VISHAY SI1902DL-T1

Si1902DL
Vishay Siliconix
Dual N-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
20
rDS(on) (Ω)
ID (A)
0.385 at VGS = 4.5 V
0.70
0.630 at VGS = 2.5 V
0.54
• TrenchFET® Power MOSFETS: 2.5 V Rated
Pb-free
Available
RoHS*
COMPLIANT
SOT-363
SC-70 (6-LEADS)
1
6
D1
G1
2
5
G2
D2
3
4
S2
M a r k inCode
g C ode
Marking
P
PAA XX
Y
YYY
S1
Lot
L o Traceability
tT
and Date Code
Part # Code
Top View
Ordering Information: Si1902DL-T1 (with Tape and Reel)
Si1902DL-T1-E3 (Lead (Pb)-free with Tape and Reel)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
±12
TA = 25 °C
Continuous Drain Current (TJ = 150 °C)a
TA = 85 °C
ID
IS
Continuous Source Current (Diode Conduction)a
TA = 25 °C
Maximum Power Dissipationa
TA = 85 °C
Operating Junction and Storage Temperature Range
PD
V
0.70
0.66
0.50
IDM
Pulsed Drain Current
0.48
A
1.0
0.25
0.23
0.30
0.27
0.16
0.14
TJ, Tstg
Unit
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t ≤ 5 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
360
415
400
460
300
350
Unit
°C/W
Notes
a. Surface Mounted on 1" x 1" FR4 Board.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 71080
S-51415–Rev. H, 03-Apr-06
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Si1902DL
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
0.6
Typ
Max
Unit
Static
VGS(th)
VDS = VGS, ID = 250 µA
1.5
V
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 12 V
± 100
nA
IDSS
VDS = 16 V, VGS = 0 V
1
Zero Gate Voltage Drain Current
VDS = 16 VGS = 0 V, TJ = 85°C
5
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
Gate Threshold Voltage
Forward Transconductancea
Diode Forward Voltagea
VDS ≥ 5 V, VGS = 4.5 V
µA
1.0
A
VGS = 4.5 V, ID = 0.66 A
0.320
0.385
VGS = 2.5 V, ID = 0.40 A
0.560
0.630
gfs
VDS = 10 V, ID = 0.66 A
1.5
VSD
IS = 0.23 A, VGS = 0 V
0.8
1.2
0.8
1.2
VDS = 10 V, VGS = 4.5 V, ID = 0.66 A
0.06
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
0.30
Turn-On Delay Time
td(on)
10
Rise Time
VDD = 10 V, RL = 20 Ω
ID ≅ 0.5 A, VGEN = 4.5 V, RG = 6 Ω
tr
Turn-Off DelayTime
td(off)
Fall Time
tf
Source-Drain Reverse Recovery
Time
trr
IF = 0.23 A, di/dt = 100 A/µs
nC
20
16
30
10
20
10
20
20
40
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
1.0
1.0
VGS = 5 thru 2.5 V
0.8
I D – Drain Current (A)
I D – Drain Current (A)
0.8
2V
0.6
0.4
0.6
0.4
TC = 125 °C
0.2
0.2
25 °C
1.5 V
- 55 °C
1V
0.0
0.0
0.5
1.0
1.5
2.0
2.5
VDS – Drain-to-Source Voltage (V)
Output Characteristics
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2
3.0
0 .0
0.0
0 .5
1.0
1.5
2.0
2.5
VGS – Gate-to-Source Voltage (V)
Transfer Characteristics
Document Number: 71080
S-51415–Rev. H, 03-Apr-06
Si1902DL
Vishay Siliconix
1.0
100
0.8
80
C – Capacitance (pF)
r DS(on) – On-Resistance (Ω)
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
VGS = 2.5 V
0.6
0.4
VGS = 4.5 V
Ciss
60
40
Coss
20
0.2
Crss
0.0
0.0
0
0.2
0.4
0.6
0.8
0
1.0
4
8
On-Resistance vs. Drain Current
20
Capacitance
VGS = 4.5 V
ID = 0.66 A
VDS = 10 V
ID = 0.66 A
1.4
4
r DS(on) – On-Resistance
(Normalized)
VGS – Gate-to-Source Voltage (V)
16
1.6
5
3
2
1.2
1.0
0.8
1
0
0.0
0.2
0.4
0.6
0.6
- 50
0.8
- 25
0
25
50
75
100
125
Qg – Total Gate Charge (nC)
TJ – Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
1.0
r DS(on) – On-Resistance (Ω)
I S – Source Current (A)
1
TJ = 150 °C
TJ = 25 °C
0.1
0.0
12
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
0.8
ID = 0.66 A
0.6
0.4
0.2
0.0
0.2
0.4
0.6
0.8
1.0
VSD – Source-to-Drain Voltage (V)
Surge-Drain Diode Forward Voltage
Document Number: 71080
S-51415–Rev. H, 03-Apr-06
1.2
0
1
2
3
4
5
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
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Si1902DL
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
0.2
5
4
ID = 250 μA
- 0.0
Power (W)
V GS(th) Variance (V)
0.1
- 0.1
- 0.2
3
2
1
- 0.3
- 0.4
- 50
- 25
0
25
50
75
100
TJ – Temperature (°C)
125
150
0
10-3
Threshold Voltage
10-2
10-1
1
Time (sec)
10
100
600
Single Pulse Power, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 400 °C/W
3 . TJ M – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
1 0 -2
10-1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 71080
S-51415–Rev. H, 03-Apr-06
Si1902DL
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?71080.
Document Number: 71080
S-51415–Rev. H, 03-Apr-06
www.vishay.com
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Disclaimer
All product specifications and data are subject to change without notice.
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therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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