2 kΩ. A diode is placed in series with the supply line in both applications to protect the device from reverse polarity switching and from damage caused by pulses 1 and 3 in Figs 7 and 8. In the present application a varistor is included in the motor. The electrolytic capacitor of 47 µF should have a very low ESR, for instance as low as 5 Ω at a temperature of −40 °C. An extra ceramic capacitor (approximately 100 nF) parallel to it is obligatory when this can not be guaranteed. Application diagrams and additional information Two possible application diagrams are shown. The first (see Fig.9) shows the best case: the lowest component count. The second (see Fig.10) shows additional components which may be necessary. Two capacitors are added to meet EMC requirements (one on the VP pins, the second one between the set and feedback input pins). A third capacitor has been added across the motor to suppress current spikes. The given values of these capacitors have to be optimized by experiments carried out on the total application. The resistors do not have to have the same value. The voltage hysteresis is set by means of RSET. +Vb handbook, full pagewidth 47 µF 43 V VP1 PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE TDA3629 VP2 SUPPLY SHORT-CIRCUIT ISET BROKEN WIRE +Vb RSET 1 kΩ +Vb 2.2 kΩ SET + VSET − RFB + VFB − VP OUT1 INPUT STAGE WINDOWS AND COMPARATORS FB ISET OUTPUT STAGES VP Im + Vm M − OUT2 Iref MECHANICAL TRANSMISSION Fig.9 Best case application diagram. 1996 Sep 04 11 MGE640 Philips Semiconductors Product specification Light position controller TDA3629 +Vb handbook, full pagewidth 47 µF 43 V VP1 PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE TDA3629 100 nF VP2 SUPPLY SHORT-CIRCUIT ISET RSET 1 kΩ +Vb VP BROKEN WIRE +Vb + VSET − RFB 2.2 kΩ SET 100 nF OUT1 INPUT STAGE WINDOWS AND COMPARATORS FB + VFB − OUTPUT STAGES VP ISET Im + Vm M − 100 nF OUT2 Iref MECHANICAL TRANSMISSION MGE641 Fig.10 Worst case application diagram. It is assumed that the device must be capable of moving the motor from one end to the other in four equal steps and that the total time needed for this excursion is 16 seconds. After this excursion a pause is allowed before the same pulses are used to return to the original position. This operation is illustrated in Fig.11. Thermal aspects The dissipation of the device is the sum of two sources: the supply current (IP − Im) times the supply voltage (VP) plus the motor current (Im) times the output saturation voltage (VP − Vm). In formula: P = VP × ( IP – Im ) + Im × ( VP – Vm ) (IP − Im) is approximately equal to IP(ss) when the motor is not running. It is obvious from the ratings that the combination of VP = 18 V, (IP − Im) = 80 mA, Im = 900 mA and (VP − Vm) = 2.5 V can not be allowed at Tamb = 105 °C; see chapter “Limiting values” note 2. But it is also improbable that the motor is continuously driven, therefore the following assumptions have been made. 1996 Sep 04 12 Philips Semiconductors Product specification Light position controller TDA3629 Stereo operation The default application will be when two modules are driven by one set potentiometer. One module controls the left head light, where the other one controls the right head light. Each module is connected by three wires: the battery line, the ground line and the set input wire. This can result in two additional fault conditions: from one module the battery line or the ground line can be broken, when the other module is still connected. Assume that the left one operates normally, where the right one has a fault. The setting potentiometer will have extra loading when the battery line is broken. This will result in a lower voltage at the wiper of the setting potentiometer. Thus the left module will start to regulate until a new equilibrium is reached. The amount of extra loading can be influenced by the external series resistor in the set input. These fault conditions and their implications should be considered when the total application is designed. 8s handbook, halfpage pause 4s active motor inactive time (s) MGE642 The duration of the pause depends on the ambient temperature, see Table 1. Fig.11 Thermal transient test. Table 1 Duration of the pauses Tamb (°C) PAUSE (s) <95 60 95 180 95 to 105 300 Test diagram All parameters in chapter “Characteristics” until this section are measured at Tamb = 25 °C and are tested at each device using the test set-up of Fig.12. The only exceptions are parameters supply current (motor active) and output voltage (motor output) where the 1 kΩ output resistor is replaced by an appropriate current source. The maximum allowable dissipated power P is then 0.77 W during the motor active periods in the event of a DIP8 package being used. Dissipation pulses due to starting and stopping the motor can be ignored because of their short duration. This maximum allowable dissipated power implies that the maximum continuous motor current (Im) is approximately 250 mA during the motor active periods when the supply voltage VP is 13 V. The maximum allowable dissipated power P is 0.67 W during the motor active periods in the event of a SO16 package being used. This implies that the maximum continuous motor current (Im) is approximately 220 mA during the motor active periods when the supply voltage (VP) is 13 V. 1996 Sep 04 13 Philips Semiconductors Product specification Light position controller TDA3629 handbook, full pagewidth VP1 PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE TDA3629 VP2 12 V + − SUPPLY SHORT-CIRCUIT ISET RSET = 20 kΩ + − − VP SET VSET RFB = 20 kΩ + BROKEN WIRE OUT1 INPUT STAGE WINDOWS AND COMPARATORS FB OUTPUT STAGES VP ISET OUT2 VFB Iref MGE643 Fig.12 Test set-up (general). 