BTS 4140 N Smart High-Side Power Switch One Channel: 1 x 1Ω Features Product Summary • Current controlled input Overvoltage protection Vbbin(AZ) • Short circuit protection Operating voltage Vbb(on) • Current limitation On-state resistance RON 62 V 4.9...60 V Ω 1 • Overload protection • Overvoltage protection (including load dump) • Switching inductive loads • Clamp of negative voltage at output SOT-223 4 with inductive loads • Thermal shutdown with restart • ESD - Protection 3 • Loss of GND and loss of Vbb protection • Very low standby current 2 1 VPS05163 • Reverse battery protection • Improved electromagnetic compatibility (EMC) Application • All types of resistive, inductive and capacitive loads • Current controlled power switch for 12V, 24V and 42V DC applications • Driver for electromechanical relays • Signal amplifier General Description N channel vertical power MOSFET with charge pump and current controlled input, monolithically integrated in Smart SIPMOS technology. Providing embedded protective functions. Page 1 2004-01-27 BTS 4140 N Block Diagram + V bb 2 /4 C o n tro l C irc u it OUT 3 T e m p e ra tu re Sensor R IN 1 IN R L GND Pin Symbol Function 1 IN Input, activates the power switch in case of connection to GND 2 Vbb Positive power supply voltage 3 OUT Output to the load 4 Vbb Positive power supply voltage Page 2 2004-01-27 BTS 4140 N Maximum Ratings Symbol Parameter Value Unit at Tj = 25°C, unless otherwise specified 60 V IL self limited A Maximum current through the input pin ( DC ) I IN ±15 mA Operating temperature Tj -40 ...+150 °C Storage temperature T stg -55 ... +150 Power dissipation1) Ptot 1.7 W EAS 1 J Supply voltage Vbb Load current (Short - circuit current, see page 5) TA = 25 °C Inductive load switch-off energy dissipation 2) single pulse Tj = 150 °C, IL = 0.15 A Load dump protection 3) VLoadDump4)= VA + VS V VLoaddump RI=2Ω, td=400ms, VIN= low or high IL = 150 mA, Vbb = 13,5 V 93.5 Vbb = 27 V 127 kV Electrostatic discharge voltage (Human Body Model) VESD according to ANSI EOS/ESD - S5.1 - 1993 ESD STM5.1 - 1998 Input pin ±1 all other pins ±5 1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for V bb connection. PCB is vertical without blown air. 2not subject to production test, specified by design 3more details see EMC-Characteristics on page 7 4V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 . Page 3 2004-01-27 BTS 4140 N Electrical Characteristics Symbol Parameter at Tj = -40...150 °C, Vbb = 9...42 V unless otherwise specified Values Unit min. typ. max. Thermal Characteristics Thermal resistance @ min. footprint Rth(JA) - 86 125 Thermal resistance @ 6 cm 2 cooling area 1) Rth(JA) - 60 72 Thermal resistance, junction - soldering point RthJS - - 17 K/W K/W Load Switching Capabilities and Characteristics On-state resistance Ω RON Pin1 connencted to GND Tj = 25 °C, IL = 150 mA, Vbb = 9...52 V Tj = 150 °C - 1 1.5 - 1.5 3 Tj = 25 °C, IL = 50 mA, Vbb = 6 V - 2 5 0.2 - - Nominal load current2) IL(nom) A Device on PCB 1) Ta = 85 °C , Tj ≤ 150 °C Turn-on time3) VIN = Vbb to 0V to 90% VOUT ton µs RL = 270 Ω - - 125 4) RL = 270 Ω, Vbb = 13.5 V, Tj = 25 °C - 45 100 RL = 270 Ω - - 175 4) RL = 270 Ω, Vbb = 13.5 V, Tj = 25 °C - 40 140 Turn-off time3) Slew rate on3) VIN = 0V to Vbb VIN = Vbb to 0V to 10% VOUT 10 to 30% VOUT toff dV/dton V/µs RL = 270 Ω - - 64) RL = 270 Ω, Tj = 25 °C, Vbb = 13.5 V - 1.3 4 RL = 270 Ω - - 84) RL = 270 Ω, Tj = 25 °C, Vbb = 13.5 V - 1.7 4 Slew rate off 3) VIN = 0V to Vbb 70 to 40% VOUT -dV/dtoff 1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for V bb connection. PCB is vertical without blown air. 2Nominal load current is limited by the current limitation ( see page 5 ) 3Timing values only with high input slewrates, otherwise slower. 4not subject to production test, specified by design Page 4 2004-01-27 BTS 4140 N Electrical Characteristics Symbol Parameter at Tj = -40...150 °C, Vbb = 9...42 V unless otherwise specified Values Unit min. typ. max. Operating Parameters Operating voltage Vbb(on) 4.9 - 60 V Standby current Ibb(off) - 2 10 µA Pin1 = open Protection Functions1) Initial peak short circuit current limit A IL(SCp) (see page 11) Tj = -40 °C, Vbb = 13.5 V, tm = 100 µs Tj = 25 °C Tj = 150 °C - - 1.2 - 0.9 - 0.2 - - - 0.7 - Repetitive short circuit current limit IL(SCr) Tj = Tjt Output clamp (inductive load switch off) VON(CL) 60 - - Vbbin(AZ) 62 68 - Thermal overload trip temperature Tjt 150 - - °C Thermal hysteresis ∆Tjt - 10 - K V at VOUT = Vbb - VON(CL), Ibb = 4 mA Overvoltage protection Ibb = 1 mA 1Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. Page 5 2004-01-27 BTS 4140 N Electrical Characteristics Parameter Symbol at Tj = -40...150 °C, Vbb = 9...42 V unless otherwise specified Values min. typ. Unit max. Input Off state input current mA IIN(off) VOUT ≤ 0.1 V Tj = 25 °C, RL = 270 Ω - - 0.05 Tj = 150 °C - - 0.04 - 0.3 1 On state input current ( Pin1 grounded ) 1) IIN(on) Input resistance RI 0.5 1 2.5 kΩ IS - - 0.2 A -VON - 600 - Reverse Battery Continuous reverse drain current TC = 25 °C Drain-source diode voltage (VOUT > Vbb) mV IF = 0.2 A, IIN ≤ 0,05 mA 1Driver circuit must be able to drive currents > 1mA. Page 6 2004-01-27 BTS 4140 N EMC-Characteristics All EMC-Characteristics are based on limited number of sampels and no part of production test. Test Conditions: If not other specified the test circuitry is the minimal functional configuration without any external components for protection or filtering. Supply voltage: Vbb = 13.5V Load: RL = 220Ω Operation mode: PWM DC On/Off - DUT-Specific.: Temperature: Ta = 23 ±5°C ; Frequency: 100Hz / Duty Cycle: 50% Fast electrical transients Acc. ISO 7637 Test Pulse Test Level 1 2 3a 3b 41) 5 -200 V +200 V -200 V + 200 V -7 V 175 V Test Results On Off C C C C C C C C C C E (150V ) E (150V ) Pulse Cycle Time and Generator Impedance 500ms ; 10Ω 500ms ; 10Ω 100ms ; 50Ω 100ms ; 50Ω 0,01Ω 400ms ; 2Ω The test pulses are applied at Vbb Definition of functional status Class C E Content All functions of the device are performed as designed after exposure to disturbance. One or more function of a device does not perform as designed after exposure and can not be returned to proper operation without repairing or replacing the device. The value after the character shows the limit. Test