DISCRETE SEMICONDUCTORS DATA SHEET BFM505 Dual NPN wideband transistor Product specification Supersedes data of 1995 Sep 04 File under Discrete Semiconductors, SC14 1996 Oct 08 Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 FEATURES PINNING - SOT363A • Small size PIN SYMBOL DESCRIPTION • Temperature and hFE matched 1 b1 base 1 • Low noise and high gain 2 e1 emitter 1 • High gain at low current and low capacitance at low voltage 3 c2 collector 2 4 b2 base 2 5 e2 emitter 2 6 c1 collector 1 • Gold metallization ensures excellent reliability. APPLICATIONS • Oscillator and buffer amplifiers 6 • Balanced amplifiers 5 4 c1 handbook, halfpage • LNA/mixer. b1 c2 b2 DESCRIPTION e1 Dual transistor with two silicon NPN RF dies in a surface mount, 6-pin SOT363 (S-mini) package. The transistors are primarily intended for wideband applications in the GHz-range in the RF front end of analog and digital cellular phones, cordless phones, radar detectors, pagers and satellite TV-tuners. 1 2 e2 3 Top view MAM210 Marking code: N0. Fig.1 Simplified outline and symbol. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Any single transistor Cre feedback capacitance Ie = 0; VCB = 3 V; f = 1 MHz − 0.22 − pF fT transition frequency IC = 5 mA; VCE = 3V; f = 1 GHz − 9 − GHz insertion power gain IC = 5 mA; VCE = 3 V; f = 900 MHz; Tamb = 25 °C 14 15 − dB GUM maximum unilateral power gain IC = 5 mA; VCE = 3 V; f = 900 MHz; Tamb = 25 °C − 17 − dB F noise figure IC = 1 mA; VCE = 3 V; f = 900 MHz; ΓS = Γopt − 1.1 1.6 dB Rth j-s thermal resistance from junction to soldering point single loaded − − 230 K/W double loaded − − 115 K/W s 21 2 1996 Oct 08 2 Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 LIMITING VALUES In accordance with the Absolute Maximum System IEC 134. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Any single transistor VCBO collector-base voltage open emitter − 20 V VCEO collector-emitter voltage open base − 8 V VEBO emitter-base voltage open collector − 2.5 V IC DC collector current − 18 mA Ptot total power dissipation − 500 mW Tstg storage temperature −65 +175 °C Tj junction temperature − 175 °C up to Ts = 118 °C; note 1 THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering point; note 1 CONDITIONS VALUE UNIT single loaded 230 K/W double loaded 115 K/W Note to the Limiting values and Thermal characteristics 1. Ts is the temperature at the soldering point of the collector pin. 1996 Oct 08 3 Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT DC characteristics of any single transistor IC = 2.5 µA; IE = 0 20 − − V 8 − − V IE = 2.5 µA; IC = 0 2.5 − − V collector-base leakage current VCB = 6 V; IE = 0 − − 50 nA DC current gain IC = 5 mA; VCE = 6 V 60 120 250 V(BR)CBO collector-base breakdown voltage V(BR)CEO collector-emitter breakdown voltage IC = 10 µA; IB = 0 V(BR)EBO emitter-base breakdown voltage ICBO hFE DC characteristics of the dual transistor ∆hFE ratio of highest and lowest DC current gain IC1 = IC2 = 5 mA; VCE1 = VCE2 = 6 V 1 1.2 − ∆VBEO difference between highest and lowest base-emitter voltage (offset voltage) IE1 = IE2 = 10 mA; Tamb = 25 °C 0 1 − mV AC characteristics of any single transistor fT transition frequency IC = 5 mA; VCE = 3 V; f = 1 GHz − 9 − GHz Cc collector capacitance IE = ie = 0; VCB = 3 V; f = 1 MHz − 0.31 − pF Cre feedback capacitance IC = 0; VCB = 3 V; f = 1 MHz − 0.22 − pF GUM maximum unilateral power gain; note 1 IC = 5 mA; VCE = 3 V; Tamb = 25 °C; f = 900 MHz − 17 − dB IC = 5 mA; VCE = 3 V; Tamb = 25 °C; f = 2 GHz − 10 − dB insertion power gain IC = 5 mA; VCE = 3 V; f = 900 MHz; Tamb = 25 °C 14 15 − dB noise figure IC = 5 mA; VCE = 3 V; f = 900 MHz; ΓS = Γopt − 1.4 1.8 dB IC = 5 mA; VCE = 3 V; f = 2 GHz; ΓS = Γopt − 1.9 − dB IC = 1 mA; VCE = 3 V; f = 900 MHz; ΓS = Γopt − 1.1 1.6 dB s 21 2 F Note s 21 2 dB 1. GUM is the maximum unilateral power gain, assuming s12 is zero. G UM = 10 log -----------------------------------------------------------( 1 – s 11 2 ) ( 1 – s 22 2 ) 1996 Oct 08 4 Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 MBG208 600 handbook, halfpage fT (GHz) double loaded Ptot (mW) MGD687 12 handbook, halfpage 400 VCE = 6V 8 3V single loaded 200 4 0 0 50 100 150 Ts (oC) 0 10−1 200 1 10 IC (mA) f = 1 GHz; Tamb = 25 °C. Fig.2 Power derating as a function of soldering point temperature; typical values. Fig.3 Transition frequency as a function of collector current; typical values. MRA719 250 MRA720 0.4 handbook, halfpage handbook, halfpage hFE Cre (pF) 200 0.3 150 0.2 100 0.1 50 0 10−3 0 10−2 10−1 1 10 0 102 IC (mA) 2 VCE = 6 V. IC = 0; f = 1 MHz. Fig.4 Fig.5 DC current gain as a function of collector current; typical values. 1996 Oct 08 5 4 6 8 10 VCB (V) Feedback capacitance as a function of collector-base voltage; typical values. Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 MGG199 20 MGG200 20 handbook, halfpage handbook, halfpage gain (dB) gain (dB) GUM 16 16 12 MSG/Gmax 12 MSG GUM 8 8 4 4 0 0 0 4 8 IC (mA) 12 0 4 f = 900 MHz; VCE = 3 V. f = 2 GHz; VCE = 3 V. Fig.6 Fig.7 Gain as a function of collector current; typical values. MGG201 IC (mA) 12 Gain as a function of collector current; typical values. MGG202 50 50 handbook, halfpage handbook, halfpage gain (dB) gain (dB) 40 40 GUM GUM MSG/Gmax 30 8 30 MSG/Gmax 20 20 10 10 0 10 102 103 f (MHz) 0 10 104 IC = 1 mA; VCE = 3 V. IC = 5 mA; VCE = 3 V. Fig.8 Fig.9 Gain as a function of frequency; typical values. 1996 Oct 08 6 102 103 f (MHz) Gain as a function of frequency; typical values. 104 Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 MGC766 5 MGD686 20 handbook, halfpage handbook, halfpage F (dB) Gass (dB) f = 900 MHz 4 15 3 10 1GHz 2 GHz 5 2 2000 MHz 1000 MHz 900 MHz 500 MHz 1 0 −5 0 10−1 1 10−1 10 IC (mA) VCE = 3 V. 1 IC (mA) 10 VCE = 3 V. Fig.10 Minimum noise figure as a function of collector current; typical values. Fig.11 Associated available gain as a function of collector current; typical values. MGC768 5 MGC769 20 handbook, halfpage handbook, halfpage 4 15 3 10 F (dB) Gass (dB) IC = 1.25 mA 5 mA 5 2 5 mA 0 1 1.25 mA −5 0 102 103 f (MHz) 104 102 103 f (MHz) 104 VCE = 3 V. VCE = 3 V. Fig.12 Minimum noise figure as a function of frequency; typical values. Fig.13 Associated available gain as a function of frequency; typical values. 1996 Oct 08 7 Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 APPLICATION INFORMATION SPICE parameters for any single BFM505 die SEQUENCE No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19(1) 20(1) 21(1) 22 23 24 25 26 27 28 29 30 31 32 33 34 35(1) 36(1) 37(1) 38 PARAMETER VALUE IS BF NF VAF IKF ISE NE BR NR VAR IKR ISC NC RB IRB RBM RE RC XTB EG XTI CJE VJE MJE TF XTF VTF ITF PTF CJC VJC MJC XCJC TR CJS VJS MJS FC 134.1 180.0 0.988 38.34 150.0 27.81 2.051 55.19 0.982 2.459 2.920 17.45 1.062 20.00 1.000 20.00 1.171 4.350 0.000 1.110 3.000 284.7 600.0 0.303 7.037 12.34 1.701 30.64 0.000 242.4 188.6 0.041 0.130 1.332 0.000 750.0 0.000 0.897 aA − − V mA fA − − − V mA aA − Ω µA Ω Ω Ω − eV − fF mV − ps − V mA deg fF mV − − ns F mV − − C2 LP B1 LP T1 LB T2 LE B2 LB LE E1 MBG188 E2 Fig.14 Package equivalent circuit SOT363A (inductance only). Lead inductances (nH) LP 0.4 LB 0.6 LE 1.0 E2 3 E1 27 6 B2 1 27 3 C2 3 17 36 48 C1 48 36 17 3 6 B1 E2 E1 B2 C2 MBG189 Fig.15 Package capacitance (fF) between indicated nodes. Note 1. These parameters have not been extracted, the default values are shown. 1996 Oct 08 C1 handbook, halfpage UNIT 8 Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 PACKAGE OUTLINE 0.2 handbook, full pagewidth 1.1 0.8 0.9 0.6 0.25 0.10 0.1 0.0 0.3 0.1 0.65 0.65 MSA368 0.2 M B 1.35 1.15 A 1 B 6 2 5 3 4 2.2 2.0 Dimensions in mm. Fig.16 SOT363. 1996 Oct 08 9 0.3 0.2 (6x) 2.2 1.8 0.2 M A Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Short-form specification The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Oct 08 10