1996 Sep 04 1 kΩ 14 Philips Semiconductors Product specification Light position controller TDA3629 has to be verified, because the level setting may have an overshoot and the device under test may have a latching behaviour. The verification is achieved by switching off the power supply for 1 s after degradation is first detected. Then the supply is switched on and the degradation is rechecked. If the second check also indicates a degradation, then the values of RF level and frequency are inserted into a data file for reporting. If the second check is negative the level is further increased. If no degradation occurs until the specified maximum test level is reached, the maximum level is recorded together with the frequency of that step. IMMUNITY TO NARROW BAND ELECTROMAGNETIC DISTURBANCES Test procedure GENERAL INFORMATION The immunity is measured using a test procedure, which is derived from the draft international standard “ISO/DIS 11452”, parts 1 and 7, submitted for circulation 1992 June 14. The test is carried out using a printed-circuit test board in a test set-up, which is illustrated in Fig.13. The circuit diagram of the test board is shown in Fig.14. The physical layout of the test board is shown in Figs 15 to 17. RECOMMENDED RF-VOLTAGE SETTING PROCEDURE For a fast setting of the RF voltage to the required test level step it is recommended that the substitution method is used. This method sets the actual test level with respect to level values that have been filed in a pre-measurement. The RF source in the test set-up is built from a low-power RF generator and suitable amplifiers. In the recommended pre-measurement the RF voltage at the injection point is measured, while the signal generator outputs a constant voltage level (e.g. 100 mV). Thus, the gain factor from the output of the RF generator to the injection point can be easily calculated. In the pre-measurement the RF voltage at the injection point is measured for each frequency step. Dividing this measured voltage by 100 mV results in the gain factor for this frequency. All gain factors together with their frequency value are filed for use in the level setting of the immunity tests. In the immunity test routine, a required RF voltage test level at a frequency step is obtained by setting the RF signal generator to a level that is calculated by dividing the required RF voltage test level by the gain factor of that frequency. PREPARATION OF TEST The IC under test is mounted onto the printed-circuit test board. The printed-circuit test board is mounted into the faraday cage (RF-shielded 19 inch-rack) and connected to the test equipment as shown in Fig.13. One of three RF voltage injection points has to be chosen for injection, while the others have to be connected to passive terminations. The injection into the control loop via input RFC is shown in Fig.13. After the set-up is completed, the feedback voltage is selected by the appropriate setting of a jumper in the jumper field J1 (see Fig.14) and the battery voltage is switched on. With no RF voltage injected the correct operation of the system is verified by turning the SET potentiometer (see Fig.13) left and right (or vice-versa). The outputs OUT1 and OUT2 will switch to on-state (absolute differential voltage Vdiff = 3 to 5 V DC) in both turn directions. If the device under test functions correctly, the potentiometer is set to a position where the absolute voltage difference between the slider connection of the potentiometer and the jumper J1 is less than 5 mV. After adjustment, the absolute differential output voltage Vdiff has to be below 100 mV. Having reached this condition the immunity test may be started. Test conditions The test is carried out using the test procedure as mentioned before and under the conditions mentioned in Table 2. TEST OF IMMUNITY For the test of immunity the RF voltage is injected into the test board and Vdiff is monitored for degradation. Vdiff is degraded if its actual value exceeds the maximum value described in Table 2. In the test routine the frequency is varied in steps from the start frequency to the stop frequency (see Table 2). Within each frequency step the level of injected RF voltage is incremented by steps to the maximum test level, which is specified in Table 2. Each step level is held constant for the dwell time. After the dwell time has elapsed, the degradation of the absolute output voltage is checked. If a degradation is detected it 1996 Sep 04 15 Philips Semiconductors Product specification Light position controller Table 2 TDA3629 General test conditions for immunity measurements SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT General Tamb ambient temperature 