circuit: Pulse Bat. Vbb PROFET OUT IN RL 1Supply voltage V = 12 V instead of 13,5 V. bb Page 7 2004-01-27 BTS 4140 N Conducted Emission Acc. IEC 61967-4 (1Ω / 150Ω method) Typ. Vbb-Pin Emission at DC-On with 150 Ω-matching network 100 90 N o is e Vbb D C 80 70 60 dBµV 50 1 5 0 Ω / 8 -H 40 30 20 1 5 0 Ω / 1 3 -N 10 0 -1 0 -2 0 0 ,1 1 10 100 1000 f / MHz Typ. Vbb -Pin Emission at PWM-Mode with 150 Ω-matching network 100 90 N o is e Vbb PW M 80 70 60 dBµV 50 1 5 0 Ω / 8 -H 40 30 20 1 5 0 Ω / 1 3 -N 10 0 -1 0 -2 0 0 ,1 1 10 100 1000 f / MHz Test circuit: 5µH 150Ω-Network Vbb PROFET IN BSS100 OUT 5µH R For defined decoupling and high reproducibility a defined choke (5µH at 1 MHz) is inserted between supply and Vbb-pin. Page 8 2004-01-27 BTS 4140 N Conducted Susceptibility Acc. 47A/658/CD IEC 62132-4 (Direct Power Injection) Direct Power Injection: Failure criteria: Forward Power CW Amplitude and frequency deviation max. 10% at Out Typ. Vbb-Pin Susceptibility at DC-On/Off 40 35 30 dBm 25 20 15 D e v ic e : D a te C o d e : Load: O -M o d e : C o u p lin g P o in t : M o n it o r in g : M o d u la t io n : M e a s u re m e n t: L im it ON OFF 10 5 BTS 4140 E0150 220 O hm O N / O FF VBB O ut CW P fw d 0 1 10 100 1000 f / MHz Typ. Vbb -Pin Susceptibility at PWM-Mode 40 35 30 dBm 25 20 15 D e v ic e : D a te C o d e : Load: O -M o d e : C o u p lin g P o in t : M o n it o r in g : M o d u la t io n : M e a s u re m e n t: L im it PW M 10 5 BTS 4140 E0150 220 O hm PW M 100 H z 50% VBB O ut CW P fw d 0 1 10 100 1000 f / MHz Test circuit: HF 5µH Vbb 150Ω PROFET IN 6,8nF OUT 5µH RL BSS100 150Ω 6,8nF For defined decoupling and high reproducibility the same choke and the same 150Ω -matching network as for the emission measurement is used. Page 9 2004-01-27 BTS 4140 N Terms Inductive and overvoltage output clamp + Vbb Ibb V Vbb V IL PROFET bb Z VON V ON OUT OUT IN IN V OUT I IN VON clamped to 60 V min. Input circuit (ESD protection) Overvoltage protection of logic part + Vbb V + Vbb ESD Control. Circuit R V Z2 Logic I IN R IN IN Reverse battery protection Signal GND - Vbb Vbb,AZ = V Z2 + Ibb * RIN = 62V min. OUT Logic RIN Power Inverse Diode IN RL Signal GND Power GND R I=1kΩ typ., Temperature protection is not active during inverse current. Page 10 2004-01-27 BTS 4140 N Vbb disconnect with charged inductive load Inductive Load switch-off energy dissipation E bb E AS ELoad Vbb Vb b PROFET PR O FET OUT OUT L = IN V ZL IN I IN bb { EL ER R L Energy stored in load inductance: EL = ½ * L * IL2 While demagnetizing load inductance, the enérgy dissipated in PROFET is E AS = E bb + EL - ER = VON(CL) * iL(t) dt, with an approximate solution for RL > 0Ω: E AS = Page 11 IL * R L IL * L ) * ( V b b + | V O U T ( C L )| ) * ln (1 + | V O U T ( C L )| 2 * RL 2004-01-27 BTS 4140 N Typ. transient thermal impedance Typ. transient thermal impedance ZthJA=f(tp) @ 6cm 2 heatsink area Z thJA=f(tp) @ min. footprint Parameter: D=tp/T Parameter: D=tp/T 10 2 10 2 K/W 10 1 Z thJA ZthJA K/W D=0.5 D=0.2 D=0.1 D=0.05 D=0.02 D=0.01 D=0 10 0 10 -1 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10 10 1 D=0.5 D=0.2 D=0.1 D=0.05 D=0.02 