VISHAY SI1013X-T1-GE3

Si1013R/X
Vishay Siliconix
P-Channel 1.8-V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 20
RDS(on) (Ω)
ID (mA)
1.2 at VGS = - 4.5 V
- 350
1.6 at VGS = - 2.5 V
- 300
2.7 at VGS = - 1.8 V
- 150
• Halogen-free Option Available
• High-Side Switching
•
•
•
•
•
RoHS
Low On-Resistance: 1.2 Ω
Low Threshold: 0.8 V (Typ.)
Fast Switching Speed: 14 ns
1.8 V Operation
TrenchFET® Power MOSFETs
COMPLIANT
• 2000 V ESD Protection
APPLICATIONS
SC-75A or SC-89
G
1
3
S
D
SC-75A (SOT-416):
Si1013R - Marking Code D
SC-89 (SOT-490):
Si1013X - Marking Code B
2
Top View
Ordering Information:
Si1013R-T1-E3 (SC-75A, Lead (Pb)-free)
Si1013R-T1-GE3 (SC-75A, Lead (Pb)-free and Halogen-free)
Si1013X-T1-E3 (SC-89, Lead (Pb)-free)
Si1013X-T1-GE3 (SC-89, Lead (Pb)-free and Halogen-free)
• Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories
• Battery Operated Systems
• Power Supply Converter Circuits
• Load/Power Switching Cell Phones, Pagers
BENEFITS
•
•
•
•
•
Ease in Driving Switches
Low Offset (Error) Voltage
Low-Voltage Operation
High-Speed Circuits
Low Battery Voltage Operation
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
5s
Steady State
Drain-Source Voltage
VDS
- 20
Gate-Source Voltage
VGS
±6
Continuous Drain Current (TJ = 150 °C)b
TA = 25 °C
TA = 85 °C
Pulsed Drain Currenta
ID
- 400
Continuous Source Current (diode conduction)b
Maximum Power Dissipationb for SC-75
b
Maximum Power Dissipation for SC-89
Operating Junction and Storage Temperature Range
Gate-Source ESD Rating (HBM, Method 3015)
IS
V
- 350
- 300
IDM
- 275
- 1000
- 275
- 250
TA = 25 °C
175
150
TA = 85 °C
90
80
275
250
TA = 25 °C
PD
TA = 85 °C
Unit
160
mA
mW
140
TJ, Tstg
- 55 to 150
°C
ESD
2000
V
Notes:
a. Pulse width limited by maximum junction temperature.
b. Surface Mounted on FR4 board.
Document Number: 71167
S-81444-Rev. C, 23-Jun-08
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Si1013R/X
Vishay Siliconix
SPECIFICATIONS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
- 0.45
Typ.
Max.
Unit
µA
Static
VGS(th)
VDS = VGS, ID = - 250 µA
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 4.5 V
±1
±2
Zero Gate Voltage Drain Current
IDSS
VDS = - 16 V, VGS = 0 V
- 0.3
- 100
nA
-5
µA
On-State Drain Currenta
ID(on)
Gate Threshold Voltage
Drain-Source On-State
VDS = - 16 V, VGS = 0 V, TJ = 85 °C
VDS = - 5 V, VGS = - 4.5 V
Forward Transconductancea
Diode Forward Voltagea
- 700
mA
VGS = - 4.5 V, ID = - 350 mA
0.8
1.2
VGS = - 2.5 V, ID = - 300 mA
1.2
1.6
VGS = - 1.8 V, ID = - 150 mA
1.8
2.7
gfs
VDS= - 10 V, ID = - 250 mA
0.4
VSD
IS = - 150 mA, VGS = 0 V
- 0.8
RDS(on)
Resistancea
V
Ω
S
- 1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
1500
VDS = - 10 V, VGS = - 4.5 V, ID = - 250 mA
450
5
VDD = - 10 V, RL = 47 Ω
ID ≅ - 200 mA, VGEN = - 4.5 V, RG = 10 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
pC
150
9
ns
35
tf
Fall Time
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
11
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
For the following graphs, P-Channel negative polarities for all voltage and current values are represented as positive values.
1.0
1000
VGS = 5 thru 3 V
TJ = - 55 °C
2.5 V
0.6
2V
0.4
1.8 V
0.2
0.0
0.0
600
125 °C
400
200
0.5
1.0
1.5
2.0
VDS - Drain-to-Source Voltage (V)
Output Characteristics
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2
25 °C
800
I D - Drain Current (mA)
I D - Drain Current (A)
0.8
2.5
3.0
0
0.0
0.5
1.0
1.5
2.0
2.5
VGS - Gate-to-Source Voltage (V)
3.0
Transfer Characteristics
Document Number: 71167
S-81444-Rev. C, 23-Jun-08
Si1013R/X
Vishay Siliconix
TYPICAL CHARACTERISTICS
TA = 25 °C, unless otherwise noted
120
100
3.2
VGS = 1.8 V
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
4.0
2.4
VGS = 2.5 V
1.6
VGS = 4.5 V
Ciss
80
60
40
Coss
0.8
20
Crss
0
0.0
0
200
400
600
800
1000
0
4
8
On-Resistance vs. Drain Current
16
20
Capacitance
1.6
5
VDS = 10 V
ID = 250 mA
1.4
4
R DS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
12
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (mA)
3
2
1.2
VGS = 1.8 V
ID = 150 mA
1.0
0.8
1
0
0.0
VGS = 4.5 V
ID = 350 mA
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.6
- 50
1.6
- 25
0
25
50
75
100
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
125
5
1000
RDS(on) - On-Resistance (Ω)
I S - Source Current (mA)
TJ = 125 °C
100
TJ = 25 °C
TJ = - 55 °C
10
1
0.0
4
3
ID = 350 mA
2
ID = 200 mA
1
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD - Source-to-Drain Voltage (V)
Surge-Drain Diode Forward Voltage
Document Number: 71167
S-81444-Rev. C, 23-Jun-08
1.4
0
1
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
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Si1013R/X
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
3.0
0.3
2.5
ID = 0.25 mA
2.0
0.1
IGSS - (µA)
V GS(th) Variance (V)
0.2
0.0
1.5
VGS = 4.5 V
- 0.1
1.0
- 0.2
0.5
- 0.3
- 50
- 25
0
25
50
75
100
0.0
- 50
125
- 25
TJ - Temperature (°C)
0
25
50
75
100
125
TJ - Temperature (°C)
Threshold Voltage Variance vs. Temperature
IGSS vs. Temperature
BVGSS - Gate-to-Source Breakdown Voltage (V)
7
6
5
4
3
2
1
0
- 50
- 25
0
25
50
75
100
125
TJ - Temperature (°C)
BVGSS vs. Temperature
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 833 °C/W
0.02
3. T JM - T A = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient (SC-75A)
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Document Number: 71167
S-81444-Rev. C, 23-Jun-08
Si1013R/X
Vishay Siliconix
TYPICAL CHARACTERISTICS
TA = 25 °C, unless otherwise noted
2
1
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?71167.
Document Number: 71167
S-81444-Rev. C, 23-Jun-08
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
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or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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document or by any conduct of Vishay.
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Document Number: 91000
Revision: 18-Jul-08
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