18 − 28 12.5 − 13.5 V 0 1.0 V − 250 − kHz Vbat battery voltage Vdiff absolute differential output voltage (DC value) fstart start frequency fstop stop frequency fn frequency steps VIL(rms) immunity voltage level (RMS value) oC − 1 000 − MHz from 250 kHz to 1 MHz − − 100 kHz from 1 to 10 MHz; 9 steps (logarithmic): n = 0 to 8 − note 1 − from 10 to 200 MHz − − 2 MHz from 200 to 1000 MHz − − 20 MHz from 250 kHz to 1 MHz 5 − − V from 1 MHz to 5 MHz 10 − − V from 5 MHz to 1 GHz 15 − − V V MHz VTL(max) maximum test voltage level − 24 − VSTART(rms) voltage start level (RMS value) 2 4 6 V VSTEP(rms) voltage level step (RMS value) − 2 − V QTL relative accuracy of test level −10 − +10 % tdwell dwell time 2 − − s RF-voltage characteristic; note 2 fM(AM) AM modulation frequency constant peak level − 1 − kHz mD modulation depth constant peak level − 0 − % Notes 1. The typical value is 1 × 10 n --9 2. For definition see “ISO/DIS 11452-1”, annex B. 1996 Sep 04 16 Philips Semiconductors Product specification Light position controller TDA3629 handbook, full pagewidth FARADAY CAGE LIGHT POSITION CONTROL IMMUNITY TEST BOARD CONTROL RFC OUT1 100 Ω 50 nF 50 Ω 50 Vdiff nF − + V digital RFS 100 Ω 50 nF 50 nF Vbat 50 Ω RF +13 V GND 100 Ω 620 Ω 50 nF SET 1 kΩ RFG OUT2 50 Ω MGE853 RF RF digital V TEST CONTROL AND DATA AQUISITION RFC is the RF voltage injection point to control path. RFG is the RF voltage injection point to ground. RFS is the RF voltage injection point to battery voltage (+13 V). For all decoupling filters Z >> 150 Ω. Fig.13 Test set-up for immunity test. 1996 Sep 04 17 Philips Semiconductors Product specification Light position controller TDA3629 D1 Vbat handbook, full pagewidth +13 V C2 47 nF 1N4005 RFS n.c. VP1 VP2 n.c. R7 1.2 kΩ n.c. R1 SET CONTROL R6 820 Ω SET 15 kΩ C1 R2 FB 100 nF C3 47 nF RFC J1 10 5 12 15 2 14 n.c. 16 IC1 FB 1 6 OUT1 TDA3629T 20 kΩ n.c. R5 820 Ω C6 47 µF (50 V) D2 BZT03/C43 C5 1.0 nF 3 11 OUT2 OUT2 OUT1 1 n.c. 4 7 R4 1.2 kΩ 8 13 9 R8 510 Ω R9 510 Ω n.c. n.c. n.c. GND GND C4 47 nF OUT2 RFG OUT1 MGE852 Feedback voltage setting J1: amount of voltage difference between J1 and SET input adjusted by potentiometer setting to <50 mV (see also Fig.13). Fig.14 Circuit diagram of the test board. Figs 15 to 17 show the layout of the immunity test board used for the evaluation. 1996 Sep 04 18 Philips Semiconductors Product specification Light position controller TDA3629 handbook, full pagewidth D1 C6 R7 D2 C1 R6 R8 OUT2 R9 OUT1 CONTROL C2 RFS GND R4 C3 RFC 30 50 70% C4 R1 R2 +13 V R5 RFG C5 IC1 J1 MGE854 Fig.15 Component placement of the printed-circuit board. handbook, full pagewidth MGE855 Fig.16 Top view of printed-circuit board. 1996 Sep 04 19 Philips Semiconductors Product specification Light position controller TDA3629 handbook, full pagewidth MGE856 Fig.17 Bottom view of printed-circuit board. Test results MGE858 30 handbook, full pagewidth VRF(rms) (V) 20 (1) device accepted device not accepted (2) 10 (3) (4) 0 10−1 1 10 102 frequency (MHz) 103 (1) Feedback voltage is 30%. (2) Feedback voltage is 50%. (3) Feedback voltage is 70%. (4) Immunity level. Fig.18 Typical immunity results with respect to setting of jumper 1 (30, 50 and 70%) RF input to RFC. 1996 Sep 04 20 Philips Semiconductors Product specification Light position controller TDA3629 MGE857 30 handbook, full pagewidth VRF(rms) (V) (1) 20 device accepted device not accepted (2) 10 (3) 0 10−1 1 10 102 frequency (MHz) 103 (1) RF voltage injection point to ground and to battery voltage. (2) RF voltage injection point to control path. (3) Immunity level. Fig.19 Typical immunity results with respect to RF injection points, with jumper 1 set to 50%. The typical immunity results of the TDA3629T are shown in Fig.18. The RF voltage was injected into the control line (see also Figs 13 and 14). This injection point is the most sensitive one that could be found. This is underlined by the comparison results shown in Fig.19. 1996 Sep 04 21 Philips Semiconductors Product specification Light position controller TDA3629 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1996 Sep 04 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 22 Philips Semiconductors Product specification Light position controller TDA3629 SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0098 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.24 0.23 0.041 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.0098 0.057 0.0039 0.049 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1996 Sep 04 EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-23 23 o 8 0o Philips Semiconductors Product specification Light position controller TDA3629 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Sep 04 24 Philips Semiconductors Product specification Light position controller TDA3629 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Sep 04 25 Philips Semiconductors Product specification Light position controller TDA3629 NOTES 1996 Sep 04 26 Philips Semiconductors Product specification Light position controller TDA3629 NOTES 1996 Sep 04 27 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 617021/1200/01/pp28 Date of release: 1996 Sep 04 Document order number: 9397 750 01139