D=0.01 D=0 10 0 s 10 10 -1 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10 4 tp s 10 tp Typ. on-state resistance Typ. on-state resistance RON = f(Tj) ; Vbb = 9V ; Pin1 grounded; RON = f(V bb); IL = 150mA ; Pin1 grounded IL=150mA 1.6 3 Ω Ω RON RON 1.2 1 2 150°C 0.8 1.5 0.6 1 25°C 0.4 -40°C 0.5 0.2 0 -40 -20 0 20 40 60 80 100 120 °C Tj 0 0 160 Page 12 5 10 15 20 25 30 35 40 V Vbb 50 2004-01-27 4 BTS 4140 N Typ. turn on time Typ. turn off time ton = f(Tj ); R L = 270Ω toff = f(Tj); RL = 270Ω 80 80 µs µs 9V 60 60 9...42V toff ton 13.5V 50 42V 50 40 40 30 30 20 20 10 10 0 -40 -20 0 20 40 60 80 100 120 °C Tj 0 -40 -20 160 0 20 40 60 80 100 120 Typ. slew rate on Typ. slew rate off dV/dton = f(Tj ) ; RL = 270 Ω dV/dtoff = f(Tj); RL = 270 Ω 3 °C Tj 160 6 V/µs 5 -dV dtoff dV dton V/µs 2 4.5 4 3.5 42V 1.5 3 2.5 42V 1 2 13.5V 13,5V 9V 0.5 1.5 1 0.5 0 -40 -20 0 20 40 60 80 100 120 °C Tj 0 -40 -20 160 Page 13 9V 0 20 40 60 80 100 120 °C Tj 160 2004-01-27 BTS 4140 N Typ. initial peak short circuit current limit Typ. initial short circuit shutdown time IL(SCp) = f(Tj) ; Vbb = 13,5 V; tm = 100 µs toff(SC) = f(Tj,start) 10 3 1 ms A t off(SC) I L(SCp) 10 2 0.6 10 1 0.4 10 0 13,5V 0.2 24V 42V 0 -40 -20 0 20 40 60 80 100 120 °C Tj 10 -1 -40 -20 160 0 20 40 60 80 100 120 °C Tj Typ. initial peak short circuit current limit Typ. current limitation characteristic: IL(SCp) = f(Vbb); tm = 100 µs IL(SC) = f(VON ), Vbb = 13,5V 1 1.2 A -40°C A 25°C I L(SC) I L(SCp) 160 0.8 150°C 0.6 0.6 0.4 0.4 0.2 0.2 0 0 5 10 15 20 25 30 35 40 V Vbb 0 0 50 4 8 12 16 24 V VON Page 14 2004-01-27 BTS 4140 N Typ. standby current Maximum allowable inductive switch-off Ibb(off) = f(Tj ) ; Pin1 open energy, single pulse EAS = f(I L); T jstart = 150°C 6 2.2 J 60V µA 1.6 4 EAS Ibb(off) 1.8 1.4 1.2 3 1 0.8 2 42V 13.5V 1 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 100 120 °C Tj 0 50 160 Page 15 75 100 125 150 175 mA IL 225 2004-01-27 BTS 4140 N Timing diagrams Figure 1a: Vbb turn on: Figure 2b: Switching a lamp I IN I IN Vbb VOUT I IL L t t Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition Figure 2c: Switching an inductive load I IN I IN V OUT VOUT 90% t on d V /d to n 10% d V / d to ff t o ff IL IL t t Page 16 2004-01-27 BTS 4140 N Figure 3a: Turn on into short circuit, shut down by overtemperature, restart by cooling Figure 3b: Short circuit in on-state shut down by overtemperature, restart by cooling I IN I IN V OUT V OUT O utput short to G N D I L I L(S C p) I normal operation I L(S C r) tm L Output short to GND I L(SCr) t t t off(S C ) Heating up of the chip may require several milliseconds, depending on external conditions. Figure 4: Overtemperature: Reset if Tj < Tjt I IN VOUT TJ t Page 17 2004-01-27 BTS 4140 N Package and ordering code all dimensions in mm Sales code BTS 4140 N Ordering code, Q67060-S6084-A101 1.6 ±0.1 6.5 ±0.2 +0.2 acc. to DIN 6784 1 2 3 3.5±0.2 4 7 ±0.3 B 15˚ max 0.1 max 3 ±0.1 0.5 min A 0.28 ±0.04 2.3 0.7 ±0.1 4.6 0.25 M A 0.25 M B GPS05560 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 München © Infineon Technologies AG 2001 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 18 2004-01-27